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    • 100. 发明公开
    • Etching method using block-copolymers
    • Ätzverfahrenunter Verwendung von Blockcopolymeren
    • EP2733533A2
    • 2014-05-21
    • EP13189664.9
    • 2013-10-22
    • IMECTokyo Electron Limited
    • Chan, Boon TeikTahara, Shigeru
    • G03F7/00
    • H01L21/3086B82Y10/00B82Y40/00G03F7/0002H01L21/0271H01L21/3065H01L21/3081H01L21/3088H01L27/04H01L51/0014H01L51/0017
    • A method (10) for lithography, the method comprising:
      - Obtaining (12) a self-organizing block-copolymer layer (21) on a neutral layer overlying a substrate (23), the self-organizing block-copolymer layer (21) comprising at least two polymer components (24, 25) having mutually different etching resistances, the self-organizing block-copolymer layer (21) furthermore comprising a copolymer pattern structure formed by micro-phase separation of the at least two polymer components (24, 25),
      - Etching (14) selectively a first polymer component (25) of the self-organizing block-copolymer layer (21), thereby remaining a second polymer component (24),
      - applying a plasma etching (16) to the neutral layer (22") using the second polymer component (24) as a mask, wherein the plasma etching (16) comprises an inert gas and H 2 .
    • 一种用于光刻的方法(10),所述方法包括: - 获得(12)在衬底(23)上的中性层上的自组织嵌段共聚物层(21),所述自组织嵌段共聚物层(21) 所述自组织嵌段共聚物层(21)还包含通过所述至少两种聚合物组分(24,24)的微相分离形成的共聚物图案结构,所述聚合物组分(24,25)具有相互不同的抗蚀性, 25), - 选择性地蚀刻(14)自组织嵌段共聚物层(21)的第一聚合物组分(25),从而保留第二聚合物组分(24), - 将等离子体蚀刻(16)施加到中性 使用第二聚合物组分(24)作为掩模的层(22“),其中等离子体蚀刻(16)包括惰性气体和H 2。