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31. 发明公开

EP1388070A2 ELECTROMAGNETICALLY COUPLED INTERCONNECT SYSTEM ARCHITECTURE 有权
标题翻译：电磁耦合-LINK系统架构
公开(公告)号：EP1388070A2
公开(公告)日：2004-02-11
申请号：EP01986111.1
申请日：2001-11-13
申请人： FORMFACTOR, INC.
发明人： MILLER, Charles, A.
IPC分类号： G06F13/40
CPC分类号： H04B5/0012 , H01L23/48 , H01L2924/0002 , H01L2924/3011 , H04B5/0075 , H04B5/02 , H05K1/141 , H05K1/181 , H05K3/366 , H05K2201/10098 , Y02P70/611 , H01L2924/00
摘要： An electromagnetic interconnect method and apparatus effects contactless, proximity connections between elements in an electronics system. Data to be communicated between elements in an electronic system are modulated into a carrier signal and transmitted contactlessly by electromagnetic coupling. The electromagnetic coupling may be directly between elements in the system or through an intermediary transmission medium.

32. 发明公开

EP1362005A2 METHOD FOR FORMING MICROELECTRONIC SPRING STRUCTURES ON A SUBSTRATE 有权
标题翻译：用于生产导电接触结构
公开(公告)号：EP1362005A2
公开(公告)日：2003-11-19
申请号：EP02709455.6
申请日：2002-02-06
申请人： FORMFACTOR, INC.
发明人： ELDRIDGE, Benjamin, N. , WENZEL, Stuart, W.
IPC分类号： B81B3/00 , H01L23/48 , G01R1/073 , G01R1/067 , G01R3/00
CPC分类号： G01R1/06716 , G01R1/0483 , G01R1/06727 , G01R1/06733 , G01R1/07342 , G01R3/00 , H01L23/4822 , H01L24/72 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/12036 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01R12/52 , H01R13/24 , H01R13/2407 , H05K3/4092 , H05K7/1069 , Y10T29/49147 , H01L2924/00
摘要： A layer of sacrificial material is formed over a substrate. Then, a contoured surface is developed in the sacrificial material, such as by molding the sacrificial material using a mold or stamp. The contoured surface provides a mold for at least one spring form, and preferably for an array of spring forms. If necessary, the sacrificial layer is then cured or hardened. A layer of spring material is deposited over the contoured surface of the sacrificial material, in a pattern to define at least one spring form, and preferably an array of spring forms. The sacrificial material is then at least partially removed from beneath the spring form to reveal at least one freestanding spring structure. A separate conducting tip is optionally attached to each resulting spring structure, and each structure is optionally plated or covered with an additional layer or layers of material, as desired. An alternative method for making a resilient contact structure using the properties of a fluid meniscus is additionally disclosed. In an initial step of the alternative method, a layer of material is provided over a substrate. Then, a recess is developed in the material, and fluid is provided in the recess to form a meniscus. The fluid is cured or hardened to stabilize the contoured shape of the meniscus. The stabilized meniscus is then used to define a spring form in the same manner as the molded surface in the sacrificial material.

33. 发明公开

EP1326079A2 Probe card 有权
标题翻译： Testkarte
公开(公告)号：EP1326079A2
公开(公告)日：2003-07-09
申请号：EP03003496.1
申请日：1999-12-02
申请人： FORMFACTOR, INC.
发明人： Eldridge, Benjamin N. , Grube, Gary W. , Mathieu, Gaetan L.
IPC分类号： G01R1/073
CPC分类号： B23K20/004 , B23K2201/40 , G01R1/06711 , G01R1/06716 , G01R1/07307 , G01R1/07314 , G01R1/07342 , G01R1/07378 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/13099 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2924/0001 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15787 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , H01L2924/00
摘要： A probe card (321) is provided for contacting an electronic component with raised contact elements. In particular, the present invention is useful for contacting a semiconductor wafer (310) with resilient contact elements (301), such as springs. A probe card (321) is designed to have terminals to mate with the contact elements on the wafer (310). In a preferred embodiment, the terminals are posts. In a preferred embodiment the terminals include a contact material suitable for repeated contacts. In one particularly preferred embodiment, a space transformer (324) is prepared with contact posts on one side and terminals on the opposing side. An interposer (325) with spring contacts (333, 334) connects a contact (335) on the opposing side of the space transformer (324) to a corresponding terminal (332) on a probe card (321), which terminal (332) is in turn connected to a terminal (331) which is connectable to a test device such as a conventional tester.
摘要翻译：提供探针卡（321）用于使电子部件与凸起的接触元件接触。特别地，本发明对于使半导体晶片（310）与诸如弹簧的弹性接触元件（301）接触是有用的。探针卡（321）设计成具有与晶片（310）上的接触元件配合的端子。在优选实施例中，终端是帖子。在优选实施例中，端子包括适于重复接触的接触材料。在一个特别优选的实施例中，空间变压器（324）制备成具有一侧的接触柱和相对侧上的端子。具有弹簧触点（333,334）的插入器（325）将空间变压器（324）的相对侧上的触点（335）连接到探针卡（321）上的相应端子（332），该端子（332）又连接到可连接到例如常规测试仪的测试装置的端子（331）。

34. 发明公开

EP1263136A3 Filter structures for integrated circuit interfaces 有权
标题翻译：用于集成电路之间的接口的过滤器结构
公开(公告)号：EP1263136A3
公开(公告)日：2003-05-07
申请号：EP02010250.5
申请日：2000-02-23
申请人： FORMFACTOR, INC.
发明人： Charles Miller, A.
IPC分类号： H03H7/38
CPC分类号： H05K1/025 , H01L2224/48091 , H01L2924/30107 , H01L2924/3011 , H03H7/0115 , H03H7/38 , H03H2001/0085 , H05K1/0216 , H05K1/0231 , H05K1/0233 , H05K1/113 , H05K1/116 , H05K1/162 , H05K3/3421 , H05K3/429 , H05K2201/09263 , H05K2201/09454 , H05K2201/09672 , H05K2201/09727 , H05K2201/10689 , H01L2924/00014 , H01L2924/00
摘要： A method of optimizing the frequency response of an interconnect system of the type which conveys high frequency signals between bond pads of separate integrated circuits (ICs) mounted on a printed circuit board (PCB) through inductive conductors, such as bond wires and package legs, and a trace on the surface of the PCB. To improve the interconnect system, capacitance is added to the trace and inductance is added to the conductors, with the added trace capacitance and conductor inductance being appropriately sized relative to one another and to various other interconnect system impedances to optimize the interconnect system impedance matching frequency response.

35. 发明公开

EP1275150A2 SHAPED SPRINGS AND METHODS OF FABRICATING AND USING SHAPED SPRINGS 审中-公开
标题翻译：异型弹簧及其生产工艺和异型弹簧的使用
公开(公告)号：EP1275150A2
公开(公告)日：2003-01-15
申请号：EP01922806.3
申请日：2001-03-28
申请人： FORMFACTOR, INC.
发明人： MATHIEU, Gaetan, L. , ELDRIDGE, Benjamin, N. , WENZEL, Stuart, W.
IPC分类号： H01L23/48
CPC分类号： G01R1/06761 , G01R1/06744 , G01R1/07342 , G01R3/00 , H01L24/11 , H01L24/13 , H01L2224/13 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/01094 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H01L2924/00
摘要： An interconnection element and a method of fabricating and using an interconnect element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the interconnection is modified. An example is a material that has a transformable property such that a volume of the first and/or second element material may undergo a thermal transformation from one volume to a different volume (such as a smaller volume).

36. 发明授权

EP0729652B1 METHOD FOR FABRICATING A CONTACT STRUCTURE FOR INTERCONNECTIONS, INTERPOSER, SEMICONDUCTOR ASSEMBLY 失效
标题翻译：一种用于生产接触结构对化合物ZWISCHENSTÜCK的半导体装置，
公开(公告)号：EP0729652B1
公开(公告)日：2002-10-16
申请号：EP95901950.6
申请日：1994-11-16
申请人： FormFactor, Inc.
发明人： KHANDROS, Igor, Y. , MATHIEU, Gaetan, L.
IPC分类号： H01R9/00 , H01R29/00 , B23K31/02 , H05K3/30 , H01L23/49 , H01L21/60 , H01L23/48 , H01L21/66 , H01L21/68 , H01L23/32
CPC分类号： H05K7/1069 , B23K2201/40 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06761 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/563 , H01L21/67138 , H01L21/6715 , H01L22/20 , H01L23/49811 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/06153 , H01L2224/1134 , H01L2224/13083 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/136 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/49109 , H01L2224/73203 , H01L2224/78301 , H01L2224/81801 , H01L2224/85045 , H01L2224/85205 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01055 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15312 , H01L2924/15787 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49124 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49162 , Y10T29/49169 , Y10T29/49217 , Y10T29/49224 , H01L2924/00 , H01L2224/48 , H01L2224/81205
摘要： An interconnection contact structure assembly including an electronic component (102) having a surface and a conductive contact terminal (103) carried by the electronic component (102) and accessible at the surface. The contact structure (101) includes an internal flexible elongate member (106) having first (107) and second ends (108) and with the first end (107) forming a first intimate bond to the surface of the conductive contact terminal (103) without the use of a separate bonding material. An electrically conductive shell (116) is provided and is formed of at least one layer of a conductive material enveloping the elongate member (106) and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

37. 发明公开

EP1204872A1 ELECTRICAL CONTACTOR, ESPECIALLY WAFER LEVEL CONTACTOR, USING FLUID PRESSURE 有权
标题翻译：电气KONTAKTOR，尤其是在WAFERKONTAKTOR，使用液体或气体的压力
公开(公告)号：EP1204872A1
公开(公告)日：2002-05-15
申请号：EP00957408.8
申请日：2000-08-10
申请人： FORMFACTOR, INC.
发明人： ELDRIDGE, Benjamin
IPC分类号： G01R1/073 , G01R31/316
CPC分类号： G01R31/2887 , G01R1/0735 , G01R31/2886
摘要： An electrical interconnect assembly and methods for making an electrical interconnect assembly. In one embodiment, an interconnect assembly includes a flexible wiring layer having a plurality of first contact elements and a fluid containing structure which is coupled to the flexible wiring layer. The fluid, when contained in the fluid containing structure, presses the flexible wiring layer towards a device under test to form electrical interconnections between the first contact elements and corresponding second contact elements on the device under test. In a further embodiment, an interconnect assembly includes a flexible wiring layer having a plurality of first contact terminals and a semiconductor substrate which includes a plurality of second contact terminals. A plurality of freestanding, resilient contact elements, in one embodiment, are mechanically coupled to one of the flexible wiring layers or the semiconductor substrate and make electrical contacts between corresponding ones of the first contact terminals and the second contact terminals. In another embodiment, a method of making electrical interconnections includes joining a flexible wiring layer and a substrate together in proximity and causing a pressure differential between a first side and a second side of the flexible wiring layer. The pressure differential deforms the flexible wiring layer and causes a plurality of first contact terminals on the flexible wiring layer to electrically connect with a corresponding plurality of second contact terminals on the substrate.

38. 发明公开

EP1188061A1 SEGMENTED CONTACTOR 有权
标题翻译：基于分段KONTAKTOR
公开(公告)号：EP1188061A1
公开(公告)日：2002-03-20
申请号：EP00947625.0
申请日：2000-06-06
申请人： FORMFACTOR, INC.
发明人： ESLAMY, Mohammad , PEDERSEN, David, V. , COBB, Harry, D.
IPC分类号： G01R3/00 , H01L21/68
CPC分类号： G01R31/2886 , G01R3/00 , Y10T29/49004 , Y10T29/49117 , Y10T29/49147 , Y10T29/49149 , Y10T29/49171 , Y10T29/49178 , Y10T29/49204 , Y10T29/4921 , Y10T29/49211
摘要： A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.

39. 发明公开

EP1159630A1 DISTRIBUTED INTERFACE FOR PARALLEL TESTING OF MULTIPLE DEVICES USING A SINGLE TESTER CHANNEL 有权
标题翻译：分布式的接口，用于单信道测试使用多个设备并行测试
公开(公告)号：EP1159630A1
公开(公告)日：2001-12-05
申请号：EP00910352.4
申请日：2000-02-24
申请人： FORMFACTOR, INC.
发明人： ROY, Richard, S. , MILLER, Charles, A.
IPC分类号： G01R31/3193 , G01R31/319 , G11C29/00
CPC分类号： G11C29/48 , G01R31/31905 , G01R31/31926 , G01R31/3193 , G11C29/56 , G11C2029/2602 , G11C2029/5606 , H01L2224/16225
摘要： A system for testing a number of integrated circuit (IC) devices under test (DUTs) having interface circuitry coupled to a single or multi-channel tester for receiving data values from the tester and providing error information concerning the DUTs. The interface circuitry forwards data values (received from the tester over a single channel) to a number of DUTs in parallel. The circuitry performs comparisons using data values read from the DUTs, and in response generates error values indicative of the comparison. The error values may then be returned to the tester over the same or a different channel.

40. 发明公开

EP0729652A4 CONTACT STRUCTURE FOR INTERCONNECTIONS, INTERPOSER, SEMICONDUCTOR ASSEMBLY AND METHOD 失效
标题翻译： KONTAKSTRUKTURFÜRVERBINDUNGEN，ZWISCHENSTÜCK，HALBLEITERANORDNUNG UND VERFAHREN
公开(公告)号：EP0729652A4
公开(公告)日：1998-06-24
申请号：EP95901950
申请日：1994-11-16
申请人： FORMFACTOR INC
发明人： KHANDROS IGOR Y , MATHIEU GAETAN L
IPC分类号： H01L23/12 , C23C18/16 , C25D7/12 , G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/26 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L21/66 , H01L23/32 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L25/065 , H01L25/07 , H01L25/16 , H01L25/18 , H01R4/02 , H01R9/00 , H01R12/52 , H01R33/76 , H05K1/14 , H05K3/30 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40 , H05K7/10 , B23K31/02 , H01R23/70 , H01R29/00
CPC分类号： H05K7/1069 , B23K2201/40 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06761 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/563 , H01L21/67138 , H01L21/6715 , H01L22/20 , H01L23/49811 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/06153 , H01L2224/1134 , H01L2224/13083 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/136 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/49109 , H01L2224/73203 , H01L2224/78301 , H01L2224/81801 , H01L2224/85045 , H01L2224/85205 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01055 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15312 , H01L2924/15787 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49124 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49162 , Y10T29/49169 , Y10T29/49217 , Y10T29/49224 , H01L2924/00 , H01L2224/48 , H01L2224/81205
摘要： An interconnection contact structure assembly including an electronic component (102) having a surface and a conductive contact terminal (103) carried by the electronic component (102) and accessible at the surface. The contact structure (101) includes an internal flexible elongate member (106) having first (107) and second ends (108) and with the first end (107) forming a first intimate bond to the surface of the conductive contact terminal (103) without the use of a separate bonding material. An electrically conductive shell (116) is provided and is formed of at least one layer of a conductive material enveloping the elongate member (106) and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.
摘要翻译：一种互连接触结构组件，其包括具有表面的电子部件（102）和由电子部件（102）承载且可在表面可访问的导电接触端子（103）。接触结构（101）包括具有第一（107）和第二端（108）的内部柔性细长构件（106），并且第一端（107）形成与导电接触端子（103）的表面的第一紧密接合，而不使用单独的粘合材料。提供导电外壳（116），并且由至少一层包围细长构件（106）的导电材料层形成，并与紧邻第一紧密接合的导电接触端子的至少一部分形成第二紧密接合。

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