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    • 11. 发明公开
    • Air film conveyor for transporting semiconductor chips
    • LuftgleitbahnfürHalbleiterscheiben。
    • EP0054899A1
    • 1982-06-30
    • EP81110482.7
    • 1981-12-16
    • International Business Machines Corporation
    • DeRobertis, Ignatius JosephHassan, Javathu KutikaranJudge, Robert LewisPaivanas, John Angelo
    • B65G51/02
    • H01L21/67784B65G51/03
    • This transport system contains an air film shuttle conveyor (10) for conveying semiconductor chips (26) from a loading (20) to an unloading station (30), the conveyor comprising a base plate (42) and upstanding side walls (48) extending longitudinally of the base plate, the side walls being spaced apart a distance slightly greater than the lateral dimension of said chips; further included are means providing a laminar air flow which surrounds the chips and forms an air film supporting them and propelling them downstream-such that the slight spacing between the chips and the side walls causes the flow resistance to be higher in the one region defined by said slight spacing than in the region defined by the spacing between the chips, whereby a continuous and flexible separation action occurs between the chips.
    • 该输送系统包含用于将半导体芯片(26)从负载(20)输送到卸载站(30)的空气膜穿梭输送器(10),所述输送机包括基板(42)和直立的侧壁(48) 所述底板的纵向间隔开所述芯片的横向尺寸稍大的距离; 进一步包括提供层流气流的装置,其包围芯片并形成支撑它们的空气膜并将其推向下游,使得芯片和侧壁之间的轻微间隔导致在由所述第一区域限定的一个区域中的流动阻力更高 在由芯片之间的间隔限定的区域中的间隔小,由此在芯片之间发生连续且灵活的分离作用。