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91. 发明公开

EP2937218A2 SEMICONDUCTOR APPARATUS, EXPOSING HEAD, AND IMAGE FORMING APPARATUS 审中-公开
标题翻译： BALICHTUNGSKOPF在BILDERZEUGUNGSVORRICHTUNG的HALBLEITERBAUELEMENT
公开(公告)号：EP2937218A2
公开(公告)日：2015-10-28
申请号：EP15161234.8
申请日：2015-03-27
申请人： Oki Data Corporation
发明人： Suzuki, Takahito , Kaneto, Taishi
IPC分类号： B41J2/45
CPC分类号： G03G15/043 , F21V21/00 , F21V23/06 , F21Y2103/10 , G03G15/04054 , H01L27/153 , H01L33/20
摘要： A semiconductor apparatus includes a rectangular plate-like body including a major surface (142, 205, 304, 441). A plurality of light emitting portions (143, 206, 305, 412) formed in the major surface, and aligned in a straight line. A first terraced portion (146, 210, 308, 445) and a second terraced portion (145+146, 210, 308, 445) are formed in the major surface except areas in which the plurality of light emitting portions are formed.
摘要翻译：一种半导体装置，包括一个包括主表面（142,205,304,441）的矩形板状主体。多个发光部分（143,206,305,412），形成在主表面上，并以直线对准。除了形成多个发光部的区域之外，在主表面上形成有第一台阶部分（146,210,308,445）和第二台阶部分（145 + 146,210,308,445）。

92. 发明公开

EP2927958A1 Light emitting element array, semiconductor device, manufacturing method thereof, printing head and image forming apparatus 无效
标题翻译：发光元件阵列，半导体元件，工艺制作，头及摄像装置
公开(公告)号：EP2927958A1
公开(公告)日：2015-10-07
申请号：EP15161590.3
申请日：2015-03-30
申请人： Oki Data Corporation
发明人： Kaneto, Taishi , Suzuki, Takahito
IPC分类号： H01L25/075 , H01L27/15 , B41J2/45
CPC分类号： H01L33/24 , B41J2/45 , G03G15/04054 , H01L25/0753 , H01L25/167 , H01L27/156 , H01L2924/0002 , H01L2924/00
摘要： A light emitting element array includes a semiconductor thin-film layer (104) in which a plurality of light emitting portions (103) are arranged. The plurality of light emitting portions are driven to emit light in such a manner that an arrangement direction of the plurality of light emitting portions defines a main scanning direction (X). The plurality of light emitting portions are arranged in such a manner that adjacent light emitting portions are displaced from each other in a sub scanning direction (Y) perpendicular to the main scanning direction by a certain amount. An end portion of the semiconductor thin-film layer in the sub scanning direction has a shape along a pattern in which the plurality of light emitting portions are arranged.
摘要翻译：一种发光元件阵列包括其中的发光部分（103）多个布置在半导体薄膜层（104）。的发光部分的多元化被驱动以发射光的方式搜索中的发光部，所述多个排列方向确实定义了一个主扫描方向（X）。的发光部分中的多个求的方式被布置做相邻的发光部由在副扫描方向（Y）相互垂直于主扫描方向通过一定量的移位。在副扫描方向上的半导体薄膜层的端部具有沿着哪个发光部分的多元布置的图案的形状。

93. 发明授权

EP2096503B1 Image forming apparatus and development cartridge 有权
标题翻译：图像形成装置和处理盒
公开(公告)号：EP2096503B1
公开(公告)日：2015-05-06
申请号：EP09002208.8
申请日：2009-02-17
申请人： Brother Kogyo Kabushiki Kaisha
发明人： Funahashi, Norimichi
IPC分类号： G03G15/08
CPC分类号： G03G21/1676 , G03G15/04054 , G03G15/0855 , G03G15/0863 , G03G15/0865 , G03G15/0896 , G03G15/326 , G03G21/1657 , G03G21/1666 , G03G2215/0697 , G03G2221/1651 , G03G2221/1823

94. 发明公开

EP2722793A1 Linear LED array for digital printing apparatus 有权转让
标题翻译： Lineare LED-Anordnungfüreine digitale Druckvorrichtung
公开(公告)号：EP2722793A1
公开(公告)日：2014-04-23
申请号：EP12189237.6
申请日：2012-10-19
申请人： Xeikon IP BV
发明人： Van der Gucht, Romain Jan Victor Paul
IPC分类号： G06K15/12 , B41J2/45
CPC分类号： G03G15/04054 , B41J2/45 , G06K15/1242 , H05B37/0254
摘要： An array (200) of light emitting semiconductor components for use in a digital printer, each component comprising a driver (220) and at least one light emitting device (210),
the array (200) comprising data buses (D 0 , D 1 , D 2 , D 3 ) connecting to first subsets of components, forming a first partition of said components;
said array (200) further comprising auxiliary buses (A 0 , A 1 , A 2 , A 3 ) connecting to second subsets of components, forming a second partition of said components;
wherein said first partition and said second partition are chosen such that each component can be uniquely identified by the subset of the first and second partition to which it belongs;
wherein the data buses (D 0 , D 1 , D 2 , D 3 ) are configured to supply instructions to the first subsets of components; and
wherein each component is configured to extract instructions on the basis of its membership of a particular subset according to said second partition.
摘要翻译：一种用于数字打印机的发光半导体部件的阵列（200），每个部件包括驱动器（220）和至少一个发光器件（210），所述阵列（200）包括数据总线（D 0，D 1 ，D 2，D 3），连接到第一组件子集，形成所述组件的第一分区; 所述阵列（200）还包括连接到第二子组件的辅助总线（A 0，A 1，A 2，A 3），形成所述组件的第二分区; 其中所述第一分区和所述第二分区被选择为使得每个组件可以由其所属的第一和第二分区的子集唯一地标识; 其中数据总线（D 0，D 1，D 2，D 3）被配置为向组件的第一子集提供指令; 并且其中每个组件被配置为根据其根据所述第二分区的特定子集的成员资格来提取指令。

95. 发明公开

EP2511769A2 Light emitting apparatus, print head and image forming apparatus 审中-公开
标题翻译：发光装置，打印头和图像形成装置
公开(公告)号：EP2511769A2
公开(公告)日：2012-10-17
申请号：EP11177906.2
申请日：2011-08-18
申请人： Fuji Xerox Co., Ltd.
发明人： Ohno, Seiji
IPC分类号： G03G15/04
CPC分类号： G03G15/04054 , B41J2/45
摘要： A light emitting apparatus includes a plurality of light emitting chips, a first wire, a second wire, a third wire, and a fourth wire. The plurality of light emitting chips each have a plurality of light emitting devices and are divided into a plurality of chip groups, the light emitting devices in each of the light emitting chips being divided into a plurality of device groups. The first wire transmits in common a transmission signal to the light emitting chips. The second wire transmits in common a first selection signal to a given chip group of the light emitting chips. The third wire transmits in common a second selection signal to a set of the device groups. The fourth wire transmits a turn-on control signal to each of the chip groups.
摘要翻译：发光装置包括多个发光芯片，第一导线，第二导线，第三导线和第四导线。多个发光芯片各自具有多个发光器件并被分成多个芯片组，每个发光芯片中的发光器件被划分成多个器件组。第一导线共同传输传输信号至发光芯片。第二导线共同传送第一选择信号到发光芯片的给定芯片组。第三导线共同传输第二选择信号到一组装置组。第四导线将导通控制信号传输至每个芯片组。

96. 发明公开

EP2463108A1 Light emission control device, light emission control method, and image forming apparatus 有权
标题翻译： Lichtemissionssteuervorrichtung，Lichtemissionssteuerverfahren und Bilderzeugungsvorrichtung
公开(公告)号：EP2463108A1
公开(公告)日：2012-06-13
申请号：EP11191798.5
申请日：2011-12-02
申请人： Ricoh Company, Ltd.
发明人： Yokoyama, Takuhei , Kinoshita, Izumi , Komai, Kunihiro , Miyadera, Tatsuya , Shirasaki, Yoshinori , Shikama, Takeshi , Yamaguchi, Akinori
IPC分类号： B41J2/45 , G03G15/043 , G03G21/14
CPC分类号： B41J2/45 , G03G15/04054 , G03G15/043 , G03G15/5008 , G03G15/5033 , G03G15/505 , G03G21/145 , G03G2215/0132 , G03G2215/0409
摘要： A light emission control device (2) images an electrostatic latent image on a photosensitive element (109) by a plurality of light emitting elements (111) corresponding to a line in a second direction perpendicular to a first direction which is a rotational direction the photosensitive element. The light emission control device includes: a detecting unit (301) that detects a rotational position of the photosensitive element, in the first direction, corresponding to a line in the second direction; an acquiring unit that acquires a distance between the light emitting elements and the rotational position of the photosensitive element in the first direction detected by the detecting unit; and a control unit (305) that controls light emission by the light emitting elements according to the distance acquired by the acquiring unit and corrects a fluctuation in a density of a visible image converted from the electrostatic latent image.
摘要翻译：发光控制装置（2）通过与作为旋转方向的第一方向垂直的第二方向上的线对应于多个发光元件（111）将感光元件（109）上的静电潜像图像感光元件。发光控制装置包括：检测单元，其在与第二方向上的线对应的第一方向上检测感光元件的旋转位置; 获取单元，其获取由所述检测单元检测到的所述发光元件与所述感光元件在所述第一方向上的旋转位置之间的距离; 以及控制单元（305），其根据由所述获取单元获取的距离来控制所述发光元件的发光，并校正从所述静电潜像转换的可见图像的浓度的波动。

97. 发明公开

EP2287912A3 Semiconductor composite LED apparatus 有权转让
标题翻译：半导体LED组合部件
公开(公告)号：EP2287912A3
公开(公告)日：2011-11-23
申请号：EP10182130.4
申请日：2006-03-01
申请人： Oki Data Corporation
发明人： Ogihara, Mitsuhiko , Muto, Masataka , Igari, Tomoki , Suzuki, Takahito
IPC分类号： H01L27/15 , H01L33/36
CPC分类号： H01L33/0079 , G03G15/04054 , G03G15/326 , G03G2215/0409 , H01L24/24 , H01L24/25 , H01L27/153 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/49175 , H01L2224/73267 , H01L2924/01322 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor composite apparatus includes a substrate (2) and a planarizing layer (3), and a semiconductor thin film (4). The planarizing layer (3) is formed on the substrate either directly or indirectly. The planarizing layer includes a first surface that faces the substrate (2) and a second surface that is on the side of the planarizing layer (3) remote from the substrate (2). The semiconductor thin film (4) formed on the planarizing layer (3). The second surface has a roughness of not more.than 5 nm.

98. 发明公开

EP2287912A2 Semiconductor composite LED apparatus 有权转让
标题翻译：半导体复合LED设备
公开(公告)号：EP2287912A2
公开(公告)日：2011-02-23
申请号：EP10182130.4
申请日：2006-03-01
申请人： Oki Data Corporation
发明人： Ogihara, Mitsuhiko , Muto, Masataka , Igari, Tomoki , Suzuki, Takahito
IPC分类号： H01L27/15 , H01L33/36
CPC分类号： H01L33/0079 , G03G15/04054 , G03G15/326 , G03G2215/0409 , H01L24/24 , H01L24/25 , H01L27/153 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/49175 , H01L2224/73267 , H01L2924/01322 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor composite apparatus includes a substrate (2) and a planarizing layer (3), and a semiconductor thin film (4). The planarizing layer (3) is formed on the substrate either directly or indirectly. The planarizing layer includes a first surface that faces the substrate (2) and a second surface that is on the side of the planarizing layer (3) remote from the substrate (2). The semiconductor thin film (4) formed on the planarizing layer (3). The second surface has a roughness of not more.than 5 nm.
摘要翻译：一种半导体复合装置，包括衬底（2）和平坦化层（3）以及半导体薄膜（4）。平坦化层（3）直接或间接地形成在衬底上。平坦化层包括面向衬底（2）的第一表面和在平坦化层（3）远离衬底（2）的一侧上的第二表面。形成在平坦化层（3）上的半导体薄膜（4）。第二个表面的粗糙度不超过5nm。

99. 发明公开

EP2178120A2 Driver circuit, optical print head, and image forming apparatus 审中-公开
标题翻译：驱动电路，光学打印头和图像形成装置
公开(公告)号：EP2178120A2
公开(公告)日：2010-04-21
申请号：EP09171590.4
申请日：2009-09-29
申请人： Oki Data Corporation
发明人： Nagumo, Akira
IPC分类号： H01L27/02 , H01L27/118 , B41J2/45 , G06K15/12 , H01L27/115 , H01L27/15
CPC分类号： H01L27/0207 , B41J2/45 , G03G15/04054 , G03G15/326 , H01L27/11898 , H01L27/153 , H01L29/4238 , H01L2224/48091 , H01L2224/48137 , H01L2924/12044 , H01L2924/1301 , H01L2924/13091 , H03K17/122 , H01L2924/00014 , H01L2924/00
摘要： A driver circuit in an optical print head uses driving transistors (122) to drive a row of light-emitting elements. The gate electrodes (122G) of the driving transistors are at least partly oriented so that driving current flows in the channels below the gate electrodes in a direction (Y) different from the direction (X) of the row the light-emitting elements. This orientation reduces the temperature dependency of the driving current, so that the optical print head can produce the same high image quality at low ambient temperatures as at room temperature.
摘要翻译：光学打印头中的驱动电路使用驱动晶体管（122）来驱动一行发光元件。驱动晶体管的栅电极（122G）至少部分地被取向，使得驱动电流在与发光元件的行的方向（X）不同的方向（Y）上在栅电极下方的沟道中流动。这种取向降低了驱动电流的温度依赖性，使得光学打印头可以在低的环境温度下产生与室温相同的高图像质量。

100. 发明公开

EP1699091A2 Semiconductor composite LED apparatus 有权转让
标题翻译： Halbleiter LED Verbundbauelement
公开(公告)号：EP1699091A2
公开(公告)日：2006-09-06
申请号：EP06110563.1
申请日：2006-03-01
申请人： Oki Data Corporation
发明人： Ogihara, Mitsuhiko c/o Oki Digital Imaging Corp. , Muto, Masataka c/o Oki Digital Imaging Corp. , Igari, Tomoki c/o Oki Digital Imaging Corp. , Suzuki, Takahito c/o Oki Digital Imaging Corp.
IPC分类号： H01L33/00
CPC分类号： H01L33/0079 , G03G15/04054 , G03G15/326 , G03G2215/0409 , H01L24/24 , H01L24/25 , H01L27/153 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/49175 , H01L2224/73267 , H01L2924/01322 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor composite apparatus includes a substrate (2) and a planarizing layer (3), and a semiconductor thin film (4). The planarizing layer (3) is formed on the substrate either directly or indirectly. The planarizing layer includes a first surface that faces the substrate (2), and a second surface that is on the side of the planarizing layer (3) remote from the substrate (2). The semiconductor thin film (4) formed on the planarizing layer (3). The second surface has a roughness of not more than 5 nm.
摘要翻译：一种半导体复合装置，包括基板（2）和平坦化层（3）以及半导体薄膜（4）。平坦化层（3）直接或间接地形成在基板上。平坦化层包括面向基板（2）的第一表面和位于平坦化层（3）远离基板（2）侧的第二表面。形成在平坦化层（3）上的半导体薄膜（4）。第二表面的粗糙度不大于5nm。

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