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21. 发明公开

EP3357629A1 SOLDER PASTE FOR REDUCTION GAS, AND METHOD FOR PRODUCING SOLDERED PRODUCT 有权转让
公开(公告)号：EP3357629A1
公开(公告)日：2018-08-08
申请号：EP16851822.3
申请日：2016-09-29
申请人： Origin Electric Company, Limited , Koki Company Limited
发明人： HAYASHI, Yukiko , SHIRAISHI, Arisa , OZAWA, Naoto , SUZUKI, Takayuki , SHIRAI, Takeshi , UCHIDA, Noriyoshi , FURUSAWA, Mitsuyasu
IPC分类号： B23K35/22 , B23K1/00 , B23K3/04 , B23K3/06 , B23K31/02 , B23K35/363 , H05K3/34 , B23K35/26 , C22C13/00
CPC分类号： B23K1/00 , B23K3/04 , B23K3/06 , B23K31/02 , B23K35/22 , B23K35/26 , C22C13/00 , H05K3/34
摘要： The present invention is a solder paste that contains no reducing agents or activators, and a method for producing a soldered product for completing solder joints using the solder paste. This solder paste for a reduction gas is used together with a reducing gas, wherein: the solder paste contains a solder powder, a thixotropic agent that is solid at normal temperature, and a solvent; and contains no reducing agents for removing oxidized films or activators for improving reduction properties.

22. 发明授权

EP2941104B1 GAS-INTAKE-HOLE ARRAY STRUCTURE AND SOLDERING DEVICE 有权
标题翻译：进气孔阵列结构和焊接装置
公开(公告)号：EP2941104B1
公开(公告)日：2017-11-15
申请号：EP13868049.1
申请日：2013-12-20
申请人： SENJU METAL INDUSTRY CO., LTD.
发明人： HIYAMA Tsutomu
IPC分类号： F27D5/00
CPC分类号： B05B1/005 , B23K1/0016 , B23K1/008 , B23K1/012 , B23K3/04 , B23K3/085 , F27B9/02 , F27B9/06 , F27B9/10 , F27D5/0037 , H05K3/3494 , H05K2203/081
摘要： In a gas-intake-port array structure, which enables any temperature fluctuation during conveying time of a printed circuit board, a semiconductor wafer or the like to be reduced and allows the printed circuit board and the like to be very uniformly heated or cooled, a nozzle pattern P2 is arranged to be line symmetry with a nozzle pattern P1 in one upper or lower divided section of a nozzle layout region of the nozzle cover 3 relative to a center portion that is orthogonal to a conveying direction, as shown in FIG. 1 . In order for the arrangement patterns diagonally arranged in the nozzle layout region to become identical, the nozzle pattern P1 is arranged to be line symmetry with the nozzle pattern P2 in the other upper or lower divided section. Intake ports 3b, 3c and 3d each having a predetermined opening width are arranged between two blowing nozzles 2 or more and across a first row thereof and plural other rows having different phases, in order to circulate the gas blown from the blowing nozzles 2. Widths of the intake ports 3b, 3c and 3d are set so that they are gradually become narrower with increasing distance from the center portion.

23. 发明授权

EP2949415B1 HEAT-BONDING DEVICE AND HEAT-BONDED-ARTICLE MANUFACTURING METHOD 有权转让
公开(公告)号：EP2949415B1
公开(公告)日：2017-08-16
申请号：EP14743722.2
申请日：2014-01-09
申请人： Origin Electric Company, Limited
发明人： MATSUDA,Jun , SUZUKI,Takayuki , KURODA,Masami
IPC分类号： B23K1/008 , B23K1/00 , B23K3/04 , H05K3/34 , B23K101/42
CPC分类号： H05K3/3494 , B23K1/0016 , B23K1/008 , B23K3/04 , B23K3/047 , B23K2201/42 , H05K2203/085

24. 发明公开

EP2949415A4 HEAT-BONDING DEVICE AND HEAT-BONDED-ARTICLE MANUFACTURING METHOD 有权转让
标题翻译： WÄRMEBINDUNGSVORRICHTUNGUND VERFAHREN ZUR HERSTELLUNG EINESWÄRMEGEBUNDENENARTIKELS
公开(公告)号：EP2949415A4
公开(公告)日：2016-10-12
申请号：EP14743722
申请日：2014-01-09
申请人： ORIGIN ELECTRIC
发明人： MATSUDA JUN , SUZUKI TAKAYUKI , KURODA MASAMI
IPC分类号： B23K1/008 , B23K1/00 , B23K3/04 , B23K101/42 , H05K3/34
CPC分类号： H05K3/3494 , B23K1/0016 , B23K1/008 , B23K3/04 , B23K3/047 , B23K2201/42 , H05K2203/085

25. 发明公开

EP3057732A1 VORRICHTUNG ZUR VEREINZELTEN APPLIKATION VON VERBINDUNGSMATERIALDEPOTS 无效
标题翻译：设备技术相关材料车厂俱乐部帐篷应用
公开(公告)号：EP3057732A1
公开(公告)日：2016-08-24
申请号：EP14742161.4
申请日：2014-07-03
申请人： Pac Tech - Packaging Technologies GmbH
发明人： AZDASHT, Ghassem
IPC分类号： B23K1/005 , B23K3/06
CPC分类号： B23K1/0056 , B23K1/018 , B23K3/04 , B23K3/0623
摘要： The invention relates to an apparatus (10) for the individual application of deposits of soldering material, in particular solder balls, comprising a feeding device for the individual feeding of the deposits of soldering material from a soldering material reservoir to an application device (33), wherein the feeding device has transporting receptacles formed as through-holes, which can in each case be moved from a receiving position P1, in which a deposit of soldering material is received from the soldering material reservoir, into a transfer position P2, in which the deposit of soldering material is subjected to compressed gas and from which the deposit of soldering material is transferred to the application device, into an application position P3, wherein a removal device (46) for removing a deposit of soldering material from a transporting receptacle arranged in a removal position P4 is arranged downstream of the transfer position in the feeding direction, wherein, for initiating the removing function, the removal device is connected to a detector device, which checks the state of the transporting receptacle in the transfer position.

26. 发明公开

EP3009220A1 Rolle-zu-Rolle-Fertigungsanlage und -verfahren für verkettete kontinuierliche und diskontinuierliche Verarbeitungsprozesse 有权
标题翻译：卷对卷制造系统和方法，用于级联连续和间歇处理操作
公开(公告)号：EP3009220A1
公开(公告)日：2016-04-20
申请号：EP14189335.4
申请日：2014-10-17
申请人： Rehm Thermal Systems GmbH
发明人： Kuhn, Jochen , Oettl, Helmut
IPC分类号： B23K1/00 , B23K1/008 , H05K3/34
CPC分类号： B23K3/06 , B23K1/0016 , B23K1/008 , B23K3/04 , B23K2201/42 , H05K3/22 , H05K3/3494 , H05K2203/043 , H05K2203/1545 , H05K2203/163
摘要： Die vorliegende Erfindung betrifft eine Endlosfertigungsanlage (100) insbesondere eine Rolle-zu-Rolle-Endlosfertigungsanlage zum Verarbeiten eines bandförmigen Substrats (101). Die Endlosfertigungsanlage umfasst eine erste Antriebseinrichtung zum Bewegen des bandförmigen Substrats in einer Transportrichtung (x) und mindestens zwei Prozesszonen (110,120, 130), durch die das bandförmige Substrat läuft, so dass unterschiedliche Bereiche des bandförmigen Substrats gleichzeitig bearbeitet werden können, wobei die mindestens zwei Prozesszonen folgendes umfassen: eine erste Prozesszone (110,120) für einen diskontinuierlichen Prozess und eine zweite Prozesszone (130) für einen kontinuierlichen Prozess, wobei der kontinuierliche Prozess mit einer Reflow-Lötprozessanordnung durchgeführt wird. Die Reflow-Lötprozessanordnung (130) umfasst mindestens eine Wärmequelle (W) und eine zweite Antriebseinrichtung zum Bewegen der Wärmequelle relativ zu der ersten Prozesszone entlang des bandförmigen Substrats. Die zweite Antriebseinrichtung ist dafür ausgelegt, die Wärmequelle (W) relativ zu der ersten Prozesszone (110,120) entlang des bandförmigen Substrats (101) entgegen der Transportrichtung (X) des bandförmigen Substrats (101) zu bewegen, selbst wenn die erste Antriebseinrichtung stillsteht.
摘要翻译：的连续制造装置（100），用于处理的带状基片（101）。第一驱动移动基板在传输（X）的方向，并穿过处理区（110，120,130），所以没有在基板的不同区域被同时处理。的处理区包括用于不连续的处理的第一处理区（110，120）和用于连续处理的第二处理区（130）。的连续方法是回流焊接工艺。回流焊接工艺（130）包括热（W）的源极和相对热的源移动到沿所述基板第一工艺区的第二驱动器。第二驱动热（W）相对于源移动到沿相对的基板（101）的传输（X）的方向上的基片（101）与第一过程区域（110，120），即使第一驱动器是站着不动。

27. 发明公开

EP2941104A1 GAS-INTAKE-HOLE ARRAY STRUCTURE AND SOLDERING DEVICE 有权
标题翻译： GASEINLASSLOCH-ARRAYSTRUKTUR UNDLÖTVORRICHTUNG
公开(公告)号：EP2941104A1
公开(公告)日：2015-11-04
申请号：EP13868049.1
申请日：2013-12-20
申请人： SENJU METAL INDUSTRY CO., LTD.
发明人： HIYAMA Tsutomu
IPC分类号： H05K3/34 , B23K1/008 , B23K3/04 , B23K101/40 , B23K101/42
CPC分类号： B05B1/005 , B23K1/0016 , B23K1/008 , B23K1/012 , B23K3/04 , B23K3/085 , F27B9/02 , F27B9/06 , F27B9/10 , F27D5/0037 , H05K3/3494 , H05K2203/081
摘要： In a gas-intake-port array structure, which enables any temperature fluctuation during conveying time of a printed circuit board, a semiconductor wafer or the like to be reduced and allows the printed circuit board and the like to be very uniformly heated or cooled, a nozzle pattern P2 is arranged to be line symmetry with a nozzle pattern P1 in one upper or lower divided section of a nozzle layout region of the nozzle cover 3 relative to a center portion that is orthogonal to a conveying direction, as shown in FIG. 1 . In order for the arrangement patterns diagonally arranged in the nozzle layout region to become identical, the nozzle pattern P1 is arranged to be line symmetry with the nozzle pattern P2 in the other upper or lower divided section. Intake ports 3b, 3c and 3d each having a predetermined opening width are arranged between two blowing nozzles 2 or more and across a first row thereof and plural other rows having different phases, in order to circulate the gas blown from the blowing nozzles 2. Widths of the intake ports 3b, 3c and 3d are set so that they are gradually become narrower with increasing distance from the center portion.
摘要翻译：在能够减少印刷电路板，半导体晶片等的传送时间期间的任何温度波动并允许印刷电路板等被非常均匀地加热或冷却的气体进气口阵列结构中，如图3所示，喷嘴图案P2被布置成与喷嘴盖3的喷嘴布局区域的一个上部或下部分割部分中的喷嘴图案P1相对于与输送方向正交的中心部分线性对称。 1。为了使喷嘴布局区域中对角布置的布置图案变得相同，喷嘴图案P1布置成与另一个上部或下部分割部分中的喷嘴图案P2线性对称。每个具有预定开口宽度的进气口3b，3c和3d布置在两个吹气喷嘴2之间，并且跨越其第一排和多个具有不同相位的其它行，以便使从吹风喷嘴2吹出的气体循环。宽度进气口3b，3c和3d设置成随着距离中心部分的距离的增加而逐渐变窄。

28. 发明公开

EP2842682A1 SOLDERING APPARATUS AND METHOD FOR MANUFACTURING SOLDERED PRODUCT 有权转让
标题翻译： LÖTVORRICHTUNGUND VERFAHREN ZUR HERSTELLUNG EINESGELÖTETENPRODUKTS
公开(公告)号：EP2842682A1
公开(公告)日：2015-03-04
申请号：EP13782231.8
申请日：2013-04-24
申请人： Origin Electric Company, Limited
发明人： KURODA, Masami , MATSUDA, Jun , SUZUKI, Takayuki
IPC分类号： B23K1/008 , B23K1/00 , B23K1/005 , B23K3/04 , B23K31/02 , H05K3/34 , B23K101/42
CPC分类号： B23K3/085 , B23K1/0016 , B23K1/005 , B23K1/008 , B23K3/04 , B23K3/047 , B23K2201/42 , H05K3/3494 , H05K2203/1121 , H05K2203/167
摘要： An excellent soldering apparatus and manufacturing method of soldered product are provided where a workpiece can be efficiently soldered in a short cycle time. The soldering apparatus includes a thermal radiation heater and two coolers for cooling the workpiece which sandwich the heater therebetween. The coolers are movable between a standby position and a cooling position and form a recessed portion in which the heater is placed. The coolers move to the standby position where the coolers are separated from the workpiece and stand by such that the heater is in a state of protruding from the recessed portion while the heater heats the workpiece. The coolers can move from the standby position to the cooling position to cool the workpiece.
摘要翻译：提供了一种优良的焊接装置和焊接产品的制造方法，其中可以在短的周期内有效地焊接工件。焊接装置包括热辐射加热器和用于冷却工件的两个冷却器，其将加热器夹在其间。冷却器可在备用位置和冷却位置之间移动并形成其中放置加热器的凹入部分。冷却器移动到待机位置，在该位置，冷却器与工件分离并且待机，使得加热器处于从凹部突出的状态，同时加热器加热工件。冷却器可以从待机位置移动到冷却位置，以冷却工件。

29. 发明公开

EP2800462A1 HEAT PROCESSING DEVICE 有权
标题翻译：热处理装置
公开(公告)号：EP2800462A1
公开(公告)日：2014-11-05
申请号：EP12862549.8
申请日：2012-12-25
申请人： Yokota Technica Limited Company
发明人： YOKOTA, Yatsuharu
IPC分类号： H05K3/34 , B23K1/008 , H05K13/02 , B23K101/42
CPC分类号： B23K3/04 , B23K1/0016 , B23K1/008 , B23K1/012 , B23K3/087 , B23K2201/42 , H05K3/3494
摘要： A reflow furnace (1) has a decompression chamber (5), and air bubbles contained in a molten solder on a substrate (7) are removed in this decompression chamber (5). The substrate (7) supported on a first conveying rail (8) is fed into the decompression chamber (5) by a first conveyance rod (18). The substrate (7) in the decompression chamber (5) is taken out by a second conveyance rod (32) and is conveyed to the exit of the reflow furnace (1) while being supported on the second conveying rail (9). Before the treatment of substrates (7) having different widths, the width of the first conveying rail (8) and the width of the second conveying rail (9) are adjusted. During this adjustment, the second conveyance rod (32) is displaced in the width direction of the substrate (7), with the second conveyance rod (32) kept in the decompression chamber (5), and in association with this, the spacing between right and left rail portions (12a, 12a) in the decompression chamber (5) is adjusted.

30. 发明公开

EP1902807A1 Lötverfahren und Vorrichtung zum Dampfphasenlöten mit einer gesteuerten Dampfphasen-Material-Aufbringvorrichtung 审中-公开
标题翻译：焊接方法和用于汽相焊接装置具有受控的气相材料施加
公开(公告)号：EP1902807A1
公开(公告)日：2008-03-26
申请号：EP06020522.6
申请日：2006-09-29
申请人： Linde Aktiengesellschaft
发明人： Wandke, Ernst, Dr.
IPC分类号： B23K1/015 , B23K1/00 , B23K3/04 , H05K3/34 , B23K101/42
CPC分类号： H05K3/3494 , B23K1/0016 , B23K1/015 , B23K3/04 , B23K2201/42 , H05K2203/075 , H05K2203/088
摘要： Die Erfindung betrifft ein Verfahren zum Dampfphasenlöten mit einer Vorwärm- und einer Lötphase, wobei in der Vorwärm- und/oder Lötphase ein Dampfphasenmaterial als Dampf oder als Dampf-Gas-Gemisch auf eine Leiterplatte (1) oder auf andere zu Iötende Baugruppen gesteuert aufgebracht wird. Desweiteren betrifft die Erfindung eine Vorrichtung zum Dampfphasenlöten mit einer Vorwärm- und einer Lötzone, wobei eine Aufbrmngvorrichtung (2a,2b,2c) zum gesteuerten Aufbringen eines Dampfphasen-Materials auf eine Leiterplatte (1) oder auf andere zu lötende Baugruppen vorgesehen ist.
摘要翻译：在预热和/或钎焊，材料在蒸气相中，与气体任意混合，被施加到印刷电路板（1）或到其它组件，以进行焊接。所用的汽相，含有烃和/或气体。惰性气体，氢气，CF4和化学性质活泼的气体，E.G.：合适的气体选自还原性气体。间隔，位置和应用的数量来控制（4）。应用单元，特别是喷嘴或喷嘴阵列（2A，2B，2C），用于控制的应用程序。气相材料被施加到电路板的bothsides，或者被焊接其他组件。该设备包括控制器确定性采矿间隔，数量和应用程序的位置。喷射器被使用。气相焊接设备被设置在板或组件的每一侧进行焊接。独立claimsoft包括相应的设备。

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