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    • 3. 发明申请
    • METAL PROGRAMMABLE INTEGRATED CIRCUIT CAPABLE OF UTILIZING A PLURALITY OF CLOCK SOURCES AND CAPABLE OF ELIMINATING CLOCK SKEW
    • 金属可编程集成电路,可以利用多个时钟源,并能够消除时钟轴
    • US20040224443A1
    • 2004-11-11
    • US10249745
    • 2003-05-05
    • Hsin-Shih WangShang-Jyh Shieh
    • H01L021/82
    • G06F1/10H01L27/11803
    • A method for forming a metal programmable integrated circuit that can use a plurality of clock sources and balance clock skew. The integrated circuit has a semiconductor body. The method includes step (a) used for forming a plurality of basic units on the semiconductor body wherein each basic unit has at least a logic module, at least a driving module, and at least a storage module, and step (b) used for forming a metal layer for programming the logic module to be able to perform logic operations, programming the driving module to able to drive an input signal inputted into the driving module, and programming the storage module to be able to store data after performing step (a).
    • 一种用于形成可以使用多个时钟源并平衡时钟偏移的金属可编程集成电路的方法。 该集成电路具有半导体本体。 该方法包括用于在半导体本体上形成多个基本单元的步骤(a),其中每个基本单元至少具有一个逻辑模块,至少一个驱动模块和至少一个存储模块,以及步骤(b) 形成用于对所述逻辑模块进行编程以便能够执行逻辑操作的金属层,对所述驱动模块进行编程以能够驱动输入到所述驱动模块的输入信号,以及对所述存储模块进行编程,以便能够在执行步骤(a )。
    • 8. 发明申请
    • Methods to form a memory cell with metal-rich metal chalcogenide
    • 用金属富金属硫族化物形成记忆电池的方法
    • US20040157417A1
    • 2004-08-12
    • US10769787
    • 2004-02-03
    • John T. MooreTerry L. GiltonKristy A. Campbell
    • H01L021/04H01L021/8234H01L021/82H01L021/8244
    • H01L45/1675H01L27/2463H01L45/085H01L45/143H01L45/1641
    • The invention relates to the fabrication of a resistance variable material cell or programmable metallization cell. The processes described herein can form a metal-rich metal chalcogenide, such as, for example, silver-rich silver selenide. Advantageously, the processes can form the metal-rich metal chalcogenide without the use of photodoping techniques and without direct deposition of the metal. For example, the process can remove selenium from silver selenide. One embodiment of the process implants oxygen to silver selenide to form selenium oxide. The selenium oxide is then removed by annealing, which results in silver-rich silver selenide. Advantageously, the processes can dope silver into a variety of materials, including non-transparent materials, with relatively high uniformity and with relatively precise control.
    • 本发明涉及电阻可变材料单元或可编程金属化单元的制造。 本文所述的方法可形成金属富金属硫族化物,例如富银硒化银。 有利的是,该方法可以形成富含金属的金属硫属元素化物,而不需要使用光致激发技术,而不会直接沉积金属。 例如,该过程可以从硒化银中除去硒。 该方法的一个实施方案是将氧沉积到硒化银以形成氧化硒。 然后通过退火除去氧化硒,这导致富银银硒化银。 有利的是,该方法可以将银掺杂到各种材料中,包括非透明材料,具有相对高的均匀性和相对精确的控制。
    • 9. 发明申请
    • Self-passivating Cu laser fuse
    • 自钝化铜激光保险丝
    • US20040135230A1
    • 2004-07-15
    • US10745263
    • 2003-12-23
    • Hans-Joachim Barth
    • H01L021/82H01L029/00
    • H01L23/5258H01L2924/0002H01L2924/00
    • In an integrated circuit structure, the improvement comprising a self-passivating Cu-laser fuse characterized by resistance to oxidation and corrosion and improved adhesion in the interface between Cu and metallization lines and Cu and a dielectric cap subsequent to blowing the fuse by an energizing laser, the fuse comprising: a metallization-line; a liner separating the metallization line and a combination Cu-alloy seed layer and a pure Cu layer; a dielectric surrounding the liner; and a dielectric cap disposed over the surrounding dielectric, the liner and the combination Cu-alloy seed layer and pure Cu layer; the laser fuse being characterized after laser energizing by passivation areas: a) on the open Cu-fuse surface; and b) in the interfaces between: (i) the Cu-alloy seed layer and the liners and dielectric; and (ii) between the pure Cu layer and the dielectric cap.
    • 在集成电路结构中,改进包括自钝化铜激光熔丝,其特征在于抗氧化和腐蚀,并且在Cu和金属化线之间的界面中改善粘合性,并且通过激励激光器熔化熔丝后的Cu和介电帽 所述保险丝包括:金属化线; 分离金属化线和组合的Cu合金种子层和纯Cu层的衬里; 围绕衬套的电介质; 以及设置在周围电介质,衬垫和组合Cu合金晶种层和纯Cu层上的电介质盖; 激光熔丝的特征在于钝化区域激光激励后:a)在开放的Cu熔丝表面上; 和b)在以下界面中:(i)Cu合金种子层和衬垫和电介质; 和(ii)在纯Cu层和电介质盖之间。