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41. 发明授权

EP3091571B1 FAN-OUT PACKAGE STRUCTURE INCLUDING A CONDUCTIVE SHIELDING LAYER 有权
公开(公告)号：EP3091571B1
公开(公告)日：2019-06-12
申请号：EP16166793.6
申请日：2016-04-25
申请人： MediaTek Inc.
发明人： LIN, Tzu-Hung , PENG, I-Hsuan , LIU, Nai-Wei , HSIAO, Ching-Wen , HUANG, Wei-Che
IPC分类号： H01L23/538 , H01L23/552 , H01L25/10 , H01L23/66 , H01L25/16

42. 发明公开

EP3439029A1 SEMICONDUCTOR PACKAGE INCLUDING LID STRUCTURE WITH OPENING AND RECESS 有权转让
公开(公告)号：EP3439029A1
公开(公告)日：2019-02-06
申请号：EP18181976.4
申请日：2018-07-05
申请人： MediaTek Inc.
发明人： CHANG, Chia-Cheng , LIN, Tzu-Hung , PENG, I-Hsuan , LIU, Nai-Wei
IPC分类号： H01L23/16 , H01L23/04 , H01L23/367
摘要： A semiconductor package structure including a package substrate, at least one semiconductor die, a lid structure, a first electronic component and a heat sink is provided. The package substrate has a first surface and a second surface opposite to the first surface. The semiconductor die is on the first surface of the package substrate and is surrounded by an encapsulating layer. The lid structure surrounds and is spaced apart from the encapsulating layer. The lid structure includes a first opening that is covered by the first surface of the package substrate. The first electronic component is over the first surface of the package substrate and arranged within the first opening of the lid structure. The heat sink covers the lid structure and the semiconductor die.

43. 发明公开

EP3364451A1 SEMICONDUCTOR PACKAGE ASSEMBLY 有权转让
公开(公告)号：EP3364451A1
公开(公告)日：2018-08-22
申请号：EP18156200.0
申请日：2018-02-11
申请人： MediaTek Inc.
发明人： LIN, Tzu-Hung , CHANG, Chia-Cheng , PENG, I-Hsuan
IPC分类号： H01L23/367 , H01L23/538 , H01L25/10 , H01L25/18
CPC分类号： H01L23/5389 , H01L21/486 , H01L21/563 , H01L23/3128 , H01L23/3675 , H01L23/481 , H01L23/49816 , H01L23/5283 , H01L23/5386 , H01L24/05 , H01L24/13 , H01L24/81 , H01L25/105 , H01L25/18 , H01L2224/16225 , H01L2924/15311
摘要： The invention provides a semiconductor package assembly. The semiconductor package assembly includes a first semiconductor package and a second semiconductor package overlying a portion of the first semiconductor package. The first semiconductor package includes a first redistribution layer (RDL) structure, a first semiconductor die and a molding compound. The first semiconductor die is disposed on a first surface of the first RDL structure and electrically coupled to the first RDL structure. The molding compound is positioned overlying the first semiconductor die and the first surface of the first RDL structure. The second semiconductor package includes a first memory die and a second memory die vertically stacked on the first memory die. The second memory die is electrically coupled to first memory die by through silicon via (TSV) interconnects formed passing through the second memory die.

44. 发明公开

EP3163614A3 STACKED FAN-OUT PACKAGE STRUCTURE 有权
标题翻译：堆叠扇出包装结构
公开(公告)号：EP3163614A3
公开(公告)日：2017-07-12
申请号：EP16186728.8
申请日：2016-09-01
申请人： MediaTek Inc.
发明人： LIU, Nai-Wei , LIN, Tzu-Hung , PENG, I-Hsuan , HSIAO, Ching-Wen , HUANG, Wei-Che
IPC分类号： H01L23/538 , H01L23/31 , H01L21/56
CPC分类号： H01L23/3114 , H01L21/568 , H01L23/3135 , H01L23/49811 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/94 , H01L2224/02379 , H01L2224/04105 , H01L2224/12105 , H01L2224/19 , H01L2224/32145 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/94 , H01L2924/1431 , H01L2924/1432 , H01L2924/1436 , H01L2924/19011 , H01L2924/35121 , H01L2924/37001 , H01L2224/83 , H01L2224/83005
摘要： A semiconductor package structure is provided. The structure includes a first semiconductor die (100) having a first surface (100a) and a second surface (100b) opposite thereto. A first molding compound (102) surrounds the first semiconductor die. A first redistribution layer (RDL) structure (104) is disposed on the second surface of the first semiconductor die and laterally extends on the first molding compound. A second semiconductor die (200) is disposed on the first RDL structure and has a first surface (200a) and a second surface (200b) opposite thereto. A second molding compound (202) surrounds the second semiconductor die. A first protective layer (202a) covers a sidewall of the first RDL structure (104a) and a sidewall of the first molding compound (102a).
摘要翻译：提供了一种半导体封装结构。该结构包括具有第一表面（100a）和与其相对的第二表面（100b）的第一半导体管芯（100）。第一模塑料（102）围绕第一半导体管芯。第一再分布层（RDL）结构（104）设置在第一半导体管芯的第二表面上并且在第一模塑化合物上横向延伸。第二半导体管芯（200）设置在第一RDL结构上并且具有第一表面（200a）和与其相对的第二表面（200b）。第二模塑料（202）围绕第二半导体管芯。第一保护层（202a）覆盖第一RDL结构（104a）的侧壁和第一模塑料（102a）的侧壁。

45. 发明公开

EP3168872A2 SEMICONDUCTOR PACKAGE ASSEMBLEY 无效
标题翻译：半导体封装ASSEMBLEY
公开(公告)号：EP3168872A2
公开(公告)日：2017-05-17
申请号：EP16198064.4
申请日：2016-11-10
申请人： MediaTek Inc.
发明人： Lin, Tzu-Hung , LIU, Nai-Wei , PENG, I-Hsuan , HUANG, Wei-Che
IPC分类号： H01L25/065
CPC分类号： H01L23/5389 , H01L23/3114 , H01L23/5383 , H01L23/5384 , H01L23/5386 , H01L24/19 , H01L24/20 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/05555 , H01L2224/05567 , H01L2224/12105 , H01L2224/32145 , H01L2224/32225 , H01L2224/48229 , H01L2224/73265 , H01L2225/0651 , H01L2225/06555 , H01L2225/06568 , H01L2225/06582 , H01L2225/1035 , H01L2225/1058 , H01L2924/15311 , H01L2924/3512 , H01L2224/48227 , H01L2924/00012
摘要： The invention provides a semiconductor package assembly. The semiconductor package assembly includes a redistribution layer (RDL) structure having a first surface and a second surface opposite to the first substrate. The RDL structure includes a redistribution layer (RDL) contact pad arranged close to the second surface. A passivation layer is disposed on the RDL contact pad. The passivation layer has an opening corresponding to the RDL contact pad such that the RDL contact pad is exposed to the opening. A first distance between a first position of the opening and a central point of the opening is different from a second distance between a second position of the opening and the central point of the opening in a plan view.
摘要翻译：本发明提供了一种半导体封装组件。半导体封装组件包括具有第一表面和与第一衬底相对的第二表面的再分布层（RDL）结构。 RDL结构包括靠近第二表面布置的再分布层（RDL）接触垫。钝化层设置在RDL接触垫上。钝化层具有对应于RDL接触焊盘的开口，使得RDL接触焊盘暴露于开口。在开口的第一位置和开口的中心点之间的第一距离与在平面图中的开口的第二位置和开口的中心点之间的第二距离不同。

46. 发明公开

EP3154085A1 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME 无效
标题翻译： VERFAHREN ZUR FORMUNG DAVONHALBLEITERGEHÄUSESTRUKTUR
公开(公告)号：EP3154085A1
公开(公告)日：2017-04-12
申请号：EP16182289.5
申请日：2016-08-02
申请人： MediaTek Inc.
发明人： LIU, Nai-Wei , LIN, Tzu-Hung , PENG, I-Hsuan , HSIAO, Ching-Wen , HUANG, Wei-Che
IPC分类号： H01L25/10 , H01L21/60 , H01L25/065 , H01L21/56
CPC分类号： H01L25/0657 , H01L21/561 , H01L21/568 , H01L21/78 , H01L23/3128 , H01L23/3142 , H01L23/49805 , H01L23/49816 , H01L24/06 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/20 , H01L24/73 , H01L24/94 , H01L24/97 , H01L25/105 , H01L2224/03011 , H01L2224/03502 , H01L2224/036 , H01L2224/04042 , H01L2224/04105 , H01L2224/06136 , H01L2224/06146 , H01L2224/06156 , H01L2224/06166 , H01L2224/10126 , H01L2224/12105 , H01L2224/16235 , H01L2224/17136 , H01L2224/17146 , H01L2224/17156 , H01L2224/17166 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2224/73267 , H01L2224/92244 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2225/06517 , H01L2225/0652 , H01L2225/06548 , H01L2225/06568 , H01L2225/06572 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/10253 , H01L2924/1431 , H01L2924/1432 , H01L2924/1436 , H01L2924/15311 , H01L2924/18162 , H01L2924/19105 , H01L2924/3511 , H01L2924/3512 , H01L2924/00014 , H01L2924/00012 , H01L2224/83 , H01L2224/214 , H01L2924/00
摘要： A semiconductor package structure is provided. The semiconductor package structure includes a semiconductor body (100) and a conductive structure (140) disposed below the semiconductor body. The semiconductor package structure also includes an insulating layer (150) surrounding the conductive structure. The semiconductor package structure further includes a redistribution layer structure (240) coupled to the conductive structure. In addition, the semiconductor package structure includes a molding compound (230) surrounding the semiconductor body. A portion of the molding compound extends between the redistribution layer structure and the semiconductor body.
摘要翻译：提供半导体封装结构。半导体封装结构包括设置在半导体本体下方的半导体本体（100）和导电结构（140）。半导体封装结构还包括围绕导电结构的绝缘层（150）。半导体封装结构还包括耦合到导电结构的再分配层结构（240）。此外，半导体封装结构包括围绕半导体本体的模塑料（230）。模制化合物的一部分在再分布层结构和半导体本体之间延伸。

47. 发明公开

EP3091571A3 FAN-OUT PACKAGE STRUCTURE INCLUDING AN ANTENNA OR A CONDUCTIVE SHIELDING LAYER 有权
标题翻译：具有天线或屏蔽半导体封装安排
公开(公告)号：EP3091571A3
公开(公告)日：2017-01-25
申请号：EP16166793.6
申请日：2016-04-25
申请人： MediaTek, Inc
发明人： LIN, Tzu-Hung , PENG, I-Hsuan , LIU, Nai-Wei , HSIAO, Ching-Wen , HUANG, Wei-Che
IPC分类号： H01L23/538 , H01L25/16 , H01L23/552 , H01L23/66 , H01L25/10
CPC分类号： H01L25/0652 , H01L23/3128 , H01L23/3171 , H01L23/5226 , H01L23/5385 , H01L23/5389 , H01L23/552 , H01L23/66 , H01L24/19 , H01L24/20 , H01L25/16 , H01L2223/6677 , H01L2224/02331 , H01L2224/02379 , H01L2224/04042 , H01L2224/04105 , H01L2224/12105 , H01L2224/32225 , H01L2224/73267 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/1421 , H01L2924/1435 , H01L2924/1438 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025
摘要： A semiconductor package structure including a first semiconductor package is provided. The first semiconductor package includes a first semiconductor package including a first redistribution layer (RDL) structure (106) having a first surface (101) and a second surface (103) opposite thereto. A first semiconductor die (110a) and a first molding compound (120) that surrounds the first semiconductor die are disposed on the first surface of the first RDL structure. An IMD structure (134) having a conductive layer with an antenna pattern (132) is disposed on the first molding compound and the first semiconductor die.

48. 发明公开

EP3076429A2 SEMICONDUCTOR PACKAGE ASSEMBLY WITH EMBEDDED IPD 有权
标题翻译：带嵌入式IPD的半导体封装组件
公开(公告)号：EP3076429A2
公开(公告)日：2016-10-05
申请号：EP16160070.5
申请日：2016-03-14
申请人： MediaTek, Inc
发明人： LIN, Tzu-Hung , PENG, I-Hsuan , HSIAO, Ching-Wen
IPC分类号： H01L23/538 , H01L25/16 , H01L25/10
摘要： The invention provides a semiconductor package assembly (10a). The semiconductor package assembly includes a first semiconductor package (100a) including a first semiconductor die (100). A first redistribution layer (RDL) structure (126) is coupled to the first semiconductor die. The first redistribution layer (RDL) structure includes a first conductive trace (123) disposed at a first layer-level. A second conductive trace (121) is disposed at a second layer-level. A first inter-metal dielectric (IMD) layer (120a) and a second inter-metal dielectric (IMD) layer (120b) , which is beside the first inter-metal dielectric (IMD) layer, are disposed between the first conductive trace and the second conductive trace.
摘要翻译：本发明提供了一种半导体封装组件（10a）。该半导体封装组件包括包含第一半导体管芯（100）的第一半导体封装（100a）。第一重新分布层（RDL）结构（126）耦合到第一半导体管芯。第一再分配层（RDL）结构包括设置在第一层级的第一导电迹线（123）。第二导电迹线（121）设置在第二层级。在第一金属间电介质（IMD）层旁边的第一金属间电介质（IMD）层（120a）和第二金属间电介质（IMD）层（120b）设置在第一导电迹线和第二导电迹线。

49. 发明公开

EP3073527A1 SEMICONDUCTOR PACKAGE ASSEMBLY 审中-公开
标题翻译：半导体封装组件
公开(公告)号：EP3073527A1
公开(公告)日：2016-09-28
申请号：EP16151985.5
申请日：2016-01-20
申请人： MediaTek, Inc
发明人： LIN, Tzu-Hung , PENG, I-Hsuan , HSIAO, Ching-Wen
IPC分类号： H01L25/065 , H01L25/10 , H01L23/488 , H01L23/498 , H01L23/00 , H01L25/00
CPC分类号： H01L24/19 , H01L23/488 , H01L23/49811 , H01L23/49816 , H01L23/5389 , H01L24/97 , H01L25/105 , H01L25/50 , H01L2224/04105 , H01L2224/12105 , H01L2224/13025 , H01L2224/16145 , H01L2224/16146 , H01L2224/2518 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73209 , H01L2224/73265 , H01L2225/0651 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/15311 , H01L2924/18162 , H01L2924/00012 , H01L2924/00
摘要： The invention provides a semiconductor package, a semiconductor package assembly and a method for fabricating a semiconductor package. The semiconductor package assembly includes a first semiconductor package. The first semiconductor package includes a first semiconductor die having first pads thereon. A first redistribution layer (RDL) structure is coupled to the first semiconductor die. Conductive pillar structures are disposed on a surface of the first RDL structure away from the first semiconductor die, wherein the conductive pillar structures are coupled to the first RDL structure.
摘要翻译：本发明提供了一种半导体封装，一种半导体封装组件以及一种用于制造半导体封装的方法。该半导体封装组件包括第一半导体封装。第一半导体封装包括其上具有第一焊盘的第一半导体管芯。第一重新分布层（RDL）结构耦合到第一半导体管芯。导电柱结构设置在远离第一半导体管芯的第一RDL结构的表面上，其中导电柱结构耦合到第一RDL结构。

50. 发明公开

EP3067929A2 SEMICONDUCTOR PACKAGE ASSEMBLY 审中-公开
标题翻译： HALBLEITERGEHÄUSEANORDNUNG
公开(公告)号：EP3067929A2
公开(公告)日：2016-09-14
申请号：EP16157770.5
申请日：2016-02-29
申请人： MediaTek, Inc
发明人： LIN, Tzu-Hung , HSIAO, Ching-Wen , PENG, I-Hsuan
IPC分类号： H01L25/16
CPC分类号： H01L25/0657 , H01L21/568 , H01L23/5385 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/32 , H01L24/73 , H01L25/16 , H01L2224/04105 , H01L2224/12105 , H01L2224/131 , H01L2224/13147 , H01L2224/16227 , H01L2224/16265 , H01L2224/32265 , H01L2224/73204 , H01L2224/73209 , H01L2224/92133 , H01L2225/06513 , H01L2225/06558 , H01L2225/06586 , H01L2924/1431 , H01L2924/1432 , H01L2924/1436 , H01L2924/19011 , H01L2924/19041 , H01L2924/19104 , H01L2924/014
摘要： The invention provides a semiconductor package assembly. The semiconductor package assembly includes a semiconductor die (300). A first molding compound (360) covers a back surface of the semiconductor die. A redistribution layer (RDL) structure (350a) is disposed on a front surface of the semiconductor die. The semiconductor die is coupled to the RDL structure. A second molding compound (320) is disposed on the front surface of the semiconductor die and embedded in the RDL structure. A passive device (330) is disposed on the second molding compound and coupled to the semiconductor die.
摘要翻译：本发明提供一种半导体封装组件。半导体封装组件包括半导体管芯（300）。第一模塑料（360）覆盖半导体管芯的背面。再分配层（RDL）结构（350a）设置在半导体管芯的前表面上。半导体管芯耦合到RDL结构。第二模塑料（320）设置在半导体管芯的前表面并嵌入RDL结构中。无源器件（330）设置在第二模塑料上并与半导体管芯耦合。

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