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    • 13. 发明公开
    • LED display packaging with substrate removal and method of fabrication
    • Packung einer Leuchtdiodenanzeige mit Substratentfernung und Herstellungsverfahren
    • EP0785580A2
    • 1997-07-23
    • EP97100788.5
    • 1997-01-20
    • MOTOROLA, INC.
    • Holm, Paige M.Shieh, Chan-LongMoyer, Curtis D.
    • H01L27/15
    • H01L25/167G09F9/3026H01L25/162H01L27/156H01L33/0079H01L2924/0002H01L2924/00
    • A LED display package (60) and method of fabricating including a LED array display chip (10) having connection pads (16) positioned about the perimeter of the LED chip (10), a separate driver chip (20) having connection pads (28) routed to an uppermost surface, positioned to cooperatively engage those of the LED chip (10) when properly registered and interconnected using wafer level processing technology. The LED chip (10) being flip chip mounted to the driver chip (20) and having a layer of interchip bonding dielectric (52) positioned between the space defined by the LED chip (10) and the driver chip (20). The display package (60) subsequently having removed the substrate (12) onto which the LED array (14) was initially formed, thereby exposing the connection pads (16) of the LED chip (10) and a remaining indium-gallium-aluminum-phosphide (InGaAlP) epilayer (54). The light emitted from the LED chip (10), being emitted through the remaining indium-gallium-aluminum-phosphide (InGaAlP) epilayer (54) of the LED chip (10).
    • 一种LED显示封装(60)及其制造方法,包括:LED阵列显示芯片(10),其具有围绕所述LED芯片(10)周边定位的连接焊盘(16);具有连接焊盘(28)的单独的驱动器芯片 )布置到最上表面,定位成当使用晶片级处理技术适当地配准和互连时协作地接合LED芯片(10)的那些。 LED芯片(10)被倒装安装到驱动器芯片(20)上并且具有位于由LED芯片(10)和驱动器芯片(20)限定的空间之间的芯片间接合电介质层(52)。 显示封装(60)随后已经移除了初始形成LED阵列(14)的衬底(12),从而暴露了LED芯片(10)的连接焊盘(16)和剩余的铟 - 镓 - 铝 - 磷化物(InGaAlP)外延层(54)。 从LED芯片(10)发射的光通过LED芯片(10)的剩余的铟 - 镓 - 铝 - 磷化物(InGaAlP)外延层(54)发射。
    • 16. 发明公开
    • Environmental sensor
    • 传感器zur Erfassung von Umgebungsbedingungen
    • EP0789236A1
    • 1997-08-13
    • EP96101744.9
    • 1996-02-07
    • MOTOROLA, INC.
    • Ackley, Donald E.Krihak, MichaelShieh, Chan-Long
    • G01N21/77
    • G01N21/7703
    • A sensor (10,30,40,50,70) for detecting chemicals and changes in the surrounding environment utilizes a sol-gel sensor element (14,16,17,54,56,57) containing a chemical indicator. Grooves (12,13,24,52,53) are formed in a substrate (11,51). The grooves are filled with a sol-gel material having a chemical indicator, and the sol-gel is cured to adhere to the substrate (11,51). The grooves (12,13,24,52,53) are formed to facilitate optically coupling a fiber optic cable (46) to the sol-gel sensor element. Light is coupled from the fiber optic cable (46) to the sol-gel sensor element (14,16,17,54,56,57).
    • 用于检测化学物质和周围环境变化的传感器(10,30,40,50,70)利用含有化学指示剂的溶胶 - 凝胶传感器元件(14,16,17,54,56,57)。 沟槽(12,13,24,52,53)形成在衬底(11,51)中。 用具有化学指示剂的溶胶 - 凝胶材料填充凹槽,并且溶胶 - 凝胶固化以粘附到基底(11,51)上。 凹槽(12,13,24,52,53)被形成为便于将光纤电缆(46)光学耦合到溶胶 - 凝胶传感器元件。 光从光纤电缆(46)耦合到溶胶 - 凝胶传感器元件(14,16,17,54,56,57)。
    • 18. 发明公开
    • Microactivity LED with photon recycling
    • 与光子回收的微活动LED
    • EP0772248A3
    • 1997-07-02
    • EP96116891.1
    • 1996-10-21
    • MOTOROLA, INC.
    • Ackley, Donald E.Shieh, Chan-LongLebby, Michael S.
    • H01L33/00
    • H01L33/105H01L33/405H01L33/465
    • A microcavity LED (10) with photon recycling including a substrate (12) having at least one layer (14) of material positioned thereon, and a first cladding layer (18), a second cladding layer (22) and an active region (16) sandwiched therebetween forming a mesa (24) on the layer (14) of material. The mesa (24) has generally vertical sides (28) and an upper surface (26) with an electrically conductive and light reflective system (32) positioned on the vertical sides (28) of the mesa (24) and partially covering the upper surface (26) to form a first electrical contact (32) for the LED (10), the electrically conductive and light reflective system (32) defining a centrally located light emitting opening (34) on the surface (26) of the mesa (24), the mesa (24) having a diametric dimension of the surface (26) greater than one time larger than a diametric dimension of the opening (34).
    • 一种具有光子再循环的微腔LED(10),包括具有至少一个位于其上的材料层(14)的衬底(12)以及第一包层(18),第二包层(22)和有源区(16) )夹在它们之间,在材料层(14)上形成台面(24)。 台面(24)具有大致垂直的侧面(28)和上表面(26),导电和光反射系统(32)位于台面(24)的垂直侧面(28)上并部分地覆盖上表面 (26)以形成用于LED(10)的第一电触点(32),导电和光反射系统(32)限定台面(24)的表面(26)上的中心定位的发光开口(34) ),所述台面(24)具有比所述开口(34)的直径尺寸大一倍的所述表面(26)的直径尺寸。
    • 19. 发明公开
    • Method of fabricating organic LED matrices
    • Methode zur Herstellung organistcher LED Matrizen
    • EP0762806A2
    • 1997-03-12
    • EP96111993.0
    • 1996-07-25
    • MOTOROLA, INC.
    • Shieh, Chan-LongLee, Hsing-Chung
    • H05B33/10H01L31/12H01L33/00
    • H01L51/0008H01L51/0011H01L51/5012
    • Items (30, 32, 34) of material are patterned on a substrate (13) by forming a layer of photoresist (14) on the substrate (13) and a layer of metal (15) on the photoresist (14). The photoresist (14) is patterned to define an opening (20) exposing a portion of the substrate (13) and the metal (15) is patterned to define an aperture (19) smaller than the opening (20) so as to divide the exposed surface of the substrate (13) into shadow areas (22, 23) and a non-shadow area (21). A first material system (31) is evaporated generally perpendicular to the aperture (19) to form a first organic light emitting diode (30) on the surface of the substrate (13) in the non-shadow area (21) and second and third material systems (33, 35) are evaporated at angles (α, β) to the aperture (19) to form second and third organic light emitting diodes (32, 34) in the shadow areas (22, 23). Passivation material (70, 72, 74) is evaporated perpendicularly onto the first diode (30) and at the angle (α, β) onto the second diodes (32, 34).
    • 通过在衬底(13)上形成一层光致抗蚀剂(14)和在光致抗蚀剂(14)上形成一层金属(15),将材料(30,32,34)图案化在衬底(13)上。 对光致抗蚀剂(14)进行图案化以限定暴露基板(13)的一部分的开口(20),并且金属(15)被图案化以限定小于开口(20)的孔(19),以便将 衬底(13)的暴露表面进入阴影区域(22,23)和非阴影区域(21)。 第一材料系统(31)通常垂直于孔(19)蒸发以在非阴影区域(21)中的基板(13)的表面上形成第一有机发光二极管(30),第二和第三 材料系统(33,35)以角度(α,β)蒸发到孔(19),以在阴影区域(22,23)中形成第二和第三有机发光二极管(32,34)。 将钝化材料(70,72,74)垂直地蒸发到第一二极管(30)上并以角度(α,β)蒸发到第二二极管(32,34)上。
    • 20. 发明公开
    • Active driven led matrices
    • Aktive SteuerungfürAnzeigetafeln mit Leuchtdioden
    • EP0762374A1
    • 1997-03-12
    • EP96111992.2
    • 1996-07-25
    • MOTOROLA, INC.
    • Shieh, Chan-LongLee, Hsing-ChungSo, Franky
    • G09G3/32G09G3/30
    • G09G3/2011G09G3/2025G09G3/2081G09G3/3258G09G3/3291G09G2300/0465G09G2300/0804G09G2300/0842G09G2310/0235G09G2310/0256G09G2310/027G09G2320/043G09G2330/02
    • A matrix of light emitting devices including a voltage source (60) constructed to repetitiously supply a multi-step voltage waveform (V r , V g , V b ) and a matrix of rows and columns of pixels (40), each pixel (40) being connected to the voltage source (60). A method of driving the matrix including addressing each of the pixels (40) of the matrix by supplying scan and image data activating signals (57, 55) to each of the pixels (40), the image data activating signal (55) being used to activate a pixel (40) by completing a current path from the pixel (40, 44) to a return for the voltage source (48), and activating the voltage source (60) to repetitiously supply multi-step waveforms (V r , V g , V b ) of voltage and sequentially supply each step of each of the multi-step voltage waveforms (V r , V g , V b ) to the pixels (40), and addressing each of the pixels (40) in the matrix for each step supplied.
    • 一种发光器件的矩阵,包括构造成重复地提供多级电压波形(Vr,Vg,Vb)的电压源(60)和像素(40)的行和列的矩阵,每个像素(40)被连接 到电压源(60)。 一种驱动矩阵的方法,包括通过向每个像素(40)提供扫描和图像数据激活信号(57,55)来寻址矩阵的每个像素(40),所使用的图像数据激活信号(55) 通过完成从像素(40,44)到电压源(48)的返回的电流路径来激活像素(40),并激活电压源(60)以重复地提供多步波形(Vr,Vg ,Vb),并且将每个多级电压波形(Vr,Vg,Vb)的每个步骤依次提供给像素(40),并且针对供应的每个步骤对矩阵中的每个像素(40)寻址。