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    • 45. 发明公开
    • Ozone storing method and ozone extracting method
    • Verfahren zur Speicherung und zur Extraktion von Ozon
    • EP1176118A1
    • 2002-01-30
    • EP01118366.2
    • 2001-07-27
    • THE KANSAI ELECTRIC POWER CO., INC.
    • Murai, Akira
    • C01B13/10
    • C01B13/10
    • An ozone storage apparatus for storing ozone efficiently and extracting ozone effectively is disclosed. Also ozone storage methods comprising the steps of supplying ozone either to a dried silica gel which is produced by neutralizing sodium silicate and sulfuric acid and that is then washed with water to a pH level between 6 and 7 or further processing the dried silica gel by crushing it and washing with at least one of a sulfuric acid or water. The methods also include a process where if oxygen has been adsorbed in the silica gel, a vacuum is created inside the storage container holding the silica gel, and then ozone can be supplied to the silica gel. Silica gel containing aluminum between 0.002 - 0.1 percent by weight is used for the storage medium. Also, the ozone is extracted from a tube-valve associated with the storage container by a natural downward flow.
    • 公开了一种有效地储存臭氧并有效提取臭氧的臭氧储存装置。 臭氧储存方法还包括将臭氧供给到通过中和硅酸钠和硫酸产生的干燥硅胶,然后用水洗涤至pH6-6之间的pH值,或进一步通过粉碎处理干燥的硅胶 并用至少一种硫酸或水洗涤。 该方法还包括如果氧气已经吸附在硅胶中,则在保持硅胶的储存容器内产生真空,然后将臭氧供给至硅胶。 存储介质使用含有0.002-0.1重量%的铝的硅胶。 此外,通过自然向下的流动,从与储存容器相关联的管阀中提取臭氧。
    • 50. 发明公开
    • INSULATED GATE SEMICONDUCTOR DEVICE
    • HALBLEITERANORDNUNG麻醉剂异构体门
    • EP0893830A1
    • 1999-01-27
    • EP97947874.0
    • 1997-12-10
    • THE KANSAI ELECTRIC POWER CO., INC.Hitachi, Ltd.
    • SUGAWARA, YoshitakaASANO, Katsunori
    • H01L29/78
    • H01L29/1095H01L29/0623H01L29/1608H01L29/42368H01L29/66068H01L29/7397H01L29/7398H01L29/7809H01L29/7811H01L29/7813
    • In a semiconductor device having a trench type insulated gate structure, in the case where a drift layer 2 of an n-conduction type has a high carrier density, when a high voltage is applied between a drain and a source in such a manner that a channel is not formed, the electric field strength of an insulator layer 9 below the trench type insulated gate is increased, thus causing breakdown. The withstand voltage of the semiconductor device is limited by the breakdown of the insulator layer 9, and it is difficult to realize high withstand voltage.
      In the characteristic of the present invention, a field relaxation semiconductor region 1 of a conduction type opposite to the conduction type of the drift layer 2 is formed within the drift layer 2 below the insulator layer 9 in the trench of the trench type insulated gate semiconductor device. Also, the thickness of a bottom portion of the insulator layer 9 provided in the trench of the trench type insulated gate semiconductor device is made significantly greater than the thickness of a lateral portion thereof.
    • 在具有沟槽型绝缘栅极结构的半导体器件中,在n-导体类型的漂移层2具有高载流子密度的情况下,当在漏极和源极之间施加高电压时, 通道不形成,沟槽型绝缘栅下方的绝缘体层9的电场强度增加,从而导致击穿。 半导体器件的耐压受到绝缘体层9的击穿的限制,难以实现高耐压。 在本发明的特征中,在沟槽型绝缘栅极半导体的沟槽中的绝缘体层9的下方的漂移层2内形成有与漂移层2的导电型相反的导电类型的场弛豫半导体区域1 设备。 此外,设置在沟槽型绝缘栅极半导体器件的沟槽中的绝缘体层9的底部的厚度明显大于其侧面部分的厚度。