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22. 发明公开

EP2250134A4 GLASS SURFACE MODIFICATION PROCESS 审中-公开
标题翻译：方法为了改变玻璃表面
公开(公告)号：EP2250134A4
公开(公告)日：2011-04-27
申请号：EP09712653
申请日：2009-02-17
申请人： BENEQ OY
发明人： RAJALA MARKKU , PUTKONEN MATTI , AHONEN SAMPO , PIMENOFF JOE , HOVINEN ANSSI , SNECK SAMI
IPC分类号： C03C17/23 , B05D1/10
CPC分类号： C03C17/25 , C03C23/006 , C03C2217/214 , C03C2217/22 , C23C16/403 , C23C16/405 , C23C16/453 , C23C16/56

23. 发明公开

EP2250134A1 GLASS SURFACE MODIFICATION PROCESS 审中-公开
标题翻译：方法为了改变玻璃表面
公开(公告)号：EP2250134A1
公开(公告)日：2010-11-17
申请号：EP09712653.6
申请日：2009-02-17
申请人： BENEQ OY
发明人： RAJALA, Markku , PUTKONEN, Matti , AHONEN, Sampo , PIMENOFF, Joe , HOVINEN, Anssi , SNECK, Sami
IPC分类号： C03C17/23 , B05D1/10
CPC分类号： C03C17/25 , C03C23/006 , C03C2217/214 , C03C2217/22 , C23C16/403 , C23C16/405 , C23C16/453 , C23C16/56
摘要： Process for improving the chemical durability of glass by modifying at least one surface of a glass substrate. The modification process utilizes crystalline metal oxide particles with a mean aerodynamic particle diameter of less than 1000 nm, which are at least partially embedded on and into the glass surface. Apparatus for depositing crystalline metal oxide particles on glass surface.

24. 发明公开

EP2188328A1 TRANSPARENTE PORÖSE SiO2-BESCHICHTUNG FÜR EIN TRANSPARENTES SUBSTRATMATERIAL MIT VERBESSERTEN OPTISCHEN EIGENSCHAFTEN. 无效
标题翻译：透明多孔SiO2涂料的具有改进的光学性能的透明衬底材料。
公开(公告)号：EP2188328A1
公开(公告)日：2010-05-26
申请号：EP08803016.8
申请日：2008-08-12
申请人： Siemens Aktiengesellschaft
发明人： EDER, Florian
IPC分类号： C08J5/18 , C03C1/00 , C03C17/00
CPC分类号： C03C17/007 , C03C23/006 , C03C2217/425 , C03C2218/113 , C03C2218/32 , C08G77/46 , C09D183/12 , Y10T428/249953 , Y10T428/249969
摘要： The invention relates to a transparent porous SiO2-coating for a transparent substrate material that has advantageous optical properties. These properties can be obtained, in particular, by plasma treatment.

25. 发明公开

EP2188224A1 VERFAHREN ZUR TRANSPARENTEN BESCHICHTUNG VON EINEM SUBSTRAT MIT PLASMA BEI ATMOSPHÄRENDRUCK 审中-公开
标题翻译：方法的基板与血浆在大气压力下的透明涂层
公开(公告)号：EP2188224A1
公开(公告)日：2010-05-26
申请号：EP08803253.7
申请日：2008-08-27
申请人： Siemens Aktiengesellschaft
发明人： EDER, Florian , GENSLER, Rudolf
IPC分类号： C03C17/25 , C03C17/34 , C23C16/50 , G02B1/10 , G02B1/11 , C23C16/455 , B05D7/24
CPC分类号： G02B1/11 , C03C17/25 , C03C17/256 , C03C17/3417 , C03C23/006 , C03C2217/734 , C03C2218/113 , C23C18/1208 , C23C18/1225 , C23C18/1254 , C23C18/1295
摘要： The invention relates to a method for improving the properties of coatings on transparent materials by plasma treatment, preferably by an atmospheric pressure plasma.

26. 发明公开

EP2098490A1 METHOD FOR FINISHING SURFACE OF PRELIMINARY POLISHED GLASS SUBSTRATE 审中-公开
标题翻译： VERFAHREN ZUR ENDBEARBEITUNG DEROBERFLÄCHEEINESVORLÄUFIGENPOLIERTEN GLASSUBSTRATS
公开(公告)号：EP2098490A1
公开(公告)日：2009-09-09
申请号：EP07832417.5
申请日：2007-11-22
申请人： Asahi Glass Company, Limited
发明人： OTSUKA, Koji , OKAMURA, Kenji
IPC分类号： C03C15/00 , G01B9/02 , G01B11/24 , G01B11/30 , G03F1/14 , G03F7/20 , H01L21/027
CPC分类号： G01B9/02065 , C03C15/02 , C03C19/00 , C03C23/006 , C03C2204/08 , G01B9/02057 , G01B9/0209 , G01B11/30 , G03F1/60 , H01J2237/0812 , Y10T428/24355
摘要： The invention is to provide a method in which waviness generated on a glass substrate surface during pre-polishing is removed, thereby finishing the glass substrate so as to have a surface excellent in flatness. The invention relates to a method for finishing a pre-polished glass substrate surface using any one of processing methods selected from the group consisting of ion beam etching, gas cluster ion beam etching and plasma etching, the glass substrate being made of quartz glass that contains a dopant and comprises SiO 2 as a main component, and the method for finishing a pre-polished glass substrate surface including: a step of measuring flatness of the glass substrate surface using a shape measurement unit that comprises: a low-coherent light source whose outgoing light flux has a coherence length shorter than twice an optical distance between front and back surfaces of the glass substrate; a path match route part that divides the outgoing light flux from the low-coherent light source into two light fluxes, causes one of the two light fluxes to make a detour by a given optical path length relative to the other light flux, and then recombines the light fluxes into a single light flux and outputs it; and an interference optical system that acquires an interference fringe which carries wave surface information of the glass substrate surface by radiating an outgoing light flux from the low-coherent light source onto a reference surface and the glass substrate surface held on a measurement optical axis and making lights returning from the reference surface and the glass substrate surface interfere with each other, and a step of measuring a concentration distribution of the dopant contained in the glass substrate, wherein processing conditions of the glass substrate surface are set up for each site of the glass substrate based on the results obtained from the step of measuring flatness of the glass substrate and the step of measuring a concentration distribution of the dopant contained in the glass substrate, and the finishing is carried out while keeping an angle formed by a normal line of the glass substrate and an incident beam onto the glass substrate surface at from 30 to 89°.
摘要翻译：本发明提供一种在预抛光期间在玻璃基板表面产生的波纹被去除的方法，从而使玻璃基板整理成具有优异的平面度的表面。本发明涉及使用选自离子束蚀刻，气体簇离子束蚀刻和等离子体蚀刻的任何一种处理方法来完成预抛光的玻璃基板表面的方法，该玻璃基板由石英玻璃制成，该石英玻璃包含掺杂剂并且包括SiO 2作为主要成分，以及用于完成预抛光的玻璃基板表面的方法，包括：使用形状测量单元测量玻璃基板表面的平坦度的步骤，该形状测量单元包括：低相干光源，出射光通量的相干长度短于玻璃基板的前表面和后表面之间的光学距离的两倍; 将来自低相干光源的出射光通量分成两个光束的路径匹配路线部分，使得两个光束中的一个相对于另一光束通过给定光路长度绕行，然后重新组合光通入单个光通量并输出; 以及干涉光学系统，其通过将来自所述低相干光源的出射光束照射到参考面上并且将所述玻璃基板表面保持在测量光轴上而获取携带所述玻璃基板表面的波面信息的干涉条纹，从基准面返回的光和玻璃基板表面相互干涉，测定包含在玻璃基板中的掺杂剂的浓度分布的步骤，对玻璃基板的各个部位设置玻璃基板表面的处理条件基于从测量玻璃基板的平坦度的步骤获得的结果和测量玻璃基板中所含的掺杂剂的浓度分布的步骤，并且在保持由玻璃基板的法线形成的角度的同时进行精加工玻璃基板和入射光束在30至89°的玻璃基板表面上。

27. 发明公开

EP1751325A4 CONTROLLED VAPOR DEPOSITION OF MULTILAYERED COATINGS ADHERED BY AN OXIDE LAYER 审中-公开
标题翻译： THROUGH氧化层的多层镀层的受控气相沉积SHALL
公开(公告)号：EP1751325A4
公开(公告)日：2009-05-13
申请号：EP05755015
申请日：2005-05-24
申请人： APPLIED MICROSTRUCTURES INC
发明人： KOBRIN BORIS , CHINN JEFFREY D , NOWAK ROMUALD , YI RICHARD C
IPC分类号： C23C16/40 , C23C16/00 , C23C16/448 , C23C16/455 , H01L21/316
CPC分类号： C23C16/455 , B05D1/185 , B05D1/60 , B82Y30/00 , B82Y40/00 , C03C17/42 , C03C23/006 , C23C16/402 , C23C16/448
摘要： An improved vapor-phase deposition method and apparatus for the application of multilayered films/coatings on substrates is described. The method is used to deposit multilayered coatings where the thickness of an oxide-based layer in direct contact with a substrate (106) is controlled as a function of the chemical composition of the substrate, whereby a subsequently deposited layer bonds better to the oxide-based layer.

28. 发明公开

EP1831429A4 METHODS AND APPARATUS FOR SEQUENTIALLY ALTERNATING AMONG PLASMA PROCESSES IN ORDER TO OPTIMIZE A SUBSTRATE 审中-公开
标题翻译：用于等离子体的连续变化的方法和设备流程优化衬底
公开(公告)号：EP1831429A4
公开(公告)日：2008-10-22
申请号：EP05854442
申请日：2005-12-16
申请人： LAM RES CORP
发明人： KIERMASZ ADRIAN , PANDHUMSOPORN TAMARAK , COFER ALFRED
IPC分类号： C23F4/00 , C23C14/02 , C23C16/02
CPC分类号： C03C23/006 , C23C4/02 , H01J37/32935 , H01L21/67253
摘要： In plasma processing system, a method for optimizing etching of a substrate is disclosed. The method includes selecting a first plasma process recipe including a first process variable, wherein changing the first process variable by a first amount optimizes a first substrate etch characteristic and aggravates a second substrate etch characteristic. The method also includes selecting second plasma process recipe including a second process variable, wherein changing the second process variable by a second amount aggravates the fist substrate etch characteristic and optimizes the second substrate etch characteristic. The method further includes positioning a substrate on a chuck in a plasma processing chamber; and striking a plasma within the plasma processing chamber. The method also includes alternating between the first plasma recipe and the second plasma recipe, wherein upon completion of the alternating, the first substrate etch characteristic and the second substrate etch characteristic are substantially optimized.

29. 发明公开

EP1831429A2 METHODS AND APPARATUS FOR SEQUENTIALLY ALTERNATING AMONG PLASMA PROCESSES IN ORDER TO OPTIMIZE A SUBSTRATE 审中-公开
标题翻译：用于等离子体的连续变化的方法和设备流程优化衬底
公开(公告)号：EP1831429A2
公开(公告)日：2007-09-12
申请号：EP05854442.0
申请日：2005-12-16
申请人： Lam Research Corporation
发明人： KIERMASZ, Adrian , PANDHUMSOPORN, Tamarak , COFER, Alferd
IPC分类号： C23F1/00
CPC分类号： C03C23/006 , C23C4/02 , H01J37/32935 , H01L21/67253
摘要： In plasma processing system, a method for optimizing etching of a substrate is disclosed. The method includes selecting a first plasma process recipe including a first process variable, wherein changing the first process variable by a first amount optimizes a first substrate etch characteristic and aggravates a second substrate etch characteristic. The method also includes selecting second plasma process recipe including a second process variable, wherein changing the second process variable by a second amount aggravates the fist substrate etch characteristic and optimizes the second substrate etch characteristic. The method further includes positioning a substrate on a chuck in a plasma processing chamber; and striking a plasma within the plasma processing chamber. The method also includes alternating between the first plasma recipe and the second plasma recipe, wherein upon completion of the alternating, the first substrate etch characteristic and the second substrate etch characteristic are substantially optimized.

30. 发明公开

EP1829837A1 Verfahren und Vorrichtung zur Plasmabehandlung von alkali- und erdalkalihaltgen Oberflächen 审中-公开
标题翻译： Verfahren und Vorrichtung zur Plasmabehandlung von碱 - 和erdalkalihaltgenOberflächen
公开(公告)号：EP1829837A1
公开(公告)日：2007-09-05
申请号：EP07004206.4
申请日：2007-03-01
申请人： Schott AG
发明人： Bicker, Matthias , Rohtaar, Uwe , Hormes, Robert , Hanser, Bernd , Lohmeyer, Manfred , Bauer, Stefan
IPC分类号： C03C21/00 , C03C23/00
CPC分类号： C03C21/007 , C03C23/006
摘要： Die Erfindung betrifft ein Verfahren zur Plasmabehandlung von Glasoberflächen, wobei durch eine Plasmabehandlung eines Substrats der Metall-, insbesondere der Alkali-und/oder Erdalkalianteil im oberflächennahen Bereich des Substrates reduziert wird.
摘要翻译：用于玻璃的等离子体表面处理方法包括制备衬底表面，制备工艺气体，点燃等离子体，以及还原衬底中的碱金属和/或碱土金属。工艺气体含有氢和/或氮。在等离子体处理期间，基板表面为50-500，特别是120-400℃。

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