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    • 4. 发明公开
    • METHODS OF FORMING HIGH-DENSITY ARRAYS OF HOLES IN GLASS
    • 格拉斯维尔的VERFAHREN ZUR HERSTELLUNG VON HOCHDICHTEN LOCHANORDNUNGEN
    • EP2646384A2
    • 2013-10-09
    • EP11799537.3
    • 2011-11-30
    • Corning Incorporated
    • BOEK, Heather DebraBURKET, Robert C.HARVEY, Daniel RalphSTRELTSOV, Alexander Mikhailovich
    • C03C15/00C03C23/00
    • C03B33/082B23K26/382B23K26/384B23K26/386B23K26/389B23K26/40B23K26/402B23K2103/50C03C15/00C03C15/02C03C23/0025G02B6/1225G02B6/136
    • A method of fabricating a high-density array of holes in glass is provided, comprising providing a glass piece having a front surface, then irradiating the front surface of the glass piece with a UV laser beam focused to a focal point within +/−100 μm of the front surface of the glass piece most desirably within +/−50 μm of the front surface. The lens focusing the laser has a numerical aperture desirably in the range of from 0.1 to 0.4, more desirably in the range of from 0.1 to 0.15 for glass thickness between 0.3 mm and 0.63 mm, even more desirably in the range of from 0.12 to 0.13, so as to produce open holes extending into the glass piece 100 from the front surface 102 of the glass piece, the holes having an diameter the in range of from 5 to 15 μm, and an aspect ratio of at least 20:1. For thinner glass, in the range of from 0.1-0.3 mm, the numerical aperture is desirably from 0.25 to 0.4, more desirably from 0.25 to 0.3, and the beam is preferably focused to within +/−30 μm of the front surface of the glass. The laser is desirable operated at a repetition rate of about 15 kHz or below. An array of holes thus produced may then be enlarged by etching. The front surface may be polished prior to etching, if desired.
    • 提供一种在玻璃中制造高密度孔阵列的方法,包括提供具有前表面的玻璃片,然后用聚焦在+/- 100内的焦点的UV激光束照射玻璃片的前表面 玻璃片的前表面的μm最理想地在前表面的+/-50μm内。 聚焦激光器的透镜的数值孔径希望在0.1至0.4的范围内,更优选在0.1至0.15的范围内,对于玻璃厚度在0.3mm至0.63mm之间,甚至更优选在0.12至0.13的范围内 ,以便从玻璃片的前表面102产生延伸到玻璃片100中的孔,孔的直径范围为5至15μm,纵横比至少为20:1。 对于较薄的玻璃,在0.1-0.3mm的范围内,数值孔径期望地为0.25至0.4,更期望地为0.25至0.3,并且该光束优选地被聚焦在该光束的前表面的+/-30μm内 玻璃。 期望激光器以约15kHz或更低的重复频率操作。 然后可以通过蚀刻来扩大由此产生的孔阵列。 如果需要,前表面可以在蚀刻之前进行抛光。