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21. 发明公开

EP1806792A3 Semiconductor light emitting device and manufacturing method thereof 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：EP1806792A3
公开(公告)日：2010-05-19
申请号：EP06256575.9
申请日：2006-12-22
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Taguchi, Yuichi , Sakaguchi, Hideaki , Koizumi, Naoyuki , Higashi, Mitsutoshi , Shiraishi, Akinori , Sunohara, Masahiro , Murayama, Kei
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L2224/16225 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： A light emitting device is disclosed. The light emitting device includes a light emitting element (15), and a light emitting element container (11) having a concave section (20) for containing the light emitting element (15). The concave section (20) includes a side surface (20A) and a bottom surface (20B) almost orthogonal to the side surface (20A). The light emitting device further includes a conductive paste layer (17) formed of a conductive paste in which metal particles are dispersed in a solution, and the conductive paste layer (17) includes a slanting surface (17A) on the side surface (20A) and the bottom surface (20B).
摘要翻译：公开了一种发光器件。该发光装置包括发光元件（15）和具有用于容纳发光元件（15）的凹部（20）的发光元件容器（11）。凹部（20）具有与侧面（20A）大致正交的侧面（20A）和底面（20B）。发光装置还包括导电浆料层（17），该导电浆料层（17）由其中金属颗粒分散在溶液中的导电浆料形成，并且导电浆料层（17）在侧表面（20A）上包括倾斜表面（17A）和底面（20B）。

22. 发明公开

EP1744362A3 Semiconductor device and electronic apparatus 有权转让
标题翻译：半导体装置及电子设备
公开(公告)号：EP1744362A3
公开(公告)日：2010-01-20
申请号：EP06014470.6
申请日：2006-07-12
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Murayama, Kei , Higashi, Mitsutoshi
IPC分类号： H01L23/498 , H01L25/065 , H05K1/14 , H01L21/56
CPC分类号： H01L23/49811 , H01L21/4853 , H01L21/563 , H01L23/49838 , H01L24/17 , H01L25/0655 , H01L2224/0401 , H01L2224/05166 , H01L2224/05582 , H01L2224/05644 , H01L2224/05666 , H01L2224/13099 , H01L2224/16225 , H01L2224/16237 , H01L2224/16238 , H01L2224/17106 , H01L2224/17181 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/1433 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/15321 , H01L2924/157 , H01L2924/19107 , H01L2924/00 , H01L2924/00014
摘要： External connection terminals (27) which are electrically connected to semiconductor chips (11-1,11-2,12-1,12-2) and also protrude beyond the semiconductor chips (11-1,11-2,12-1,12-2) are disposed on a substrate (13) on the side to which the plural semiconductor chips (11-1,11-2,12-1,12-2) are connected.

23. 发明公开

EP2045840A2 Wiring board with guard ring 有权转让
标题翻译： Leiterplatte mit Schutzring
公开(公告)号：EP2045840A2
公开(公告)日：2009-04-08
申请号：EP08165654.8
申请日：2008-10-01
申请人： Shinko Electric Industries Co., Ltd. , Toko, Inc.
发明人： Murayama, Kei , Nakajima, Shinji
IPC分类号： H01L23/58 , H01L23/62
CPC分类号： H01L23/585 , H01L23/481 , H01L23/60 , H01L23/62 , H01L25/16 , H01L2224/16225 , H01L2225/06527
摘要： There is provided a wiring board 10. The wiring board 10 includes: a semiconductor substrate 17 having a through hole 32 and covered with an insulating film 18; a through electrode 21 formed in the through hole 32; a first wiring 26 connected to one end of the through electrode 21; and a second wiring 28 connected to the other end of the through electrode 21. The semiconductor substrate 17 includes: a semiconductor element and a first guard ring 24 formed to surround the through hole 32. The semiconductor clement includes a first conductivity-type impurity diffusion layer 35 having a different conductivity-type from that of the semiconductor substrate and is electrically connected to the first wiring 26 and the second wiring 28.
摘要翻译：布线板10包括：具有通孔32并被绝缘膜18覆盖的半导体基板17; 形成在通孔32中的贯通电极21; 连接到贯通电极21的一端的第一布线26; 以及连接到通孔21的另一端的第二布线28.半导体衬底17包括：半导体元件和形成为围绕通孔32的第一保护环24.半导体元件包括第一导电型杂质扩散层35具有与半导体衬底不同的导电类型，并且电连接到第一布线26和第二布线28。

24. 发明公开

EP2025415A1 Spherical body sorter and spherical body sorting apparatus using the same, and spherical body sorting method 审中-公开
标题翻译：分拣机和分拣机球状体和方法排序球体
公开(公告)号：EP2025415A1
公开(公告)日：2009-02-18
申请号：EP08161684.9
申请日：2008-08-01
申请人： Shinko Electric Industries Co., Ltd.
发明人： Murayama, Kei
IPC分类号： B07B13/04
CPC分类号： B07B13/04 , B07B13/003
摘要： A spherical-body sorter 10 for sorting spherical bodies B having a predetermined diameter dimension is made by openingmultiple concave parts 14 in the side of one surface of a plate-shaped body 12 made of single-crystal silicon. Each of the concave parts formed in the spherical-body sorter is formed in the same shape and dimension.
摘要翻译：用于分拣乙具有预定直径尺寸的球体的球体分类器10是通过在由单晶硅制成的板形主体12的一个表面侧开口的多个凹部14制成。在球面体分拣机所形成的凹部中的每一个在相同的形状和尺寸形成。

25. 发明公开

EP1868245A2 Semiconductor device and method of manufacturing semiconductor device 有权
公开(公告)号：EP1868245A2
公开(公告)日：2007-12-19
申请号：EP07011906.0
申请日：2007-06-18
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Murayama, Kei , Higashi, Mitsutoshi , Koizumi, Naoyuki , Taguchi, Yuichi , Shiraishi, Akinori , Sunohara, Masahiro
IPC分类号： H01L25/16 , H01L23/14 , H01L23/492
CPC分类号： H01L25/167 , H01L23/147 , H01L23/4926 , H01L23/62 , H01L24/48 , H01L25/16 , H01L2224/32145 , H01L2224/48137 , H01L2224/4823 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12035 , H01L2924/12041 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In a semiconductor device (100), a light emitting element (120) has been mounted on an upper plane of a semiconductor substrate (102). In an impurity diffusion region of the semiconductor substrate (102), a P conducting type of a layer (104), and an N layer (106) have been formed, while an N conducting type impurity is implanted to the P layer (104), and then the implanted impurity is diffused to constitute the N layer (106). A zener diode (108) made of a semiconductor device has been formed by the P layer (104) and the N layer (106).

26. 发明公开

EP1816687A2 Semiconductor device and method of manufacturing semiconductor device 审中-公开
标题翻译：半导体器件和制造半导体器件的方法
公开(公告)号：EP1816687A2
公开(公告)日：2007-08-08
申请号：EP07002224.9
申请日：2007-02-01
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Shiraishi, Akinori , Taguchi, Yuichi , Sunohara, Masahiro , Sakaguchi, Hideaki , Koizumi, Naoyuki , Murayama, Kei , Higashi, Mitsutoshi
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , H01L24/97 , H01L33/44 , H01L33/507 , H01L33/60 , H01L2224/13 , H01L2224/48091 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： In a semiconductor device 100, a light emitting device 102 is mounted on a substrate 101. A light reflection preventing film 130 for preventing a reflection of a light is formed on an upper surface of the light emitting device 102. Moreover, a plate-shaped cover 103 formed of a glass having a light transparency is disposed above the light emitting device 102, and a light reflection preventing film 140 for preventing a reflection of a light is also formed on an upper surface of the cover 103.
摘要翻译：在半导体装置100中，发光装置102安装在基板101上。用于防止光反射的光反射防止膜130形成在发光装置102的上表面上。此外，板状由具有透光性的玻璃构成的罩103配置在发光装置102的上方，在罩103的上表面也形成有用于防止光的反射的光反射防止膜140。

27. 发明公开

EP1814165A1 Semiconductor device and method of manufacturing semiconductor device 审中-公开
标题翻译： Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
公开(公告)号：EP1814165A1
公开(公告)日：2007-08-01
申请号：EP07001975.7
申请日：2007-01-30
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Shiraishi, Akinori , Koizumi, Naoyuki , Murayama, Kei , Sakaguchi, Hideaki , Sunohara, Masahiro , Taguchi, Yuichi , Higashi, Mitsutoshi
IPC分类号： H01L33/00 , H01L25/075
CPC分类号： H01L25/0753 , F21K9/00 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device 10 has such a structure that a plurality of through electrodes 30 is formed on a substrate 20 and each of terminals of light emitting devices (LEDs) 40 is electrically connected to each of the through electrodes 30 via a bump 50 on a lower surface side. In the semiconductor device 10, moreover, a partition wall 80 for surrounding a mounting region of each of the light emitting devices 40 is formed on the substrate 20. The partition wall 80 is formed by laminating a metal film (Cu) using a thin film forming method such as a plating method. Furthermore, the partition wall 80 is formed to be opposed close to each of side surfaces of the light emitting devices 40 and is provided to surround each of the light emitting devices 4
摘要翻译：半导体器件10具有在基板20上形成多个贯通电极30的结构，并且发光器件（LED）40的每个端子经由下部的凸块50电连接到每个贯通电极30 表面。此外，在半导体装置10中，在基板20上形成有围绕各发光元件40的安装区域的分隔壁80.分隔壁80是利用薄膜电镀法等成型方法。此外，分隔壁80形成为与发光装置40的每个侧表面相对，并且设置成围绕每个发光装置4

28. 发明公开

EP1813571A2 Sealed structure and method of fabricating the sealed structure 审中-公开
标题翻译： Dichtungsstruktur und Verfahren zur Herstellung einer Dichtungsstruktur
公开(公告)号：EP1813571A2
公开(公告)日：2007-08-01
申请号：EP07001893.2
申请日：2007-01-29
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Shiraishi, Akinori , Koizumi, Naoyuki , Murayama, Kei , Sakaguchi, Hideaki , Sunohara, Masahiro , Taguchi, Yuichi , Higashi, Mitsutoshi
IPC分类号： B81B7/00
CPC分类号： B81B7/0067 , H01L24/97 , H01L2224/16225
摘要： According to a sealed structure 60 constituted by anodically bonding a silicon board 20 and a glass plate 40, an upper opening of a recessed portion 22 is sealed in an airtight state by the glass plate 40 by bonding an upper face of a wall portion 26 to the glass plate 40. A voltage applying pattern 70 is formed to surround a light transmitting region to which an optical conversion element 24 is opposed. Further, the voltage applying pattern 70 functions as a cathode pattern applied with a voltage by being brought into contact with a lower face of the cathode plate 50.
摘要翻译：根据通过阳极接合硅板20和玻璃板40构成的密封结构60，通过将壁部26的上表面粘合到玻璃板40的密封状态，将凹部22的上部开口密封在气密状态玻璃板40.形成电压施加图案70以包围光转换元件24相对的光透射区域。此外，电压施加图案70通过与阴极板50的下表面接触而用作施加电压的阴极图案。

29. 发明公开

EP1458021A2 Semiconductor device fabrication method 审中-公开
标题翻译：半导体器件制造方法
公开(公告)号：EP1458021A2
公开(公告)日：2004-09-15
申请号：EP04251084.2
申请日：2004-02-26
申请人： Shinko Electric Industries Co., Ltd.
发明人： Sunohara, Masahiro , Murayama, Kei
IPC分类号： H01L21/784 , H01L21/68
CPC分类号： H01L21/6835 , H01L21/67092 , H01L21/67132 , H01L21/6836 , H01L21/78 , H01L2221/68322 , H01L2221/68327 , H01L2221/68331
摘要： A semiconductor device fabrication method for reliably separating diced semiconductor chips (15) from a dicing tape (10) without damaging the diced semiconductor chip. The method includes the steps of: attaching a wafer (11) on a dicing tape; dicing the wafer., thereby forming divided semiconductor chips; and separating the semiconductor chips from the dicing tape, wherein the step of separating includes the steps of: providing a hollow sheet (16A, 16B, 16C) having at least one aperture (18) corresponding to the semiconductor chips between the semiconductor chips attached on the dicing tape and a porous plate (21) coupled to a vacuum source (23); sucking the semiconductor chips to the porous plate via the hollow sheet by driving the vacuum source; and separating the dicing tape from the semiconductor chips under a condition where the semiconductor chips are being sucked to the porous plate.
摘要翻译：一种半导体器件制造方法，用于可靠地从切割带（10）分离切割的半导体芯片（15）而不损坏切割的半导体芯片。该方法包括以下步骤：将晶片（11）附着在切割带上; 切割晶片，由此形成分割的半导体芯片; 以及从所述切割带分离所述半导体芯片，其中所述分离步骤包括以下步骤：提供具有对应于所述半导体芯片之间的至少一个孔（18）的中空片（16A，16B，16C）切割带和耦合到真空源（23）的多孔板（21）; 通过驱动真空源经由中空片将半导体芯片吸引到多孔板; 以及在半导体芯片被吸附到多孔板的情况下将切割带与半导体芯片分离。

30. 发明公开

EP1378932A2 Semiconductor chip mounting apparatus and mounting method 有权
标题翻译： Apparat zur Befestigung von Halbleiterchips und eine Methode zur Befestigung
公开(公告)号：EP1378932A2
公开(公告)日：2004-01-07
申请号：EP03014236.8
申请日：2003-06-25
申请人： SHINKO ELECTRIC INDUSTRIES CO. LTD.
发明人： Murayama, Kei
IPC分类号： H01L21/00
CPC分类号： H01L24/81 , H01L23/544 , H01L24/75 , H01L2223/54473 , H01L2224/13111 , H01L2224/16 , H01L2224/75 , H01L2224/75743 , H01L2224/81136 , H01L2224/81801 , H01L2924/00014 , H01L2924/01006 , H01L2924/0102 , H01L2924/01033 , H01L2924/01041 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/15787 , H01L2924/3025 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor chip mounting apparatus able to raise the positional accuracy when mounting a semiconductor chip on a package including a stage on which the substrate is carried, a visible light source for directly illuminating the substrate from above the stage, a semiconductor chip conveying means for holding from one surface the semiconductor chip comprised of silicon formed to a thickness through which visible light can pass and conveying it on the substrate carried on the stage, a capturing means arranged at a position facing the stage and capturing visible light passing through the semiconductor chip held by the semiconductor chip conveying means so as to capture patterns formed on the substrate carried on the stage and the semiconductor chip, and a positioning means for positioning the semiconductor chip on the substrate based on the patterns of the substrate and the semiconductor chip captured by the capturing means.
摘要翻译：一种半导体芯片安装装置，其能够提高将半导体芯片安装在包含载置基板的载物台的包装上时的位置精度，用于从舞台上方直接照射基板的可见光源，由一个表面形成的硅形成的半导体芯片形成为可见光可以通过的厚度，并将其传送到载置在载物台上的基板上;捕获装置，布置在面向载物台的位置并捕获通过半导体芯片保持的可见光通过半导体芯片传送装置捕获形成在载物台和半导体芯片上的基板上的图案，以及基于由基板和半导体芯片捕获的半导体芯片的图案将半导体芯片定位在基板上的定位装置捕获手段。

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