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121. 发明公开

EP2184770A4 POLISHING APPARATUS 审中-公开
标题翻译：磨光装置
公开(公告)号：EP2184770A4
公开(公告)日：2013-01-09
申请号：EP08765858
申请日：2008-06-24
申请人： EBARA CORP
发明人： KIMBA TOSHIFUMI , KUSA HIROAKI , FUJII MASAKI
IPC分类号： H01L21/304 , B24B9/00 , B24B9/06 , B24B37/005 , B24B49/12
CPC分类号： B24B49/12 , B24B9/065 , B24B37/005

122. 发明授权

EP2190626B1 VERFAHREN UND EINRICHTUNG ZUR BEARBEITUNG VON WERKSTÜCKEN 有权
标题翻译：方法和设备处理WORKPIECES
公开(公告)号：EP2190626B1
公开(公告)日：2013-01-02
申请号：EP08783451.1
申请日：2008-08-18
申请人： L. Kellenberger & Co. AG
发明人： HONEGGER, Daniel , THURNHERR, Hugo , KEFERSTEIN, Claus, P. , GSCHWEND, Bernard , RITTER, Markus
IPC分类号： B24B19/08 , B24B49/12 , B24B35/00 , G01B11/24
CPC分类号： B24B49/12 , B23Q17/2419 , B24B5/02 , B24B19/08

123. 发明公开

EP2513955A1 POLISHING METHOD, POLISHING APPARATUS AND POLISHING TOOL 审中-公开
标题翻译：研磨方法，研磨工具和抛光仪
公开(公告)号：EP2513955A1
公开(公告)日：2012-10-24
申请号：EP10837715.1
申请日：2010-12-14
申请人： Osaka University , Ebara Corporation
发明人： SANO, Yasuhisa , YAMAUCHI, Kazuto , MURATA, Junji , OKAMOTO, Takeshi , SADAKUNI, Shun , YAGI, Keita
IPC分类号： H01L21/304 , B24B37/00 , B24B49/12 , H01L21/306
CPC分类号： H01L21/32125 , B24B37/0053 , B24B37/042 , B24B37/10 , B24B37/30 , B24B49/12 , H01L21/02024
摘要： A polishing method and a polishing apparatus particularly suitable for finishing a surface of a substrate of a compound semiconductor containing an element such as Ga or the like to a desired level of flatness, so that a surface of a substrate of a compound semiconductor containing an element of Ga can be flattened with high surface accuracy within a practical processing time. In the presence of water (232) such as weak acid water, water with air dissolved therein, or electrolytic ion water, a surface of a substrate (142) made of a compound semiconductor containing either one of Ga, Al, and In and the surface of a polishing pad (242) having an electrically conductive member (264) in an area of the surface which is held in contact with the substrate (142) are relatively moved while being held in contact with each other, thereby polishing the surface of the substrate (142).

124. 发明公开

EP2490858A1 SCHLEIFMASCHINE MIT ZWEI SPINDELSÄTZEN 有权
标题翻译：一起研磨两个茎套
公开(公告)号：EP2490858A1
公开(公告)日：2012-08-29
申请号：EP10768918.4
申请日：2010-10-14
申请人： Schaudt Mikrosa GmbH
发明人： STROPPEL, Berthold
IPC分类号： B24B5/01 , B24B5/42 , B24B19/12 , B24B49/04 , B24B49/12
CPC分类号： B24B19/125 , B24B5/01 , B24B5/42 , B24B49/04 , B24B49/12
摘要： The invention relates to a grinding machine for grinding workpieces (20, 22, 48, 60), in particular for simultaneously grinding two closely adjacent workpieces (48). Said grinding machine comprises at least two first grinding spindles (26, 26') and at least two second grinding spindles (28, 28') which respectively comprise a grinding disk receiving element (37) and are pivotably mounted on the spindle block (30) on one of the first grinding spindles (26, 26'), by means of a support (40) such that they can be pivoted about the rotational axis (46) of the respective first grinding spindle (26, 26').

125. 发明授权

EP1736816B1 DEVICE FOR INSTALLING SUCTION JIG FOR EYEGLASS LENS AND METHOD FOR DETERMINING SUCTION JIG INSTALLATION POSITION 有权
标题翻译： DEVICE用于安装真空吸盘FOR眼镜镜片和方法决定真空夹具安装位置
公开(公告)号：EP1736816B1
公开(公告)日：2012-06-13
申请号：EP05727087.8
申请日：2005-03-24
申请人： TOPCON CORPORATION
发明人： KIGAWA, Tsutomu, c/o Topcon Corporation , KITAMURA, Kazuo, c/o Topcon Corporation , KOCHI, Nobuo, c/o Topcon Corporation , WATANABE, Takahiro, c/o Topcon Corporation , OGAWA, Yoshimasa, c/o Topcon Corporation
IPC分类号： B24B49/12 , B24B9/14 , B24B13/005 , G01M11/02
CPC分类号： G01M11/0214 , B24B9/146 , B24B13/005 , B24B49/12 , G01M11/0207
摘要： An automatic suction device for an eyeglass lens and a method for determining suction jig installation position, capable of recognizing that a frame exchange lens holder is being installed on a placement table, making transition to installation work of a frame exchange mode, and avoiding an erroneous contact between the frame exchange frame and a lens holding frame. The kind of holding means placed on the placement table is determined from an image of the inside of an opening (141), which image is taken by a CCD camera (105), and the installation position of a suction jig (121) at an eyeglass lens (L) placed on a frame exchange lens holder (300) is obtained.

126. 发明公开

EP2322898A3 Apparatus for checking thickness dimensions of an element while it is being machined 审中-公开
标题翻译： FOR元件的检验厚度尺寸的设备和方法，因为它是机床
公开(公告)号：EP2322898A3
公开(公告)日：2011-08-31
申请号：EP11150758.8
申请日：2008-07-18
申请人： MARPOSS SOCIETA PER AZIONI
发明人： Dall'aglio, Carlo
IPC分类号： G01B11/06 , B24B49/12
CPC分类号： G01B11/06 , B24B7/228 , B24B49/12 , H01L22/26
摘要： An apparatus for checking thickness dimensions in a semiconductor wafer ( 1 ) during grinding operations includes an optical probe ( 3 ) which transmits infrared radiations on the surface ( 2 ) being machined of the wafer ( 1 ), and detects beams that are reflected by said surface, by an opposite surface ( 2' ) of the wafer and/or by surfaces (2" , 2" ') separating different layers in the wafer.
The beam of emitted and reflected radiations travels along a path ( 4 ) with known and constant discontinuities, in part through the air ( 15 ) and in part through a cushion ( 30 ) of low flow liquid, which flows with substantially laminar flow.
A support and positioning element ( 7 ) for the optical probe includes hydraulic ducts ( 22,25 ) that generate the liquid cushion.

127. 发明授权

EP2174092B1 APPARATUS AND METHOD FOR CHECKING THICKNESS DIMENSIONS OF AN ELEMENT WHILE IT IS BEING MACHINED 有权
标题翻译：用于检查元件加工时的厚度尺寸的装置和方法
公开(公告)号：EP2174092B1
公开(公告)日：2011-04-13
申请号：EP08775214.3
申请日：2008-07-18
申请人： Marposs Societa' Per Azioni
发明人： DALL'AGLIO, Carlo
IPC分类号： G01B11/06 , B24B49/12
CPC分类号： G01B11/06 , B24B7/228 , B24B49/12 , H01L22/26
摘要： An apparatus for checking thickness dimensions in a semiconductor wafer (1) during grinding operations includes an optical probe (3) which transmits infrared radiations on the surface (2) being machined of the wafer (1), and detects beams that are reflected by said surface, by an opposite surface (2') of the wafer and/or by surfaces (2' ', 2' ' ' ) separating different layers in the wafer. The beam of emitted and reflected radiations travels along a path (4) with known and constant discontinuities, in part through the air (15) and in part through a cushion (30) of low flow liquid, which flows with substantially laminar flow. A support and positioning element (7) for the optical probe includes hydraulic ducts (22,25) that generate the liquid cushion. A method for checking the thickness dimensions includes the generation of the liquid cushion at the path along which the beam of emitted and reflected radiations travels.
摘要翻译：一种用于在研磨操作期间检查半导体晶片（1）中的厚度尺寸的设备包括：光学探针（3），其在晶片（1）的被加工表面（2）上传输红外辐射，并且检测由所述通过晶片的相对表面（2'）和/或通过分离晶片中的不同层的表面（2“，2”“）来实现。发射和反射辐射束沿具有已知和恒定不连续性的路径（4）行进，部分穿过空气（15）并且部分穿过基本层流地流动的低流动液体的衬垫（30）。用于光学探测器的支撑和定位元件（7）包括产生液体垫的液压导管（22,25）。用于检查厚度尺寸的方法包括在发射和反射辐射束沿其传播的路径上产生液体垫。

128. 发明公开

EP1736816A4 DEVICE FOR INSTALLING SUCTION JIG FOR EYEGLASS LENS AND METHOD FOR DETERMINING SUCTION JIG INSTALLATION POSITION 有权
标题翻译： DEVICE用于安装真空吸盘FOR眼镜镜片和方法决定真空夹具安装位置
公开(公告)号：EP1736816A4
公开(公告)日：2011-01-12
申请号：EP05727087
申请日：2005-03-24
申请人： TOPCON CORP
发明人： KIGAWA TSUTOMU , KITAMURA KAZUO , KOCHI NOBUO , WATANABE TAKAHIRO , OGAWA YOSHIMASA
IPC分类号： G02C13/00 , B24B9/14 , B24B13/005 , B24B49/12 , G01M11/02
CPC分类号： G01M11/0214 , B24B9/146 , B24B13/005 , B24B49/12 , G01M11/0207

129. 发明公开

EP2193880A2 Verfahren zum Bearbeiten und Berechnen einer als Halbfertigfabrikat ausgebildeten optischen Linse 有权转让
标题翻译：维尔弗朗兄弟姊妹e en e se se se se se se se se se se se se se se se se se
公开(公告)号：EP2193880A2
公开(公告)日：2010-06-09
申请号：EP09178032.0
申请日：2009-12-04
申请人： Schneider GmbH + Co. KG
发明人： Schneider, Gunter , Buchenauer, Helwig , Huttenhuis, Stephan
IPC分类号： B24B13/00 , B24B49/12 , G01B11/25
CPC分类号： B24B13/00 , B24B49/12
摘要： Die Erfindung bezieht sich auf ein Verfahren zum Bearbeiten und Berechnen einer als Halbfertigfabrikat ausgebildeten optischen Linse 1 mit einer vorgefertigten Form einer ersten Seite 1.1 und einer zu bearbeitenden zweiten Seite 1.2, bei dem eine Soll-Form einer Oberfläche der zu bearbeitenden zweiten Seite 1.2 berechnet wird, wobei vor der Berechnung der Soll-Form der Oberfläche der zweiten Seite 1.2 eine Ist-Form der Oberfläche der ersten Seite 1.1 durch Messmittel 2 erfasst wird und die Ist-Form der Oberfläche der ersten Seite 1.1 in die Berechnung der Soll-Form der Oberfläche der zweien Seite 1.2 einfließt.
摘要翻译：该方法包括使用光学测量单元（2）在半成品形式的光学透镜（1）的侧面（1.1）的上表面的实际形式之前，在评估上面的参考形式之前，另一面的表面（1.2）。实际形式用于评估参考表。半成品在前一侧的上表面与块件连接。在阻塞过程之后检测到实际形式。将前一侧的上表面的参考形式与实际形式进行比较。

130. 发明公开

EP2174092A1 APPARATUS AND METHOD FOR CHECKING THICKNESS DIMENSIONS OF AN ELEMENT WHILE IT IS BEING MACHINED 有权
标题翻译： FOR元件的检验厚度尺寸的设备和方法，因为它是机床
公开(公告)号：EP2174092A1
公开(公告)日：2010-04-14
申请号：EP08775214.3
申请日：2008-07-18
申请人： Marposs Societa' Per Azioni
发明人： DALL'AGLIO, Carlo
IPC分类号： G01B11/06 , B24B49/12
CPC分类号： G01B11/06 , B24B7/228 , B24B49/12 , H01L22/26
摘要： An apparatus for checking thickness dimensions in a semiconductor wafer (1) during grinding operations includes an optical probe (3) which transmits infrared radiations on the surface (2) being machined of the wafer (1), and detects beams that are reflected by said surface, by an opposite surface (2') of the wafer and/or by surfaces (2' ', 2' ' ' ) separating different layers in the wafer. The beam of emitted and reflected radiations travels along a path (4) with known and constant discontinuities, in part through the air (15) and in part through a cushion (30) of low flow liquid, which flows with substantially laminar flow. A support and positioning element (7) for the optical probe includes hydraulic ducts (22,25) that generate the liquid cushion. A method for checking the thickness dimensions includes the generation of the liquid cushion at the path along which the beam of emitted and reflected radiations travels.

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