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21. 发明授权

EP2045033B1 Procédé de retouche de pièces métalliques 有权
标题翻译：润饰金属零件
公开(公告)号：EP2045033B1
公开(公告)日：2011-02-23
申请号：EP08165849.4
申请日：2008-10-03
申请人： SNECMA
发明人： Causte, Eric, Yves, Roger , Flesch, Thierry, Jean, Emile , Gueguen, Mathieu , Prodent, James
IPC分类号： B23K1/00 , B23K1/005 , B23K1/008 , B23K26/34
CPC分类号： B23K1/0018 , B23K1/0056 , B23K1/008 , B23K26/32 , B23K26/34 , B23K35/007 , B23K35/0244 , B23K35/025 , B23K35/3033 , B23K35/3046 , B23K2201/001 , B23K2203/08 , B23K2203/26

22. 发明公开

EP2140963A1 Pb-free solder-connected electronic article 有权
标题翻译： Blei-freigelöteterelektronischer Artikel
公开(公告)号：EP2140963A1
公开(公告)日：2010-01-06
申请号：EP09013006.3
申请日：1998-12-09
申请人： Renesas Technology Corp.
发明人： Shimokawa, Hanae , Soga, Tasao , Okudaira, Hiroaki , Ishida, Toshiharu , Nakatsuka, Tetsuya , Inaba, Yoshiharu , Nishimura, Asao
IPC分类号： B23K1/20 , B23K35/26 , H05K3/34 , H01L23/50 , C22C13/02
CPC分类号： H05K1/181 , B23K1/0016 , B23K35/004 , B23K35/007 , B23K35/262 , B23K2201/40 , H01L23/488 , H01L23/49811 , H01L23/532 , H01L24/29 , H01L2224/83101 , H01L2924/01322 , H01L2924/15747 , H05K3/3426 , H05K3/3463 , H05K2201/10909 , Y02P70/613 , Y10T29/49144 , Y10T29/49149 , Y10T29/49169 , Y10T428/12708 , Y10T428/12715 , H01L2924/00
摘要： Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn-Ag-Bi alloy solder is applied to an electrode through an Sn-Bi alloy layer. The Sn-Bi alloy, preferably, comprises 1 to 20 wt% Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn-Bi alloy layer thereby obtaining an enough bonding strength.
摘要翻译：提供通过无铅焊料的接合结构和包含接合结构的电子制品。粘合结构相对于时间的变化具有稳定的结合界面，足够的强度和耐发生晶须同时保持焊料的良好润湿性。在接合结构中，通过Sn-Bi合金层向电极施加无铅Sn-Ag-Bi合金焊料。 Sn-Bi合金优选含有1〜20重量％的Bi，以获得良好的焊料润湿性。为了获得本发明中具有较高可靠性的理想的接合特性，在Sn-Bi合金层下方设置有铜层，从而获得足够的接合强度。

23. 发明公开

EP1272018A3 Method of mounting electronic parts with Sn-Zn solder free of Pb 审中-公开
标题翻译：一种用于通过Sn-Zn基焊料的装置安装部件，而不铅方法
公开(公告)号：EP1272018A3
公开(公告)日：2004-09-15
申请号：EP02011952.5
申请日：2002-05-29
申请人： NEC CORPORATION
发明人： Sakai, Hiroshi, c/o NEC Corporation , Suzuki, Motoji, c/o NEC Corporation , Igarashi, Makoto , Tanaka, Akihiro
IPC分类号： H05K3/34
CPC分类号： H05K3/244 , B23K35/007 , B23K35/262 , H05K3/3463
摘要： There is disclosed a method of mounting electronic parts with Sn - Zn solder which is Pb-free solder without a reduction in the bonding strength. A printed circuit board for mounting electronic parts with Pb-free solder comprises a printed circuit board whose surface is treated with Ni/Au, having an interconnection pattern of copper foil, a plated layer of Ni disposed on a surface of the copper foil, and a plated layer of Au disposed on a surface of the plated layer of Ni. The plated layer of Ni on the surface of copper foil serves as a barrier layer which prevents a Cu - Zn reaction layer, which would otherwise tend to reduce the bonding strength, from being produced in the soldered joints, when electronic parts are mounted on the printed circuit board using the Sn - Zn solder.

24. 发明授权

EP0797380B1 Method for enhancing the solderability of a surface 失效
标题翻译：一种用于增加表面的可焊过程
公开(公告)号：EP0797380B1
公开(公告)日：2004-04-28
申请号：EP97301116.6
申请日：1997-02-20
申请人： MACDERMID INCORPORATED
发明人： Ferrier, Donald , Yakobson, Eric
IPC分类号： H05K3/24 , B23K35/00 , C23C18/42
CPC分类号： H05K3/244 , B23K35/001 , B23K35/004 , B23K35/007 , C23C18/42 , H05K2203/073

25. 发明公开

EP1279458A2 Friction stir welding method and component part welded by the method 审中-公开
标题翻译： Drehendes Reibungschweissverfahren und mit diesem Verfahren hergestelltes Element
公开(公告)号：EP1279458A2
公开(公告)日：2003-01-29
申请号：EP02016344.0
申请日：2002-07-25
申请人： Hitachi, Ltd.
发明人： Okamura, Hisanori , Aota, Kinya , Satou, Kouji , Sakamoto, Masahiko
IPC分类号： B23K20/12
CPC分类号： B23K33/00 , B23K20/122 , B23K20/127 , B23K20/128 , B23K20/16 , B23K20/2275 , B23K20/2333 , B23K35/002 , B23K35/004 , B23K35/007 , B23K2203/10 , B23K2203/20 , B23K2203/22 , H01L21/4882
摘要： Disclosed is a friction stir welding method for welding two members (4, 5) to be welded which differ in physical properties and/or mechanical properties by abutting the two members to each other, inserting a pin portion (2) of a rotary tool (1) having the pin portion and a shoulder portion (3) to the abutment surfaces of the two members (4, 5), and moving the rotary tool (1) along the abutment surfaces. The pin portion (2) is inserted to only one of the members (4), the pin portion is not inserted to the other of the members (5) but only the shoulder portion (3) is set in contact with the other of the members, and, while this condition is maintained, the rotary tool (1) is moved. With this method, only the member on the side where the pin is inserted can be made to undergo plastic flow attendant on a friction stir action. The metal in plastic flow is pressed against the opposite member at an elevated temperature and high pressure, whereby diffusion of atoms is caused in the vicinity of the abutment surfaces, and the members are welded.
摘要翻译：公开了一种用于通过将两个构件彼此抵靠而将两个不同的物理特性和/或机械性质的待焊接的两个构件（4,5）进行焊接，将旋转工具的销部分（2） 1）具有销部分和肩部（3）到两个部件（4,5）的邻接表面，并且沿着邻接表面移动旋转工具（1）。销部分（2）仅插入到一个构件（4）中，销部分不插入到另一个构件（5）中，而仅将肩部（3）设置成与另一个并且当维持该状态时，使旋转工具（1）移动。通过这种方法，只有在插入销侧的构件才能在摩擦搅动作用下经受塑性流动。塑料流中的金属在升高的温度和高压下压在相对的构件上，由此在邻接表面附近引起原子的扩散，并且构件被焊接。

26. 发明公开

EP1048392A1 Pb-FREE SOLDER-CONNECTED STRUCTURE AND ELECTRONIC DEVICE 有权
标题翻译： MIT BLEIFREIEMLöTMITTELVERBUNDENE STRUKTUR UND ELEKTRONISCHE VORRICHTUNG
公开(公告)号：EP1048392A1
公开(公告)日：2000-11-02
申请号：EP98959137.5
申请日：1998-12-09
申请人： Hitachi, Ltd.
发明人： SHIMOKAWA, Hanae, Production Engineering Res. Lab. , SOGA, Tasao, Production Engineering Res. Lab. , OKUDAIRA, Hiroaki, Production Engineering Res. Lab , ISHIDA, Toshiharu, Production Engineering Res. Lab , NAKATSUKA, Tetsuya, Production Engineering Res. , INABA, Yoshiharu, Semiconductor & Integr. Circuits , NISHIMURA, Asao, Semiconductor & Integr. Circuits
IPC分类号： B23K35/26 , H05K3/34 , H01L23/50
CPC分类号： H05K1/181 , B23K1/0016 , B23K35/004 , B23K35/007 , B23K35/262 , B23K2201/40 , H01L23/488 , H01L23/49811 , H01L23/532 , H01L24/29 , H01L2224/83101 , H01L2924/01322 , H01L2924/15747 , H05K3/3426 , H05K3/3463 , H05K2201/10909 , Y02P70/613 , Y10T29/49144 , Y10T29/49149 , Y10T29/49169 , Y10T428/12708 , Y10T428/12715 , H01L2924/00
摘要： Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn-Ag-Bi alloy solder is applied to an electrode through an Sn-Bi alloy layer. The Sn-Bi alloy, preferably, comprises 1 to 20 wt% Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn-Bi alloy layer thereby obtaining an enough bonding strength.
摘要翻译：提供通过无铅焊料的接合结构和包含接合结构的电子制品。粘合结构相对于时间的变化具有稳定的结合界面，足够的强度和耐发生晶须同时保持焊料的良好润湿性。在接合结构中，通过Sn-Bi合金层向电极施加无铅Sn-Ag-Bi合金焊料。 Sn-Bi合金优选含有1〜20重量％的Bi，以获得良好的焊料润湿性。为了获得本发明中具有较高可靠性的理想的接合特性，在Sn-Bi合金层下方设置有铜层，从而获得足够的接合强度。

27. 发明授权

EP0576872B1 A new diffusion joining method 失效
标题翻译：扩散焊接工艺
公开(公告)号：EP0576872B1
公开(公告)日：1998-10-21
申请号：EP93109135.9
申请日：1993-06-07
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Hasegawa, Yo , Nagasawa, Masahiro , Tsukamoto, Masahide
IPC分类号： B23K35/00 , B23K20/16 , H05K3/40
CPC分类号： B23K20/16 , B23K35/007 , B23K35/025 , B23K2201/36 , H05K1/095 , H05K3/4069 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461

28. 发明公开

EP0797380A1 Method for enhancing the solderability of a surface 失效
标题翻译： Verfahren zurErhöhungderLötbarkeiteinerOberfläche
公开(公告)号：EP0797380A1
公开(公告)日：1997-09-24
申请号：EP97301116.6
申请日：1997-02-20
申请人： MACDERMID INCORPORATED
发明人： Ferrier, Donald , Yakobson, Eric
IPC分类号： H05K3/24 , B23K35/00 , C23C18/42
CPC分类号： H05K3/244 , B23K35/001 , B23K35/004 , B23K35/007 , C23C18/42 , H05K2203/073
摘要： A process for enhancing the solderability of a surface through the use of immersion silver deposits is disclosed. In the preferred embodiment two immersion deposits are utilized in sequence. A composition for immersion silver plating is also disclosed.
摘要翻译：公开了一种通过使用浸渍银沉积来增强表面的可焊性的方法。在优选实施例中，两个浸没沉积物按顺序使用。还公开了一种用于浸镀银的组合物。

29. 发明公开

EP0751847A1 A METHOD FOR JOINING METALS BY SOLDERING 失效
标题翻译：方法进行焊接，稀有金属CHINESE
公开(公告)号：EP0751847A1
公开(公告)日：1997-01-08
申请号：EP95935480.0
申请日：1995-10-30
申请人： Kivilahti, Jorma
发明人： Kivilahti, Jorma
IPC分类号： B23K1 , B23K35 , H01L21 , H05K3
CPC分类号： H01L25/50 , B23K1/20 , B23K35/007 , B23K35/0244 , B23K35/26 , B23K35/264 , B23K2201/40 , H01L24/29 , H01L24/83 , H01L2224/291 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/293 , H01L2224/8319 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01061 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H05K3/3473 , H01L2924/00 , H01L2924/01083 , H01L2224/13111 , H01L2924/00014
摘要： The invention relates to a method for joining coated metallic conductors and the application of the method to production of very high density microjoints as well as to the fabrication of macrojoints. It is characteristic for the invention that the surfaces to be connected are coated with solder metal or solder alloy layers, one on the top of the other. The mating contact areas are heated for a short period of time over the temperature where the base coatings and the top coatings fuse transiently. It is essential that the base coating and the top coating cannot produce intermetallic compounds with each other and that the contact interface between them is as metallic as possible. This kind of contact can be obtained for example by chemical or electrochemical deposition. Moreover, when the topcoat is capable of protecting the base coating, for example bismuth, the joining can be performed under normal atmosphere and without any flux. The method can be applied equally well either to the manufacturing of high density microjoints or to the joining of relatively large contact areas, which reduces the number of process steps in electronics assembly. A thin polymer film can be placed between the contact pads of components and substrate metallisations containing solder particles which are compatible with the base coatings of the contact areas. When the contact area is heated under external pressure, local microjoints are formed due to the fact that the solder particles and the base coating fuse transiently. Polymer film enhances the formation of the local microjoints, protects the solder joints from external oxygen and moisture. The joining method of the present invention is easy to use. It does not imply the application of flux, and thus the joints need no cleaning. Furthermore, since the method is lead-free, it is environmental-friendly also from that point of view.

30. 发明公开

EP0741116A1 Verfahren zur Herstellung eines thermisch hoch belastbaren Bauteiles 失效
公开(公告)号：EP0741116A1
公开(公告)日：1996-11-06
申请号：EP96201099.7
申请日：1996-04-24
申请人： PLANSEE Aktiengesellschaft
发明人： Kneringer, Günter, Dr. , Plöchl, Laurenz , Rainer, Florian
IPC分类号： C04B37/02 , B23K26/00
CPC分类号： C04B37/026 , B23K26/32 , B23K26/324 , B23K35/007 , B23K2201/34 , B23K2203/08 , B23K2203/12 , B23K2203/18 , B23K2203/26 , B23K2203/50 , B23K2203/52 , C04B2235/6581 , C04B2235/665 , C04B2235/667 , C04B2235/963 , C04B2237/122 , C04B2237/124 , C04B2237/385 , C04B2237/407 , C04B2237/64 , C04B2237/706 , C04B2237/708 , C04B2237/76 , C04B2237/765
摘要： Die Erfindung betrifft ein Verfahren zur Herstellung eines thermisch hoch belastbaren Bauteils, beispielsweise eines Hitzeschildes bei Fusionsreaktoren. Erfindungsgemäß erfolgt die Verbindung der Teile aus hochhitzebeständigem Material, z.B. aus Graphit, mit den metallischen Teilen durch Aufbringen einer metallischen duktilen Zwischenschicht und anschließendes Hochenergiestrahlschweißen.
摘要翻译： Prodn。高度高的部件包括将高耐热材料的一个或多个部分与至少一个金属部件结合。高耐热材料部件在与连接表面接合之前设置有金属延性中间层。使用高能束焊接进行连接。

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