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    • 22. 发明公开
    • POLISHING PADS AND SYSTEMS AND METHODS OF MAKING AND USING THE SAME
    • 抛光垫上,的系统和方法生产及其用途
    • EP3126093A1
    • 2017-02-08
    • EP15716349.4
    • 2015-03-31
    • 3M Innovative Properties Company
    • LEHUU, Duy K.MEYER, Kenneth A.P.DAVID, Moses M.
    • B24B37/26B24B37/22B24B37/24B24B7/22
    • B24B37/26B24B7/228B24B37/22B24B37/245
    • The present disclosure relates to polishing pads which include a polishing layer, wherein the polishing layer includes a working surface and a second surface opposite the working surface. The working surface includes at least one of a plurality of precisely shaped pores and a plurality of precisely shaped asperities. The present disclosure further relates to a polishing system, the polishing system includes the preceding polishing pad and a polishing solution. The present disclosure relates to a method of polishing a substrate, the method of polishing including: providing a polishing pad according to any one of the previous polishing pads; providing a substrate, contacting the working surface of the polishing pad with the substrate surface, moving the polishing pad and the substrate relative to one another while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is conducted in the presence of a polishing solution.
    • 本公开内容涉及抛光垫其中包括一个抛光层,worin抛光层包括工作表面和工作表面相对的第二表面。 工作表面包括精确成形的孔的多个部分并加以精确成形的凹凸的多个的至少一个。 本公开还涉及一种抛光系统,研磨系统包括preceding-抛光垫和抛光液。 本发明涉及一种抛光衬底的方法,抛光的方法,包括:提供抛光垫gemäß到先前抛光垫中的任何一个; 提供一基底,接触与基板表面的抛光垫的工作表面,移动所述抛光垫和相对于一个基片另一个,同时保持所述抛光垫的工作表面和基片表面之间的接触,worin抛光在传导 的研磨液的存在。
    • 30. 发明公开
    • APPARATUS AND METHOD FOR PLASMA TREATMENT OF CONTAINERS
    • VORRICHTUNG UND VERFAHREN ZUR PLASMABEHANDLUNG VONBEHÄLTERN
    • EP2427902A1
    • 2012-03-14
    • EP10719867.3
    • 2010-05-06
    • 3M Innovative Properties Company
    • HANSON, Daniel R.DAVID, Moses M.WHITE, David J.KELLY, Jean A.ALBAND, Todd D.
    • H01J37/32B05D7/22C23C16/04
    • H01J37/32394A61M15/009A61M2205/0238B05D1/62B05D3/142B05D5/083B05D7/227B05D2202/25C23C16/045C23C16/45578H01J37/32366H01J37/3244
    • An apparatus (9) for plasma treating multiple containers. The apparatus includes a manifold (2) comprising at least a first chamber with multiple outlet openings and multiple hollow, electrically-conductive nozzles (10) for at least one of delivering or exhausting plasma-generating gas. The multiple hollow, electrically-conductive nozzles are connected to the multiple outlet openings and protrude from the manifold. A method of plasma treating multiple containers is also disclosed. The method includes providing a reactor system comprising an apparatus disclosed herein, inserting the multiple hollow, electrically-conductive nozzles into the multiple containers (30), evacuating the multiple containers, grounding the multiple hollow, electrically-conductive nozzles while applying radio frequency power to the multiple containers, providing a gas inside the containers, and generating a plasma. At least one of evacuating or providing the gas is carried out through the hollow, electrically-conductive nozzles.
    • 一种用于等离子体处理多个容器的装置(9)。 该装置包括歧管(2),其包括具有多个出口开口的至少第一室和用于输送或排出等离子体产生气体的至少一个的多个中空的导电喷嘴(10)。 多个中空的导电喷嘴连接到多个出口开口并从歧管突出。 还公开了一种等离子体处理多个容器的方法。 该方法包括提供包括本文公开的装置的反应器系统,将多个中空的导电喷嘴插入多个容器(30)中,抽空多个容器,将多个中空的导电喷嘴接地,同时施加射频功率 多个容器,在容器内提供气体,并产生等离子体。 抽空或提供气体中的至少一个通过中空的导电喷嘴进行。