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101. 发明公开

EP3066749A2 ELEKTRISCHE MASCHINE MIT EINEM BEFESTIGUNGSFLANSCH 有权
公开(公告)号：EP3066749A2
公开(公告)日：2016-09-14
申请号：EP14793058.0
申请日：2014-10-24
申请人： Robert Bosch GmbH
发明人： BAUER, Christian , KELLER, Thomas
IPC分类号： H02K5/04 , H02K5/00
CPC分类号： H02K5/26 , B23K26/28 , B23K2201/36 , H02K5/00 , H02K5/04 , H02K15/14
摘要： The invention relates to an electric machine (12) having a mounting flange (10) and to a method for producing an electric machine (12) of this kind having a mounting flange (10) of this type. Said mounting flange is arranged on a - preferably cylindrical - housing part (14) of said electric machine (12) in such a way that the mounting flange (10) at least in portions surrounds the housing part (14) in the circumferential direction (16) of said housing part (14), the mounting flange (10) and/or the housing part (14) being coated. The invention is characterized in that the mounting flange (10) has an at least radially directed raised portion (18) abutting the housing part (14), the mounting flange (10) being mounted on the housing part (14) by a welding process.
摘要翻译：本发明涉及一种具有安装法兰（10）的电机（12）以及具有这种类型的安装法兰（10）的这种电机（12）的制造方法。所述安装凸缘被布置在所述电机（12）的优选圆柱形壳体部分（14）上，使得安装凸缘（10）在圆周方向上至少部分地围绕壳体部分（14）所述壳体部分（14）的所述安装凸缘（10）和/或所述壳体部分（14）被涂覆。本发明的特征在于，安装凸缘（10）具有抵靠壳体部分（14）的至少径向的凸起部分（18），安装凸缘（10）通过焊接过程安装在壳体部分（14）上。

102. 发明公开

EP3016772A4 METHOD FOR MANUFACTURING ELECTRICAL STEEL SHEET LAMINATED CORE HAVING REDUCED CORE LOSS AND INCREASED STRENGTH, AND LAMINATED CORE PRODUCED BY THE SAME 有权转让
标题翻译：方法产生具有减少磁心损耗电涂层的钢芯和增加体力而在这个过程覆膜的芯
公开(公告)号：EP3016772A4
公开(公告)日：2016-07-20
申请号：EP13888549
申请日：2013-12-24
申请人： POSCO
发明人： UHM SANG-HO , KIM CHUNG-HA , KIM JI-HYUN , BONG WON-SEOG
IPC分类号： B23K9/00 , B23K9/16 , B23K9/167 , B23K9/173 , B23K9/23 , B23K35/30 , B23K37/04 , B23K101/36 , B23K103/04 , B23K103/22 , H02K1/18 , H02K15/02
CPC分类号： B23K9/164 , B23K9/0035 , B23K9/167 , B23K9/173 , B23K9/23 , B23K35/3066 , B23K2201/36 , B23K2203/04 , B23K2203/22 , H02K1/185 , H02K15/02

103. 发明公开

EP2982469A4 LEAD-FREE SOLDER ALLOY AND IN-VEHICLE ELECTRONIC CIRCUIT 有权
标题翻译：无铅软合金和车辆内部电子开关
公开(公告)号：EP2982469A4
公开(公告)日：2016-06-29
申请号：EP14779645
申请日：2014-04-03
申请人： SENJU METAL INDUSTRY CO
发明人： YOSHIKAWA SHUNSAKU , HIRAI NAOKO , TACHIBANA KEN , TACHIBANA YOSHIE
IPC分类号： B23K35/26 , B23K35/02 , B23K101/36 , B23K101/42 , C22C13/00 , C22C13/02 , H01R4/02 , H01R12/71 , H01R13/58
CPC分类号： H01R13/58 , B23K35/0222 , B23K35/26 , B23K35/262 , B23K2201/36 , B23K2201/42 , C22C13/00 , C22C13/02 , H01R4/02 , H01R12/71
摘要： With the increasing density of in-vehicle electronic circuits, not only conventional cracks at bonding interfaces such as between the substrate and the solder attachment site or a component and the solder attachment site but also novel cracking problems of cracks occurring in the Sn matrix in the interior of the bonded solder have appeared. To solve the above problem, a lead-free solder alloy with 1-4 mass% Ag, 0.6-0.8 mass% Cu, 1-5 mass% Sb, 0.01-0.2 mass% Ni and the remainder being Sn is used. A solder alloy, which not only can withstand harsh temperature cycling characteristics from low temperatures of -40°C to high temperatures of 125°C but can also withstand external forces that occur when riding up on a curb or colliding with a vehicle in front for long periods, and an in-vehicle electronic circuit device using said solder alloy can thereby be obtained.
摘要翻译：随着车载电子电路密度的增加，不仅在基板和焊料附着部位之间的接合界面处的常规裂纹或部件和焊料附着位置，而且在Sn基体中发生裂纹的新颖的裂纹问题粘合焊料的内部已经出现。为了解决上述问题，使用了具有1-4质量％Ag，0.6-0.8质量％Cu，1-5质量％Sb，0.01〜0.2质量％Ni和余量为Sn的无铅焊料合金。一种焊料合金，它不仅可以承受从-40°C的低温到125°C的高温的恶劣的温度循环特性，而且还可以承受当爬上路边或与前面的车辆碰撞时发生的外力因此可以获得使用所述焊料合金的车载电子电路装置。

104. 发明公开

EP2898979A4 BONDING STRUCTURE FOR ALUMINUM MEMBER AND COPPER MEMBER 有权
标题翻译： VERBINDUNGSSTRUKTURFÜREIN ALUMINIUM- UND EIN KUPFERELEMENT
公开(公告)号：EP2898979A4
公开(公告)日：2016-06-08
申请号：EP13839672
申请日：2013-09-18
申请人： MITSUBISHI MATERIALS CORP
发明人： TERASAKI NOBUYUKI , NAGATOMO YOSHIYUKI
IPC分类号： B23K20/02 , B23K20/233 , B23K101/36 , B23K103/10 , B23K103/12 , B23K103/18 , B32B15/01 , H01L23/36 , H01L23/433
CPC分类号： B32B15/017 , B23K20/02 , B23K20/2333 , B23K2201/36 , B23K2203/10 , B23K2203/12 , H01L23/36 , H01L23/4334 , H01L2924/0002 , Y10T428/12667 , H01L2924/00
摘要： A bonding structure of an aluminum member and a copper member includes: the aluminum member (11) composed of aluminum or an aluminum alloy, and the copper member (12) composed of copper or a copper alloy in which the aluminum member and the copper member are bonded together by solid phase diffusion bonding; an intermetallic compound layer (21) that is made of copper and aluminum and is formed in a bonding interface between the aluminum member (11) and the copper member (12); and an oxide (27) dispersed in an interface between the copper member (12) and the intermetallic compound layer (21) in a layered form along the interface.
摘要翻译：铝构件和铜构件的接合结构包括：由铝或铝合金构成的铝构件（11）和由铜或铜合金构成的铜构件（12），其中铝构件和铜构件通过固相扩散接合结合在一起; 在铝构件（11）和铜构件（12）之间的接合界面处形成由铜和铝制成的金属间化合物层（21）; 以及沿着界面以分层形式分散在铜构件（12）和金属间化合物层（21）之间的界面中的氧化物（27）。

105. 发明公开

EP2979807A1 SOLDER ALLOY, SOLDER COMPOSITION, SOLDER PASTE AND ELECTRONIC CIRCUIT BOARD 有权
标题翻译： LÖTLEGIERUNG，LÖTZUSAMMENSETZUNG，LÖTPASTEUND ELEKTRONISCHE LEITERPLATTE
公开(公告)号：EP2979807A1
公开(公告)日：2016-02-03
申请号：EP14863041.1
申请日：2014-08-28
申请人： Harima Chemicals, Inc.
发明人： IKEDA, Kazuki , INOUE, Kosuke , ICHIKAWA, Kazuya , TAKEMOTO, Tadashi
IPC分类号： B23K35/26 , C22C13/00 , H05K3/34
CPC分类号： B23K35/262 , B23K35/0205 , B23K35/0227 , B23K35/0244 , B23K35/025 , B23K35/22 , B23K35/26 , B23K35/36 , B23K35/3606 , B23K35/3612 , B23K35/3613 , B23K35/3616 , B23K35/3618 , B23K35/362 , B23K2201/36 , B23K2201/42 , C22C13/00 , C22C13/02 , H05K3/3457 , H05K3/3484
摘要： A solder alloy is a tin-silver-copper solder alloy substantially consisting of tin, silver, copper, bismuth, nickel, cobalt, and indium. With respect to the total amount of the solder alloy, the content ratio of the silver is 2 mass% or more and 5 mass% or less; the content ratio of the copper is 0.1 mass% or more and 1 mass% or less; the content ratio of the bismuth is 0.5 mass% or more and 4.8 mass% or less; the content ratio of the nickel is 0.01 mass% or more and 0.15 mass% or less; the content ratio of the cobalt is 0.001 mass% or more and 0.008 mass% or less; the content ratio of the indium is above 6.2 mass% and 10 mass% or less; and the content ratio of the tin is the remaining ratio.
摘要翻译：焊料合金是基本上由锡，银，铜，铋，镍，钴和铟组成的锡 - 银 - 铜焊料合金。关于焊料合金的总量，银的含量比为2质量％以上且5质量％以下; 铜的含有比例为0.1质量％以上1质量％以下。铋的含量比例为0.5质量％以上至4.8质量％以下; 镍的含量比为0.01质量％以上且0.15质量％以下; 钴的含有比例为0.001质量％以上且0.008质量％以下; 铟的含有比例在6.2质量％以上10质量％以下。锡的含量比为剩余比例。

106. 发明公开

EP2956976A1 ZELLVERBINDER ZUM ELEKTRISCH LEITFÄHIGEN KONTAKTIEREN EINER MEHRZAHL VON BATTERIEZELLTERMINALS, VERFAHREN ZUM HERSTELLEN EINES SOLCHEN ZELLVERBINDERS UND BATTERIEMODUL MIT WENIGSTENS EINEM SOLCHEN ZELLVERBINDER 有权
标题翻译：电池连接器，电工导电接触电池终端的号码，用于制备这种电池连接和电池模块，至少一个这样的电池连接器
公开(公告)号：EP2956976A1
公开(公告)日：2015-12-23
申请号：EP14702818.7
申请日：2014-02-03
申请人： Robert Bosch GmbH , Samsung SDI Co., Ltd.
发明人： FINK, Holger
IPC分类号： H01M2/20 , H01M2/26
CPC分类号： H01M2/206 , B23K26/244 , B23K26/32 , B23K26/323 , B23K2201/36 , B23K2203/10 , B23K2203/12 , B23K2203/18 , B23K2203/42 , H01M2/202 , H01M2220/20
摘要： The present invention relates to a cell connector (1) for making electrically conductive contact with a plurality of battery cell terminals (2), wherein the cell connector (1) has a plurality of sections (5, 6, 7) which are arranged against one another. In this case, a first number of first sections (5, 6) is composed of an electrically conductive metal material, and a second number of second sections (7) is composed of an electrically insulating plastic, wherein at least one second section (7) is arranged between at least two first sections (5, 6) in each case. The present invention further relates to a method for producing a cell connector according to the invention, wherein the at least one second section (7) is connected to the at least two first sections (5, 6) by means of a nano-moulding method. The present invention furthermore relates to a battery module (4) having a plurality of battery cells (3) which are electrically interconnected with one another, wherein the battery cells (3) each have at least one cell terminal (2), which is electrically conductively connected to an electrode of the battery cell (3), for making electrically conductive contact with the battery cells (3), and wherein at least a first number of cell terminals (2) is connected by means of a cell connector (1) according to the invention.
摘要翻译：用于制造导电接触与电池单元端子的多个A电池连接器包括一个电绝缘的由下一个定位成海誓山盟部分包括导电金属材料构成的第一部分中的多个复数，并且至少一个第二部分塑料。所述至少一个第二部分的第一部分的多个A respectivement二者之间的位置。本公开内容还涉及一种用于制造一个电池连接器，其中，所述至少一个第二部分通过一个纳米模塑方法的装置，其连接到所述至少两个第一部分。本公开进一步涉及一种具有电池单元的与由至少一个电池连接器连接的端子的多个电池模块。

107. 发明公开

EP2883644A4 NORMAL TEMPERATURE BONDING DEVICE AND NORMAL TEMPERATURE BONDING METHOD 有权转让
标题翻译：设备绑定在正常温度和方法绑定在常温下
公开(公告)号：EP2883644A4
公开(公告)日：2015-12-02
申请号：EP13835075
申请日：2013-07-30
申请人： MITSUBISHI HEAVY IND LTD
发明人： TSUNO TAKESHI , GOTO TAKAYUKI , KINOUCHI MASATO , UTSUMI JUN , IDE KENSUKE , SUZUKI TAKENORI
IPC分类号： B23K20/00 , B23K20/02 , B23K20/16 , B23K20/24 , B23K101/36 , B29C65/02 , B32B37/00 , B32B37/18 , B32B38/00 , B32B38/18 , B81C3/00 , B81C99/00 , C23C14/34 , C23C14/50 , C23C14/56 , H01J37/34 , H01L21/02 , H01L21/18 , H01L21/20 , H01L21/67
CPC分类号： H01L21/67121 , B23K20/02 , B23K20/16 , B23K20/24 , B23K2201/36 , B32B37/0046 , B32B37/18 , B32B38/0012 , B32B38/1858 , B32B2307/20 , B32B2310/08 , B32B2311/00 , B32B2457/14 , B81C3/001 , B81C99/0025 , C23C14/3407 , C23C14/3457 , C23C14/3464 , C23C14/50 , C23C14/564 , H01J37/3435 , H01L21/187 , H01L21/2007
摘要： The purpose of the present invention is to suppress adhering of impurities to substrates and intermediate layers during normal temperature bonding of substrates. This normal temperature bonding device is provided with: a vacuum vessel (1); a first holding mechanism (3a) that holds a first substrate (4); a second holding mechanism (3b) that holds a second substrate (4); a beam source (6) that outputs an activated beam that irradiates surfaces to be bonded of the first substrate (4) and the second substrate (4); and a pressure bonding mechanism (5) that aligns and bonds the surfaces to be bonded of both substrates (4) to which a target material has been made to adhere. At least one of the vacuum vessel (1), the first and second holding mechanisms (3a, 3b), the beam source (6) and the pressure bonding mechanism (5) is formed from or covered with a first material that is not easily sputtered by the activated beam (6) or that does not inhibit the function of devices formed by bonding the two substrates (4) even when present on the surfaces to be bonded.
摘要翻译：本发明的目的是基板的常温接合期间抑制杂质到衬底和中间层的附着。这种常温接合装置具备：真空容器（1）; 第一保持机构（3a）中做了保持第一基板（4）; 第二保持机构（3b）中做了保持第二基板（4）; 光束源（6）做活化光束照射的输出确实要粘合的第一衬底（4）和所述第二基板的表面（4）; 和压接机构（5）做对准并键的表面，以键合两个基板（4）的目标材料已经做出粘附到哪个。至少在真空容器中的一个（1）中，第一和第二保持机构（3A，3B），所述光束源（6）和所述压接机构（5）由下述物质形成或用做第一材料覆盖不容易通过激活的束溅射（6）或没有不抑制通过键合两个基板（4）甚至当存在于要被粘合的表面形成的器件的功能。

108. 发明公开

EP2922655A1 VERFAHREN ZUM VERLÖTEN VON STÄNDER UND KÜHLER UND STÄNDER MIT LOTVERBINDUNG ZUM STÄNDERTRÄGER 失效
标题翻译：方法用于焊接的支架的
公开(公告)号：EP2922655A1
公开(公告)日：2015-09-30
申请号：EP13791983.3
申请日：2013-11-13
申请人： Compact Dynamics GmbH
发明人： SONTHEIM, Johann , MENHART, Michael
IPC分类号： B23K1/00 , H02K5/20 , H02K9/10 , H02K9/14 , H02K9/22
CPC分类号： H02K15/02 , B23K1/0016 , B23K1/002 , B23K31/02 , B23K2201/36 , C25D7/00 , H02K5/20 , H02K15/00
摘要： A method for soldering a stator (10) of an electric machine to a cooler (30) is described. Firstly, the stator (10) and/or the cooler (30) is coated, at least partially, with a layer of solder (20,40). Then, the stator (10) is brought together with the cooler (30) such that the layer of solder (20, 40) is between the stator (10) and the cooler (30). Finally, the cooler (30) is heated to the melt temperature of the layer of solder (20, 40) in order to produce a solder connection between the stator (10) and the cooler (30). The cooler (30) can also act as support. Furthermore, a stator (10) for an electric machine, comprising a stator support (30) and a solder connection between the stator (10) and the stator support (30) is described.

109. 发明授权

EP2437896B1 MEMBRANVERNEBLER UND VERFAHREN ZUM VERSCHWEIßEN EINER MEMBRAN MIT EINEM TRÄGER BEI DER HERSTELLUNG EINES MEMBRANVERNEBLERS 有权
标题翻译：膜雾化器和方法用于焊接膜载体IN A MEMBRANVERNEBLERS生产
公开(公告)号：EP2437896B1
公开(公告)日：2015-09-02
申请号：EP10724069.9
申请日：2010-06-02
申请人： PARI Pharma GmbH
发明人： PUMM, Gerhard , SEIFERT, René , HOLZMANN, Philipp , BRUNE, Nicole
IPC分类号： B05B17/06 , A61M11/00 , A61M15/00 , B23K11/00 , B23K11/22 , B23K11/093
CPC分类号： B05B17/0646 , A61M11/005 , A61M15/0085 , B05B17/0661 , B23K11/0026 , B23K11/093 , B23K11/22 , B23K2201/36 , B23K2203/02 , B23K2203/10

110. 发明授权

EP2140468B1 VERFAHREN ZUR BEFESTIGUNG EINES GETTERS FÜR EINE VAKUUMSCHALTRÖHRE SOWIE VAKUUMSCHALTRÖHRE 有权转让
标题翻译：方法为保障吸气剂用于真空开关管和真空开关管
公开(公告)号：EP2140468B1
公开(公告)日：2015-08-26
申请号：EP08749519.8
申请日：2008-04-04
申请人： Siemens Aktiengesellschaft
发明人： SCHÜMANN, Ulf , SPÖRER, Henryk
IPC分类号： B23K11/11 , H01H33/668 , B23K15/00 , B23K20/10 , B23K26/20 , B23K26/32
CPC分类号： B23K11/11 , B23K15/0046 , B23K20/10 , B23K26/211 , B23K26/32 , B23K2201/34 , B23K2201/36 , B23K2203/08 , B23K2203/12 , B23K2203/14 , B23K2203/16 , B23K2203/52 , H01H33/6683

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