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    • 37. 发明公开
    • THERMOPLASTIC POLYMER COMPOSITION, AND MOUDLED ARTICLE
    • 热塑性聚合物组合物和混杂物
    • EP3196250A1
    • 2017-07-26
    • EP15836800.1
    • 2015-08-10
    • Kuraray Co., Ltd.
    • MINAMIDE, AsakoMASUDA, MikioJOGO, Yosuke
    • C08L53/02B29C65/48C08L23/26C08L29/14C09J123/14C09J123/26C09J129/14C09J153/02
    • C09J153/025B29C65/48B32B7/12B32B15/082B32B15/20B32B17/064B32B27/08B32B27/302B32B27/34B32B27/36B32B2250/03B32B2325/00B32B2367/00B32B2377/00C08L23/26C08L51/06C08L53/02C08L53/025C09J9/00C09J123/14C09J123/26C09J151/06C09J153/02C08L29/14
    • To provide a thermoplastic polymer composition, which can be adhered to a synthetic resin, a ceramic or a metal without performing a primer treatment or the like, is able to be handled as a molded article, exhibits an excellent adhesive property in a broad temperature range from a low temperature to room temperature and flexibility, and has high thermal creep resistance, and a molded article using the thermoplastic polymer composition.
      A thermoplastic polymer composition, which contains from 10 to 100 parts by weight of a polar group-containing polypropylene-based resin (B) based on 100 parts by weight of a hydrogenated block copolymer (A) in which block copolymer containing a polymer block (S) including an aromatic vinyl compound unit and a polymer block (D) including a conjugated diene compound unit is hydrogenated,
      in which the hydrogenated block copolymer (A) is a mixture containing a hydrogenated block copolymer (A1) having at least one tan δ local maximum value in a range from -60 to -40°C, in which a block copolymer represented by formula (i) or (ii) shown below is hydrogenated:

              (i)     (S-D) n

              (ii)     (D-S) n -D

      (in the formulae above, S is a polymer block including an aromatic vinyl compound unit, D is a polymer block including a conjugated diene compound unit, and n is an integer from 1 to 5); and a hydrogenated block copolymer (A2) in which a block copolymer represented by formula (iii) shown below is hydrogenated:

              (iii)     (S-D) m -S

      (in the formula above, S is a polymer block including an aromatic vinyl compound unit, D is a polymer block including a conjugated diene compound unit, and m is an integer from 1 to 5); and a weight ratio of the hydrogenated block copolymer (A1) to the hydrogenated block copolymer (A2) is from 20:80 to 99:1.
    • 为了提供可以在不进行底漆处理等的情况下粘附到合成树脂,陶瓷或金属上的热塑性聚合物组合物,其可以作为模制品来处理,在宽温度范围内表现出优异的粘合性 从低温到室温和柔软性,并且具有高的耐热蠕变性,以及使用该热塑性聚合物组合物的成型品。 一种热塑性聚合物组合物,基于100重量份的氢化嵌段共聚物(A),含有10至100重量份的含极性基团的聚丙烯基树脂(B),其中嵌段共聚物含有聚合物嵌段( (A)为包含芳香族乙烯基化合物单元的聚合物嵌段共聚物(A)和含有共轭二烯化合物单元的聚合物嵌段(D)的氢化嵌段共聚物(A)的氢化嵌段共聚物 (i)或(ii)表示的嵌段共聚物被氢化的-60至-40℃范围内的局部最大值:(i)(SD)n(ii)(DS)nD 在上式中,S是包含芳族乙烯基化合物单元的聚合物嵌段,D是包含共轭二烯化合物单元的聚合物嵌段,并且n是1至5的整数。 (iii)(SD)mS(式中,S为含有芳香族乙烯基化合物单元的聚合物嵌段,D为氢原子的嵌段共聚物,D 是包含共轭二烯化合物单元的聚合物嵌段,并且m是1至5的整数。 并且氢化嵌段共聚物(A1)与氢化嵌段共聚物(A2)的重量比为20:80至99:1。