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11. 发明授权

EP0026337B1 Verfahren zum Ätzen von Werkstücken in einer Vakuumkammer 失效
标题翻译：处理真空室中工作原理的工艺和装置
公开(公告)号：EP0026337B1
公开(公告)日：1984-08-22
申请号：EP80105152.5
申请日：1980-08-29
申请人： International Business Machines Corporation
发明人： Hassan, Javathu Kutikaran, , Paivanas, John Angelo
IPC分类号： H01J37/32 , C23F1/00 , H01L21/302
CPC分类号： H01J37/3244 , C23C14/34 , C23F4/00

12. 发明授权

EP0026336B1 Contactless pick-up device 失效
标题翻译：无连接的拾取器件
公开(公告)号：EP0026336B1
公开(公告)日：1984-05-02
申请号：EP80105151.7
申请日：1980-08-29
申请人： International Business Machines Corporation
发明人： Hassan, Javathu Kutikaran , Paivanas, John Angelo
IPC分类号： B66C1/02 , B65G47/91
CPC分类号： B66C1/0218 , B66C1/0268

13. 发明公开

EP0043457A3 Air film transportation device 失效
标题翻译：空气膜运输装置
公开(公告)号：EP0043457A3
公开(公告)日：1982-04-14
申请号：EP81104436
申请日：1981-06-10
申请人： International Business Machines Corporation
发明人： Hassan, Javathu Kutikaran , Paivanas, John Angelo
IPC分类号： B65G51/00 , H01L21/68
CPC分类号： B65G51/03 , H01L21/67784
摘要： A track (14) for transporting objects such as semiconductor wafers on a bed of a gaseous fluid is provided making improved use of an axi-radial effect and a coanda effect. The track surface construction contains rows of air feed nozzles (20) separated by evacuating channels (26). The rows of holes (20) on each side of the center line (24) of the track are oriented such that the holes (20) in adjacent rows are spaced longitudinally along the track. The use of longitudinal spacing of the holes in adjacent rows reduces the number of holes necessary for the overall track configuration.

14. 发明公开

EP0043457A2 Air film transportation device 失效
标题翻译： Luftkissen-Transporteinrichtung。
公开(公告)号：EP0043457A2
公开(公告)日：1982-01-13
申请号：EP81104436.1
申请日：1981-06-10
申请人： International Business Machines Corporation
发明人： Hassan, Javathu Kutikaran , Paivanas, John Angelo
IPC分类号： B65G51/00 , H01L21/68
CPC分类号： B65G51/03 , H01L21/67784
摘要： A track (14) for transporting objects such as semiconductor wafers on a bed of a gaseous fluid is provided making improved use of an axi-radial effect and a coanda effect. The track surface construction contains rows of air feed nozzles (20) separated by evacuating channels (26). The rows of holes (20) on each side of the center line (24) of the track are oriented such that the holes (20) in adjacent rows are spaced longitudinally along the track. The use of longitudinal spacing of the holes in adjacent rows reduces the number of holes necessary for the overall track configuration.
摘要翻译：提供了用于在气态流体床上输送诸如半导体晶片的物体的轨道（14），从而改进了轴向径向效应和共同作用效果。轨道表面结构包含由抽空通道（26）分开的一排排气喷嘴（20）。轨道的中心线（24）的每一侧上的孔排（20）被定向成使得相邻排中的孔（20）沿轨道纵向间隔开。使用相邻行中的孔的纵向间隔减少了整个轨道配置所需的孔的数量。

15. 发明授权

EP0109080B1 Pick-up head for moving a sheet of material 失效
标题翻译：用于移动材料的拾取头
公开(公告)号：EP0109080B1
公开(公告)日：1987-07-22
申请号：EP83111346.9
申请日：1983-11-14
申请人： International Business Machines Corporation
发明人： Hassan, Javathu Kuttikaran , Paivanas, John Angelo
IPC分类号： H01L21/68 , B65H3/14 , H01L21/00 , B65G47/91 , B66C1/02
CPC分类号： H01L21/6838

16. 发明公开

EP0167033A3 Apparatus for conduction cooling 失效
标题翻译：导电冷却装置
公开(公告)号：EP0167033A3
公开(公告)日：1987-03-25
申请号：EP85107251
申请日：1985-06-14
申请人： International Business Machines Corporation
发明人： Ostergren, Carl David , Paivanas, John Angelo
IPC分类号： H01L23/40 , H01L23/36
CPC分类号： H01L23/4006 , H01L23/4338 , H01L2224/16 , H01L2224/73253 , H01L2924/01014 , H01L2924/01019
摘要： Disclosed is a device to thermally couple a heat dissipating intergrated circuit chip to the heat sink in a thermal conduction module for effective cooling of the chip by minimizing the thermal resistance path from the chip to the sink. The device is a combination of a heat conducting flat based, truncated solid conical disc (23) which is spring (26) loaded on the back of the chip (20) and a heat conductive hat member (27) having an opening with a continuous tapered wall (28) to conformally fit over the truncated conical disc (23). The gap between the disc (23) and the hat (27) is packed with a thin layer of a high thermal conductivity grease (33) to provide a low interfacial thermal resistance and mechanical flexibility between the disc (23) and the hat (27). For additional cooling enhancement of the chip (20), at the interface between the chip back surface and the base of the disc (23) a self-healing alloy (34) having a high thermal conductivity and low melting point is provided.

17. 发明公开

EP0054899A1 Air film conveyor for transporting semiconductor chips 失效
标题翻译： LuftgleitbahnfürHalbleiterscheiben。
公开(公告)号：EP0054899A1
公开(公告)日：1982-06-30
申请号：EP81110482.7
申请日：1981-12-16
申请人： International Business Machines Corporation
发明人： DeRobertis, Ignatius Joseph , Hassan, Javathu Kutikaran , Judge, Robert Lewis , Paivanas, John Angelo
IPC分类号： B65G51/02
CPC分类号： H01L21/67784 , B65G51/03
摘要： This transport system contains an air film shuttle conveyor (10) for conveying semiconductor chips (26) from a loading (20) to an unloading station (30), the conveyor comprising a base plate (42) and upstanding side walls (48) extending longitudinally of the base plate, the side walls being spaced apart a distance slightly greater than the lateral dimension of said chips; further included are means providing a laminar air flow which surrounds the chips and forms an air film supporting them and propelling them downstream-such that the slight spacing between the chips and the side walls causes the flow resistance to be higher in the one region defined by said slight spacing than in the region defined by the spacing between the chips, whereby a continuous and flexible separation action occurs between the chips.
摘要翻译：该输送系统包含用于将半导体芯片（26）从负载（20）输送到卸载站（30）的空气膜穿梭输送器（10），所述输送机包括基板（42）和直立的侧壁（48）所述底板的纵向间隔开所述芯片的横向尺寸稍大的距离; 进一步包括提供层流气流的装置，其包围芯片并形成支撑它们的空气膜并将其推向下游，使得芯片和侧壁之间的轻微间隔导致在由所述第一区域限定的一个区域中的流动阻力更高在由芯片之间的间隔限定的区域中的间隔小，由此在芯片之间发生连续且灵活的分离作用。

18. 发明公开

EP0026337A3 Process and apparatus for treating workpieces in a vacuum chamber into which a gas is introduced 失效
标题翻译：用于处理真空室中工作原理的工艺和装置
公开(公告)号：EP0026337A3
公开(公告)日：1981-07-15
申请号：EP80105152
申请日：1980-08-29
申请人： International Business Machines Corporation
发明人： Hassan, Javathu Kutikaran, , Paivanas, John Angelo
IPC分类号： H01J37/32 , C23F01/00 , H01L21/302
CPC分类号： H01J37/3244 , C23C14/34 , C23F4/00

19. 发明公开

EP0026336A2 Contactless pick-up device 失效
标题翻译：非接触拾取装置。
公开(公告)号：EP0026336A2
公开(公告)日：1981-04-08
申请号：EP80105151.7
申请日：1980-08-29
申请人： International Business Machines Corporation
发明人： Hassan, Javathu Kutikaran , Paivanas, John Angelo
IPC分类号： B66C1/02 , B65G47/91
CPC分类号： B66C1/0218 , B66C1/0268
摘要： A contactless air film pick-up device utilizes the Bernoulli pressure-velocity relationship to provide a pick-up action, and, at the same time, generates a lateral restraining force centering the picked-up object. An air outlet opening (22) in the center of a flow boundary surface is surrounded by intake means (25) ahd, in a radially wider distance, by outlet means (27, 29). The lifting force is provided by air flow through the outlet opening (22), the centering force is generated by air flowfrom the outlet means (27,29) to the intake means (25).

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