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21. 发明公开

EP1758734A1 TEXTILE STRUCTURES FOR HEATING OR WARMING 失效
标题翻译： TEXTILSTRUKTUREN ZUM ERHITZEN ODERERWÄRMEN
公开(公告)号：EP1758734A1
公开(公告)日：2007-03-07
申请号：EP05751099.2
申请日：2005-06-15
申请人： Textronics, Inc.
发明人： BURR, Stacey, B. , HASSONJEE, Qaizar, N.
IPC分类号： B32B5/00 , H05B3/34
CPC分类号： B32B5/26 , A41D31/0072 , B32B3/04 , B32B3/08 , B32B27/08 , B32B27/12 , B32B2307/202 , B32B2437/00 , H05B3/342 , H05B2203/005 , H05B2203/013 , H05B2203/014 , H05B2203/017 , H05B2203/036 , H05K1/00 , H05K9/009 , Y10T29/49947 , Y10T156/10 , Y10T156/1049 , Y10T156/1092 , Y10T428/24 , Y10T428/24008 , Y10T428/2419 , Y10T428/24207 , Y10T428/24273 , Y10T428/24281 , Y10T428/24289 , Y10T428/24298 , Y10T428/24306 , Y10T428/24314 , Y10T428/24322 , Y10T428/24331 , Y10T428/24339 , Y10T428/24347 , Y10T428/24479 , Y10T428/249921 , Y10T428/249922 , Y10T428/2848 , Y10T442/3008 , Y10T442/3016 , Y10T442/3024 , Y10T442/339 , Y10T442/40 , Y10T442/60 , Y10T442/601 , Y10T442/602 , Y10T442/655
摘要： The invention provides a functional laminate composite fabric which is robust, laundry-durable and adaptable for securing about any three dimensional body, and a method for forming such fabric. The functional laminate fabric is provided with at least one functional element which can conduct electricity, conduct light, provide electromagnetic fields or provide shielding from electromagnetic fields. The functional laminate may include vias through which the functional element may be exposed. Generally, the functional laminate fabric is sufficiently robust for incorporation into garments and for applications in so-called wearable electronics.
摘要翻译：本发明提供了一种功能性层压复合织物，其是坚固的，衣物耐久的并且适用于固定在任何三维体上，以及用于形成这种织物的方法。功能层压织物设置有至少一个能够传导电力，传导光，提供电磁场或提供电磁场屏蔽的功能元件。功能层压材料可以包括可以暴露功能元件的通孔。通常，功能性层压织物足够坚固，用于结合到服装中并用于所谓的可穿戴电子设备中。

22. 发明公开

EP1758732A1 PERFORATED FUNCTIONAL TEXTILE STRUCTURES 失效
标题翻译： PERFORIERTE FUNKTIONALE TEXTILSTRUKTUREN
公开(公告)号：EP1758732A1
公开(公告)日：2007-03-07
申请号：EP05754361.3
申请日：2005-06-15
申请人： Textronics, Inc.
发明人： BURR, Stacey, B. , HASSONJEE, Qaizar N. , ARMITAGE, Roger
IPC分类号： B32B3/08 , B32B5/04 , A41D1/00
CPC分类号： B32B5/26 , A41D31/0072 , B32B3/04 , B32B3/08 , B32B27/08 , B32B27/12 , B32B2307/202 , B32B2437/00 , H05B3/342 , H05B2203/005 , H05B2203/013 , H05B2203/014 , H05B2203/017 , H05B2203/036 , H05K1/00 , H05K9/009 , Y10T29/49947 , Y10T156/10 , Y10T156/1049 , Y10T156/1092 , Y10T428/24 , Y10T428/24008 , Y10T428/2419 , Y10T428/24207 , Y10T428/24273 , Y10T428/24281 , Y10T428/24289 , Y10T428/24298 , Y10T428/24306 , Y10T428/24314 , Y10T428/24322 , Y10T428/24331 , Y10T428/24339 , Y10T428/24347 , Y10T428/24479 , Y10T428/249921 , Y10T428/249922 , Y10T428/2848 , Y10T442/3008 , Y10T442/3016 , Y10T442/3024 , Y10T442/339 , Y10T442/40 , Y10T442/60 , Y10T442/601 , Y10T442/602 , Y10T442/655
摘要： The invention provides a functional stretch laminate composite puckered fabric which is robust, laundry-durable and adaptable for securing about any three dimensional body, and a method for forming such puckered fabric. The functional stretch laminate fabric is provided with at least one functional element which can conduct electricity, conduct light, provide electromagnetic fields or provide shielding from electromagnetic fields. In addition, at least one via (74) is provided in the functional stretch laminate allowing the functional element to extend or loop (76a, 76b) outwardly from the at least one via when the laminate is in a relaxed or unstretched state. Generally, the functional stretch laminate fabric is sufficiently robust for incorporation into garments and for applications in so-called wearable electronics.
摘要翻译：本发明提供了一种功能性层压复合织物，其是坚固的，衣物耐久的并且适用于固定在任何三维体上，以及用于形成这种织物的方法。功能层压织物设置有至少一个能够传导电力，传导光，提供电磁场或提供电磁场屏蔽的功能元件。功能层压材料可以包括可以暴露功能元件的通孔。通常，功能性层压织物足够坚固，用于结合到服装中并用于所谓的可穿戴电子设备中。

23. 发明公开

EP1665005A1 PROZESSOR-ANORDNUNG, TEXTILGEWEBESTRUKTUR, FLÄCHENVERKLEIDUNGSSTRUKTUR UND VERFAHREN ZUM WEITERLEITEN VON ELEKTRISCHER ENERGIEVERSORGUNG ZWISCHEN EINER VIELZAHL EINANDER ÖRTLICH BENACHBART ANGEORDNETER PROZESSORELEMENTE 有权
标题翻译：处理器布置，织物结构，表面面板的结构与方法电能供给之间的各种相互LOCAL邻近ARRANGED处理器单元TRANSFER
公开(公告)号：EP1665005A1
公开(公告)日：2006-06-07
申请号：EP04786778.3
申请日：2004-09-15
申请人： Infineon Technologies AG
发明人： GLASER, Rupert
IPC分类号： G06F1/26 , G06F15/80
CPC分类号： E04F15/02 , A47H5/0325 , A47H23/08 , D03D1/0088 , D03D15/00 , D03D15/0011 , D03D15/0066 , D10B2101/06 , D10B2101/12 , D10B2101/20 , D10B2401/16 , D10B2403/02431 , D10B2503/02 , D10B2503/03 , D10B2503/04 , E04F13/002 , E04F2290/026 , G06F11/2015 , H05K1/00
摘要： Disclosed is a processor element comprising a plurality of power supply interfaces, a plurality of power supply switches, and a fault-testing unit for testing whether a short-circuit to a connected adjacent processor element has occurred at a power supply interface. The respective power supply switch is closed in case no short-circuit has occurred such that electricity can be fed to the respective power supply interface.

24. 发明授权

EP0558331B1 Detachable apparatus for automotive audio equipment 失效
标题翻译：汽车收音机可拆卸装置
公开(公告)号：EP0558331B1
公开(公告)日：1996-08-21
申请号：EP93301448.2
申请日：1993-02-26
申请人： SONY CORPORATION
发明人： Kawamura, Masateru, c/o Sony Corporation
IPC分类号： H05K11/02 , B60R11/02
CPC分类号： B60R1/00 , B60R11/02 , H05K1/00 , H05K11/02

25. 发明公开

EP0558331A1 Detachable apparatus for automotive audio equipment 失效
标题翻译： AbnehmbaresGerätfürAutoradio。
公开(公告)号：EP0558331A1
公开(公告)日：1993-09-01
申请号：EP93301448.2
申请日：1993-02-26
申请人： SONY CORPORATION
发明人： Kawamura, Masateru, c/o Sony Corporation
IPC分类号： H05K11/02 , B60R11/02
CPC分类号： B60R1/00 , B60R11/02 , H05K1/00 , H05K11/02
摘要： An automotive equipment such as a car stereo or the like includes a lock member having an engagement portion. The engagement portion of the lock member is engaged with an engaged portion provided in an accommodation portion in which the automotive equipment body is accommodated to thereby lock the automotive equipment body. The automotive equipment body is released from being locked by a lock releasing operation executed when a lock releasing key is inserted into a lock releasing aperture formed on a front surface panel frame provided in the automotive equipment body.
摘要翻译：诸如汽车立体声等的汽车设备包括具有接合部分的锁定构件。锁定构件的接合部分与设置在其中容纳汽车设备主体的容纳部分中的接合部分接合，从而锁定汽车设备主体。当锁定解除钥匙被插入形成在设置在汽车设备主体中的前表面面板框架上的锁定释放孔中时，汽车设备主体被锁定释放操作而被锁定。

26. 发明公开

EP0526992A3 Multilayer carrier for mounting an integrated circuit and method of making the same 失效
标题翻译：多层集成电路安装设备
公开(公告)号：EP0526992A3
公开(公告)日：1993-02-24
申请号：EP92306273.1
申请日：1992-07-08
申请人： NCR INTERNATIONAL INC.
发明人： Hilbrink, John O.
IPC分类号： H01L23/538
CPC分类号： H05K1/00 , H01L23/5383 , H01L23/5385 , H01L23/5387 , H01L2924/0002 , H05K1/0298 , H05K1/141 , H05K3/0044 , H05K3/0047 , H05K3/3447 , H05K3/36 , H05K3/363 , H05K2201/096 , H05K2201/10303 , H01L2924/00
摘要： The invention provides a carrier for Integrated Circuits (ICs) (33). The ICs (33) are carried by a multi-layer board, constructed of individual layers (36). Some layers carry conductive traces, and the traces are connected together to form a 3-dimensional network connecting the ICs (33). The individual layers (36) are constructed of a flexible material, which is commercially available in large sheets, thus allowing multiple copies of the trace patterns to be printed simultaneously. The multi-layer board is attached to a standard printed circuit board (38), by pins (39) which are driven through both the standard printed circuit board (38) and the layers (36) and soldered into place.
摘要翻译：本发明提供了一种用于集成电路（IC）（33）的载体。 IC（33）由单层（36）构成的多层板承载。一些层承载导电迹线，并且迹线连接在一起以形成连接IC（33）的3维网络。单个层（36）由柔性材料构成，其可以以大片材商购，从而允许同时印刷迹线图案的多个拷贝。多层板通过被标准印刷电路板（38）和层（36）驱动并被焊接到位的销（39）连接到标准印刷电路板（38）。

27. 发明公开

EP0526992A2 Multilayer carrier for mounting an integrated circuit and method of making the same 失效
标题翻译： Mehrschichtige Befestigungsvorrichtungfürintegrierte Schaltungen。
公开(公告)号：EP0526992A2
公开(公告)日：1993-02-10
申请号：EP92306273.1
申请日：1992-07-08
申请人： NCR INTERNATIONAL INC.
发明人： Hilbrink, John O.
IPC分类号： H01L23/538
CPC分类号： H05K1/00 , H01L23/5383 , H01L23/5385 , H01L23/5387 , H01L2924/0002 , H05K1/0298 , H05K1/141 , H05K3/0044 , H05K3/0047 , H05K3/3447 , H05K3/36 , H05K3/363 , H05K2201/096 , H05K2201/10303 , H01L2924/00
摘要： The invention provides a carrier for Integrated Circuits (ICs) (33). The ICs (33) are carried by a multi-layer board, constructed of individual layers (36). Some layers carry conductive traces, and the traces are connected together to form a 3-dimensional network connecting the ICs (33). The individual layers (36) are constructed of a flexible material, which is commercially available in large sheets, thus allowing multiple copies of the trace patterns to be printed simultaneously. The multi-layer board is attached to a standard printed circuit board (38), by pins (39) which are driven through both the standard printed circuit board (38) and the layers (36) and soldered into place.
摘要翻译：本发明提供了一种用于集成电路（IC）（33）的载体。 IC（33）由单层（36）构成的多层板承载。一些层承载导电迹线，并且迹线连接在一起以形成连接IC（33）的3维网络。单个层（36）由柔性材料构成，其可以以大片材商购，从而允许同时印刷迹线图案的多个拷贝。多层板通过被标准印刷电路板（38）和层（36）驱动并被焊接到位的销（39）连接到标准印刷电路板（38）。

28. 发明公开

EP0361193A3 Leiterplatte mit einem spritzgegossenen Substrat 失效
标题翻译：具有注射成型基板的电路板
公开(公告)号：EP0361193A3
公开(公告)日：1990-06-27
申请号：EP89116802.3
申请日：1989-09-11
申请人： SIEMENS AKTIENGESELLSCHAFT
发明人： Schmidt, Hans-Friedrich, Dr.
IPC分类号： H05K1/00 , H05K3/40 , H05K3/42
CPC分类号： H05K1/00 , H05K1/116 , H05K3/064 , H05K3/107 , H05K3/184 , H05K3/28 , H05K3/426 , H05K2201/0376 , H05K2201/09036 , H05K2201/09118 , H05K2201/09827 , H05K2201/09845 , H05K2201/09981 , H05K2203/0143 , H05K2203/0571 , H05K2203/0574 , H05K2203/1415 , Y10T29/4916 , Y10T29/49165
摘要： In das spritzgegossene Substrat (1) sind grabenförmige Vertiefungen (30) eingebracht, die durch einen vorzugsweise stromlos abgeschiedenen Metallüberzug (2) bis zur Substratoberfläche aufgefüllt sind und die Leiterbahnen bilden. Im Bereich von eingespritzten Durchkontaktierungslöchern (60) befinden sich im Substrat (1) flächige Vertiefungen (40), die erfindungsgemäß tiefer sind als die grabenförmigen Vertiefungen (30). Der in den flächigen Vertiefungen (40) abgeschiedene Metallüberzug (2) endet somit im Abstand zur Substratoberfläche, so daß ein Lötstopplack (4) ohne Photostrukturierung beispielsweise durch Roller-Coating aufgetragen werden kann ohne in die flächigen Vertiefungen (40) oder entsprechende Vertiefungen für Anschlußflächen einzudringen. Danach kann beispielsweise eine Zinnschicht (3) zur Bildung der erwünschten Lötaugen durch Heißverzinnen aufgebracht werden.

29. 发明授权

EP0016230B1 SUBSTRATE FOR FLEXIBLE PRINTED CIRCUITS AND METHOD OF FABRICATING THE SAME, AND FILM 失效
标题翻译：用于柔性印刷电路的基板及其制造方法和电影
公开(公告)号：EP0016230B1
公开(公告)日：1984-10-03
申请号：EP79900652.3
申请日：1979-06-13
申请人： SUMITOMO BAKELITE COMPANY LIMITED
发明人： YAMAOKA, Sigenori , KUSUHARA, Akinobu , ENDO, Toshinaga
IPC分类号： H05K1/05 , C08L63/00
CPC分类号： H05K1/00 , C08G59/4269 , C08L63/00 , H05K1/0346 , H05K1/0353 , Y10S428/901 , Y10T428/24917 , Y10T428/2495 , Y10T428/24967 , Y10T428/24975 , Y10T428/31525 , Y10T428/31529 , Y10T428/31681 , Y10T428/31721 , Y10T428/31725 , C08L2666/20
摘要： A substrate for flexible printed circuits obtained by coating a metal foil with an organic solvent solution of a heat resistant resin composition consisting of a heat resistant resin having an heterocyclic ring and epoxy resin and then drying the metal foil to thereby form a film directly on the foil as a material adapted for a flexible printed circuit board, and a method of fabricating the same. The printed circuit board exhibits heat resistance, fire retardance, adhesion, electric insulation and heat deterioration characteristics which are remarkably superior to the conventional circuit board which is obtained by integrating a heat resistant film with a metal foil via an adhesive. These properties are very important in practical use of the printed circuit board. The substrate of this invention is inexpensive since it can be easily fabricated as compared with the conventional one. This substrate can also be used for not only various flexible printed circuit boards but also as substrate for films alone.
摘要翻译： PCT No.PCT / JP79 / 00150 Sec。 371日期1980年2月5日 102（e）1980年2月5日PCT PCT。1979年6月13日PCT公布。公开号WO80 / 00117 日本1990年1月24日。公开了一种柔性印刷电路基板，其通过涂覆由具有杂环和环氧树脂的耐热树脂组成的耐热树脂组合物作为柔性印刷电路板的元素材料而制造将树脂溶解在金属箔上的有机溶剂中并干燥以直接在所述箔上形成膜及其制造方法。所述柔性印刷电路基板与通过粘合剂集成耐热膜和金属箔而获得的传统基板相比，耐热性，阻燃性，粘合性，电绝缘性和热劣化性更优异。这些性能在印刷电路基板的实际应用中是非常重要的。与常规产品相比，生产容易，因此可以以低成本制造本基板。该基板不仅可用于各种类型的柔性印刷电路板，而且从基板获得的膜本身也可用于使用膜的领域。

30. 发明授权

EP2838606B1 A FREESTANDING THIN FILM, ESPECIALLY A FREESTANDING THIN FILM FOR A SYSTEM FOR NEURAL APPLICATIONS 有权转让
公开(公告)号：EP2838606B1
公开(公告)日：2018-06-06
申请号：EP13722690.8
申请日：2013-04-17
申请人： Medtronic Bakken Research Center B.V.
发明人： WANG, Ke , HENNEKEN, Vincent Adrianus , YOUNG, Edward Willem Albert , DECKERS, Jacobus Adrianus Johanna Maria , VAN PIJKEREN, Dirk , DECRÉ, Michel Marcel Jose
IPC分类号： A61N1/05 , A61N1/36 , A61N1/08
CPC分类号： A61N1/0551 , A61N1/0529 , A61N1/0534 , A61N1/086 , A61N1/36125 , H05K1/00
摘要： The present invention relates to a thin film, especially a thin film (301) for a system for neural applications, whereby the thin film (301) forms at least partially a planary curved winding, in particular a planary spiral winding, when being outstretched on a substantially flat surface. Furthermore, the present invention relates to a method of manufacturing of a thin film (301), a wafer, a lead core for a lead, a lead, a probe and a system for neural applications.

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