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1. 发明公开

EP3089562A1 PCB PROCESSING METHOD AND PCB 有权
标题翻译： VERARBEITUNGSVERFAHRENFÜRLEITERPLATTE UND LEITERPLATTE
公开(公告)号：EP3089562A1
公开(公告)日：2016-11-02
申请号：EP14875182.9
申请日：2014-05-21
申请人： ZTE Corporation
发明人： YI, Bi , MA, Fengchao , REN, Yonghui , XIONG, Wang , WANG, Yingxin
IPC分类号： H05K1/00 , H05K3/04
CPC分类号： H05K1/0298 , H05K1/09 , H05K1/115 , H05K3/0047 , H05K3/424 , H05K3/429 , H05K3/4611 , H05K3/4623 , H05K2201/10303 , H05K2203/0207 , H05K2203/16
摘要： The present invention discloses a PCB processing method and a PCB. The method includes: respectively carrying out laminating processing on a plurality of PCB daughter boards constituting a PCB according to PCB design requirements, and drilling and electroplating the top-most PCB daughter board to form a via hole; and laminating the plurality of PCB daughter boards together to form the PCB, and drilling and electroplating the formed PCB to form a through hole for mounting a connector, wherein a blind hole for mounting a connector is formed by the via hole, and a depth of the blind hole is greater than or equal to the length of a signal pin of the connector. By virtue of the technical scheme of the present invention, a space between wafers of the lower layer of PCBs may be doubled, and the space for layout between wafers may be doubled.
摘要翻译：本发明公开了一种PCB处理方法和PCB。该方法包括：根据PCB设计要求分别在构成PCB的多个PCB子板上进行层压处理，以及对最顶层PCB子板进行钻孔和电镀以形成通孔; 并且将多个PCB子板层压在一起以形成PCB，并且对所形成的PCB进行钻孔和电镀以形成用于安装连接器的通孔，其中用于安装连接器的盲孔由通孔形成，并且深度盲孔大于或等于连接器的信号引脚的长度。由于本发明的技术方案，PCB的下层的晶片之间的空间可以加倍，并且晶片之间的布局空间可以加倍。

2. 发明公开

EP3226666A1 DIFFERENTIAL SIGNAL LINE WIRING METHOD AND PCB BOARD 有权
标题翻译：差分信号线接线方法和PCB板
公开(公告)号：EP3226666A1
公开(公告)日：2017-10-04
申请号：EP15863273.7
申请日：2015-05-13
申请人： ZTE Corporation
发明人： GUO, Tao , MA, Fengchao , ZHANG, Yuanwang
IPC分类号： H05K3/00 , H05K3/10 , H05K1/02
CPC分类号： H05K3/10 , H05K1/0245 , H05K1/0248 , H05K1/0306 , H05K1/0366 , H05K2201/029
摘要： A differential signal line wiring method and PCB board, the wiring method comprising: providing a rectangular glass fabric formed by woven and interlaced glass fabrics and an adhesive filled between the glass fabrics (101); determining a wiring direction of a differential line, and acquiring the bundle number of the glass fabric in the direction, the wiring direction comprising a length direction or a width direction of the glass fabric (102); equally dividing the glass fabric in the wiring direction into glass fabric units of equal quantities and bundle number, and acquiring the width of the glass fabric unit according to the dimension and quantity in a direction of the glass fabric perpendicular to the wiring direction, the glass fabric unit comprising the glass fabrics and the adhesive in the wiring direction (103); determining a line spacing and a line width of the differential signal line according to the width of the glass fabric unit (104); and conducting wiring on a metal layer in the wiring direction according to the line spacing and the line width to form a required differential signal line, the metal layer being adhered to a surface of the glass fabric (105). The method solves the problems of high cost, large occupied space of the wiring and a long period of time for the wiring of an existing control differential signal delay line method.
摘要翻译：一种差分信号线布线方法和PCB板，所述布线方法包括：提供由机织和交织的玻璃织物和填充在玻璃织物之间的粘合剂形成的矩形玻璃织物; 确定差分线的布线方向，并获取所述玻璃纤维在所述方向上的束号，所述布线方向包括所述玻璃织物（102）的长度方向或宽度方向; 将玻璃布在布线方向上等分成等量和捆数的玻璃布单元，根据玻璃布垂直于布线方向的尺寸和数量获得玻璃布单元的宽度，在所述布线方向（103）上包括所述玻璃织物和所述粘合剂的织物单元; 根据所述玻璃纤维单元的宽度确定所述差分信号线的线间距和线宽; 以及根据线间距和线宽在布线方向上在金属层上进行布线以形成所需的差分信号线，金属层粘附到玻璃织物（105）的表面。该方法解决了现有控制差分信号延迟线方法的成本高，布线占用空间大，布线时间长的问题。

3. 发明授权

EP3226666B1 DIFFERENTIAL SIGNAL LINE WIRING METHOD AND PCB BOARD 有权
公开(公告)号：EP3226666B1
公开(公告)日：2019-06-26
申请号：EP15863273.7
申请日：2015-05-13
申请人： ZTE Corporation
发明人： GUO, Tao , MA, Fengchao , ZHANG, Yuanwang
IPC分类号： H05K1/02 , H05K1/03

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