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1. 发明授权

EP2782150B1 LIGHT EMITTING DEVICE PACKAGE AND BACKLIGHT INCLUDING SAME 有权转让
公开(公告)号：EP2782150B1
公开(公告)日：2018-08-15
申请号：EP12850417.2
申请日：2012-11-16
申请人： Lumens Co., Ltd.
发明人： OH, Seung Hyun , KIM, Pyoung Gug , LEE, Seung Hoon , MIN, Chun Ki , LIM, Jung A , LIM, Jun Hyung , JUNG, Cheol Hun , CHUNG, Bo Hyun
IPC分类号： H01L33/48 , H01L33/60 , F21V8/00 , G02F1/1335
CPC分类号： H01L33/62 , G02B6/0031 , G02B6/0073 , G02B6/0085 , G02F1/133615 , G02F2001/133614 , H01L33/486 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： Disclosed is a light emitting element package having excellent heat radiation performance and high luminance, and a backlight unit including the same. The light emitting element package includes a package including a lead frame, a light emitting element provided on the lead frame, and a molded material combined with the lead frame and having an opening for emitting light generated by the light emitting element, and a reflection structure having an opening corresponding to the opening of the molded material, and contacting the molded material.

2. 发明公开

EP3148295A4 LED ILLUMINATION DEVICE USING AC POWER 审中-公开
公开(公告)号：EP3148295A4
公开(公告)日：2017-12-13
申请号：EP15795576
申请日：2015-01-13
申请人： LUMENS CO LTD
发明人： YOO SOO GEUN , GONG MYEONG KOOK , LEE HO YOUNG , CHOI HONG GEOL
IPC分类号： H05B37/02 , H05B33/08
CPC分类号： H05B33/0827 , H05B33/08 , H05B33/0809 , H05B33/083 , H05B33/0845 , H05B37/02
摘要： Provided is a light emission device. When the size of an input voltage exceeds a minimum light emission voltage, all light emission elements emit light always irrespective of the size of a voltage, and as the size of the voltage decreases, the light emission device has a configuration in which the light emission elements are connected in parallel with each other, and as the size of the voltage increases, the light emission device has a configuration in which the light emission elements are connected in series with each other.

3. 发明公开

EP2782149A4 SEMICONDUCTOR LIGHT-EMITTING ELEMENT 有权转让
公开(公告)号：EP2782149A4
公开(公告)日：2015-08-05
申请号：EP13819478
申请日：2013-07-18
申请人： SEMICON LIGHT CO LTD
发明人： JEON SOO KUN , PARK EUN HYUN , KIM YONG DEOK
IPC分类号： H01L33/00 , H01L33/32 , H01L33/38 , H01L33/40 , H01L33/42 , H01L33/44 , H01L33/46 , H01L33/50
CPC分类号： H01L33/10 , H01L33/32 , H01L33/38 , H01L33/382 , H01L33/387 , H01L33/42 , H01L33/44 , H01L33/46 , H01L33/50 , H01L33/504 , H01L2224/14 , H01L2933/0025

4. 发明公开

EP2858460A1 LED LIGHTING DEVICE 有权
公开(公告)号：EP2858460A1
公开(公告)日：2015-04-08
申请号：EP13800065.8
申请日：2013-06-03
申请人： Lumens Co., Ltd.
发明人： GONG, Myeong Kook , JUNG, Hee Jin
IPC分类号： H05B37/02
CPC分类号： H05B33/0815 , H05B33/0845 , H05B33/0884 , Y02B20/348
摘要： Provided is a circuit for preventing an operating current of a TRIAC dimmer from being dropped below a holding current value. In this regard, a light emitting diode (LED) lighting device includes a TRIAC dimmer for controlling intensity of light emitted from an LED, a load connected between an output terminal of the TRIAC dimmer and a bridge rectifier to stabilize operation of the TRIAC dimmer even in low dimming level periods of the TRIAC dimmer, the bridge rectifier connected with the load to supply an operating current to the LED; and the LED for receiving the operating current from the bridge rectifier.

5. 发明公开

EP2851969A1 SEMICONDUCTOR LIGHT EMITTING DEVICE 有权转让
标题翻译：半导体发光器件
公开(公告)号：EP2851969A1
公开(公告)日：2015-03-25
申请号：EP14766651.5
申请日：2014-04-30
申请人： Semicon Light Co., Ltd.
发明人： PARK, Eun Hyun , JEON, Soo Kun
IPC分类号： H01L33/36
CPC分类号： H01L33/46 , H01L33/387 , H01L33/405
摘要： The present disclosure relates to a semiconductor light emitting device, which comprises: a plurality of semiconductor layers; a contact area where a first semiconductor layer is exposed as a result of the partial removal of a second semiconductor layer and an active layer; a non-conductive reflective film adapted to cover the second semiconductor layer and the contact area, such that light from the active layer is reflected towards the first semiconductor layer on the side of a growth substrate; a finger electrode extending between the non-conductive reflective film and the plurality of semiconductor layers; an electrical connection adapted to pass through the non-conductive reflective film and be electrically connected with the finger electrode; and a direct-connection type electrical connection adapted to pass through the non-conductive reflective film and be electrically connected with the plurality of semiconductor layers.
摘要翻译：本公开涉及一种半导体发光器件，其包括：多个半导体层; 由于部分去除第二半导体层和有源层而暴露出第一半导体层的接触区域; 非导电反射膜，其适于覆盖所述第二半导体层和所述接触区域，使得来自所述有源层的光朝向所述生长衬底侧的所述第一半导体层反射; 指状电极，其在所述非导电性反射膜与所述多个半导体层之间延伸; 适于穿过所述不导电反射膜并与所述指状电极电连接的电连接; 以及适于穿过不导电反射膜并与多个半导体层电连接的直接连接型电连接。

6. 发明公开

EP2782149A2 SEMICONDUCTOR LIGHT-EMITTING ELEMENT 有权转让
标题翻译： LICHTEMITTITRENDEND HALBLEITERELEMENT
公开(公告)号：EP2782149A2
公开(公告)日：2014-09-24
申请号：EP13819478.2
申请日：2013-07-18
申请人： Semicon Light Co. Ltd.
发明人： JEON, Soo Kun , PARK, Eun Hyun , KIM, Yong Deok
IPC分类号： H01L33/46 , H01L33/36
CPC分类号： H01L33/10 , H01L33/32 , H01L33/38 , H01L33/382 , H01L33/387 , H01L33/42 , H01L33/44 , H01L33/46 , H01L33/50 , H01L33/504 , H01L2224/14 , H01L2933/0025
摘要： The present disclosure relates to a semiconductor light emitting device, comprising: a plurality of semiconductor layers that grows sequentially on a growth substrate, with the plurality of semiconductor layers including a first semiconductor layer having a first conductivity, a second semiconductor layer having a second conductivity different from the first conductivity, and an active layer interposed between the first semiconductor layer and the second semiconductor layer, generating a light with a first wavelength via electron-hole recombination; a first electrode, supplying either electrons or holes to the plurality of semiconductor layers; a second electrode, supplying, to the plurality of semiconductor layers, electrons if the holes are supplied by the first electrode, or holes if the electrons are supplied by the first electrode; a phosphor part provided over the first semiconductor layer on the side of the growth substrate, converting the light with the first wavelength generated in the active layer into a light of a second wavelength; and a non-conductive reflective film formed on the second semiconductor layer for reflecting the light from the active layer towards the first semiconductor layer on the side of the growth substrate, with the non-conductive reflective film having a distributed bragg reflector designed based on the light converted by the phosphor part.
摘要翻译：本公开涉及一种半导体发光器件，包括：多个半导体层，其在生长衬底上顺序生长，多个半导体层包括具有第一导电性的第一半导体层，具有第二导电性的第二半导体层与第一导电率不同的有源层和介于第一半导体层和第二半导体层之间的有源层，经由电子 - 空穴复合产生具有第一波长的光; 第一电极，向多个半导体层提供电子或空穴; 第二电极，如果由第一电极提供空穴，则向多个半导体层提供电子，或者如果电子由第一电极供应，则提供空穴; 设置在生长衬底侧的第一半导体层上的荧光体部分，将在有源层中产生的第一波长的光转换为第二波长的光; 以及形成在第二半导体层上的用于将来自有源层的光朝向生长衬底侧的第一半导体层反射的非导电反射膜，其中非导电反射膜具有基于由荧光体部分转换的光。

7. 发明授权

EP2782149B1 SEMICONDUCTOR LIGHT-EMITTING DEVICE 有权转让
公开(公告)号：EP2782149B1
公开(公告)日：2022-10-19
申请号：EP13819478.2
申请日：2013-07-18
发明人： JEON, Soo Kun , PARK, Eun Hyun , KIM, Yong Deok
IPC分类号： H01L33/46 , H01L33/50 , H01L33/32 , H01L33/38 , H01L33/42 , H01L33/44

8. 发明授权

EP2782148B1 SEMICONDUCTOR LIGHT-EMITTING DEVICE 有权转让
公开(公告)号：EP2782148B1
公开(公告)日：2020-05-06
申请号：EP13819369.3
申请日：2013-07-18
申请人： Semicon Light Co., Ltd.
发明人： JEON, Soo Kun , PARK, Eun Hyun , KIM, Yong Deok
IPC分类号： H01L33/38 , H01L33/46 , H01L33/20 , H01L33/44

9. 发明公开

EP3564996A1 LED DISPLAY DEVICE 审中-公开
公开(公告)号：EP3564996A1
公开(公告)日：2019-11-06
申请号：EP17889267.5
申请日：2017-09-13
申请人： Lumens Co., Ltd.
发明人： KIM, Jinmo , KIM, Keunoh , LIM, Junhyung , NOH, Huikyeong , YOON, Seongbok , CHOI, Jinwon , HER, Jimin , SHIN, Younghwan , LEE, Kyujin , HAN, Sol
IPC分类号： H01L25/075 , H01L25/13 , H01L25/16 , H05B33/12 , H01L33/00 , H05B33/06 , G09F9/33 , H01L33/48
摘要： An LED display module is disclosed. The LED display module includes a substrate; a plurality of multi-pixel packages arrayed in a matrix with rows and columns, respectively, each of the multi-pixel packages including a package substrate and two or more pixels located on the package substrate and each of the pixels including a red LED chip, a green LED chip, and a blue LED chip; and a driver IC adapted to independently control the pixels of the multi-pixel packages. Anode terminals of the LED chips in the pixels adjacent in the row direction are connected in common to one another such that the pixels are scanned in rows in response to scan signals.

10. 发明授权

EP3116037B1 LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, LIGHTING DEVICE, AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE PACKAGE 有权
公开(公告)号：EP3116037B1
公开(公告)日：2018-03-07
申请号：EP14850112
申请日：2014-11-20
申请人： LUMENS CO LTD
发明人： OH SEUNGHYUN , LEE SEUNGHOON , NAM TEHONG , HAN KANGMIN
IPC分类号： H01L33/62 , H01L23/00 , H01L33/48
CPC分类号： H01L33/62 , G02B6/0073 , G02B6/009 , H01L24/16 , H01L24/32 , H01L24/81 , H01L24/83 , H01L33/486 , H01L33/54 , H01L33/60 , H01L2224/0401 , H01L2224/04026 , H01L2224/05553 , H01L2224/05568 , H01L2224/0615 , H01L2224/10175 , H01L2224/1132 , H01L2224/131 , H01L2224/16257 , H01L2224/26175 , H01L2224/2732 , H01L2224/291 , H01L2224/32257 , H01L2224/81192 , H01L2224/81385 , H01L2224/81815 , H01L2224/83192 , H01L2224/83385 , H01L2224/83815 , H01L2933/0066 , H01L2924/00014
摘要： Provided are a light emitting device package, a backlight unit, a lighting device and its manufacturing method. The light emitting device package may include a flip chip type light emitting device having a first pad and a second pad, a lead frame that includes a first electrode disposed at one side of an electrode separation space, and a second electrode disposed at the other side of the electrode separation space, and on which the light emitting device is mounted, a first bonding medium formed between the first pad of the light emitting device and the first electrode of the lead frame to electrically connect the first pad and the first electrode, and a second bonding medium formed between the second pad of the light emitting device and the second electrode of the lead frame to electrically connect the second pad and the second electrode, wherein at least one first accommodating cup capable of accommodating the first bonding medium is formed in the first electrode of the lead frame, wherein at least one second accommodating cup capable of accommodating the second bonding medium is formed in the second electrode of the lead frame, and wherein at least one air discharge path is formed on each of the first and second accommodating cups.

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