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1. 发明申请

US20040228707A1 System and method for moving substrates in and out of a manufacturing process 有权
标题翻译：将基板移入和移出制造过程的系统和方法
公开(公告)号：US20040228707A1
公开(公告)日：2004-11-18
申请号：US10871007
申请日：2004-06-21
发明人： Min-Young Heo , Sung-Joon Byun , Jung-Teak Lim , Byung-Kwen Park
IPC分类号： B65G001/00 , B65G065/00 , B65G049/07
CPC分类号： H01L21/67276 , Y10S414/14
摘要： Disclosed is a system for moving substrates in and out of a manufacturing process. The present invention comprises an automatic transfer device for automatically transferring a cassette that stores substrates, a manual transfer device for transferring the cassette according to instructions of an operator, and a process apparatus for performing predetermined jobs on the substrate stored in the cassette, wherein the process apparatus comprises: a port on which the cassette is temporarily placed by the automatic transfer device or the manual transfer device; a loader which has a sensor to receive a communication start signal transferred from the automatic transfer device when the cassette is transferred by the automatic transfer device; and a job table on which actual jobs on the substrates, stored in the cassette, are performed, and wherein when the cassette is placed on the port, the process apparatus checks whether the communication start signal is received by the sensor, and when the signal is received, it is determined that the cassette has been transferred by the automatic transfer device, such that the process apparatus is set in an automatic transfer mode, and when the signal is not received, it is determined that the cassette has been transferred by the manual transfer device, and therefore, the process apparatus is set in a manual transfer mode. The present invention improves productivity and efficiency.
摘要翻译：公开了一种用于将基板移入和移出制造过程的系统。本发明包括用于自动转印存储基板的盒的自动转印装置，用于根据操作者的指令传送纸盒的手动转印装置，以及用于在存储在纸盒中的基板上执行预定作业的处理装置，其中，处理装置包括：通过自动传送装置或手动传送装置临时放置盒的端口; 装载机，其具有传感器，用于当所述盒由所述自动传送装置传送时接收从所述自动传送装置传送的通信开始信号; 以及作业台，在其上进行存储在盒中的基板上的实际作业，并且其中当盒被放置在端口上时，处理装置检查传感器是否接收到通信开始信号，并且当信号被接收时，确定该盒式磁带已经被自动传送装置传送，使得处理装置被设置为自动传送模式，并且当该信号未被接收时，确定盒式磁带已被传送手动传送装置，因此，处理装置被设定为手动传送模式。本发明提高了生产率和效率。

2. 发明申请

US20040219006A1 Lift pin assembly for substrate processing 有权
标题翻译：提升销组件进行基板加工
公开(公告)号：US20040219006A1
公开(公告)日：2004-11-04
申请号：US10428967
申请日：2003-05-01
申请人： Applied Materials, Inc.
发明人： Toan Q. Tran , Daniel S. Herkalo , Yen-Kun V. Wang , Jin Ho Lee , Dong Hyung Lee , Jang Seok Oh , Won B. Bang
IPC分类号： B65G049/07
CPC分类号： H01L21/68742
摘要： Embodiments of the present invention provide an apparatus for constraining and supporting the lift pins to prevent or minimize lateral movement of the lift pins that causes substrate hand-off problems and associated degradation in substrate processing characteristics and results. In one embodiment, a lift pin assembly for manipulating a substrate above a support surface of a substrate support comprises a plurality of lift pins movable between an up position and a down position. The lift pins include top ends and bottom ends. The top ends are configured to be lifted above the support surface of the substrate support to contact a bottom surface of the substrate in the up position. The top ends are configured to be positioned at or below the support surface of the substrate support in the down position. A lift pin connecting member is attached to the plurality of lift pins at attachment locations at or near the bottom ends of the lift pins to maintain fixed relative distances between the lift pins at the attachment locations and to move with the lift pins between the up position and the down position.
摘要翻译：本发明的实施例提供了一种用于约束和支撑提升销的装置，以防止或最小化提升销的横向移动，这导致基板切换问题以及相关的基板处理特性和结果的退化。在一个实施例中，用于在衬底支撑件的支撑表面上方操作衬底的提升销组件包括可在上升位置和下降位置之间移动的多个提升销。提升销包括顶端和底端。顶端构造成被提升在基板支撑件的支撑表面上方以在上方位置接触基板的底表面。顶端构造成位于下方位置处的基板支撑件的支撑表面上或下方。提升销连接构件在提升销的底端处或附近的附接位置处附接到多个提升销，以在附接位置处保持提升销之间的固定的相对距离，并且随着提升销在上部位置之间移动和下降位置。

3. 发明申请

US20040105742A1 Semiconductor manufacturing system 审中-公开
标题翻译：半导体制造系统
公开(公告)号：US20040105742A1
公开(公告)日：2004-06-03
申请号：US10334797
申请日：2003-01-02
发明人： Seung-Kap Park , Jeong-Ho Yoo
IPC分类号： B65G049/07
CPC分类号： H01L21/67309
摘要： Provided is a semiconductor manufacturing system. The semiconductor manufacturing system includes a wafer loading boat, a complementary wafer loading boat, a door assembly, and a spacing controlling system. The wafer loading boat is mounted in the reaction tube and includes a plurality of wafer supporters on which the semiconductor wafer is rested on. The complementary wafer loading boat is located inside or outside of the wafer loading boat, moves vertically, includes a wafer holder that is devised to support the semiconductor wafer. The contact between the wafer and the holder in the center part of the wafer other than edges of the wafer is adjusted by moving one of the wafer loading boats vertically. The spacing controlling system is mounted in the door assembly, controls a space between the semiconductor wafer and the wafer holder, and maintains or adjusts a contact area of the semiconductor wafer with the wafer holder dynamically during the thermal processing. Thus, the mechanical deformation including warping, bowing, slip can be completely eliminated by supporting the wafer in the center part of the wafer with controlled contact area, resulting from ideal distribution of the gravitational force of the wafer. Also the reliability, uniformity and reproducibility of the thermal processing steps can be significantly enhanced due to the ability to control the gap between the wafer and the holder, and to control the contact area between the wafer and the holder dynamically even during the process at high temperatures, which has been never possible in the previous arts. In addition, it is possible to perform the thermal process without any mechanical damages to the semiconductor wafer having a diameter of 300 mm (12 inches) or greater.
摘要翻译：提供半导体制造系统。半导体制造系统包括晶片加载舟，互补晶片加载舟，门组件和间隔控制系统。晶片加载舟安装在反应管中，并且包括多个晶片支撑体，半导体晶片放在其上。互补晶片装载舟皿位于晶片装载船的内部或外部，垂直移动，包括设计用于支撑半导体晶片的晶片保持器。通过垂直移动晶片加载舟中的一个来调节晶片和晶片的除了晶片边缘之外的中心部分中的保持器之间的接触。间隔控制系统安装在门组件中，控制半导体晶片和晶片保持器之间的空间，并且在热处理期间动态地维持或调整半导体晶片与晶片保持器的接触面积。因此，由晶片的重力的理想分布所导致的，具有受控的接触面积的晶片的中心部分支撑晶片，可以完全消除包括翘曲，弯曲，滑动在内的机械变形。此外，由于能够控制晶片和保持器之间的间隙，并且即使在高处理期间动态地控制晶片和保持器之间的接触面积，也可以显着增强热处理步骤的可靠性，均匀性和再现性温度，这在以前的艺术中是永远不可能的。此外，可以对直径为300mm（12英寸）或更大的半导体晶片进行任何机械损伤的热处理。

4. 发明申请

US20040062633A1 System for transporting substrate carriers 有权
标题翻译：用于运输衬底载体的系统
公开(公告)号：US20040062633A1
公开(公告)日：2004-04-01
申请号：US10650310
申请日：2003-08-28
申请人： APPLIED MATERIALS, INC.
发明人： Michael Robert Rice , Robert B. Lowrance , Martin R. Elliott , Jeffrey C. Hudgens , Eric A. Englhardt
IPC分类号： B65G049/07
CPC分类号： H01L21/67276 , H01L21/67769 , H01L21/67778
摘要： In a semiconductor fabrication facility, a conveyor transports substrate carriers. The substrate carriers are unloaded from the conveyor and loaded onto the conveyor without stopping the conveyor. A load and/or unload mechanism lifts the substrate carriers from the conveyor during unloading operations, while matching the horizontal speed of the conveyor. Similarly, during loading operations, the load/unload mechanism lowers a substrate carrier into engagement with the conveyor while matching the horizontal speed of the conveyor. Individual substrates, without carriers, may be similarly loaded and/or unloaded from a conveyor.
摘要翻译：在半导体制造设备中，输送机输送基板载体。基板载体从输送机卸载并装载到输送机上而不停止输送机。在卸载操作期间，负载和/或卸载机构将基板载体从输送机提升，同时匹配输送机的水平速度。类似地，在装载操作期间，装载/卸载机构降低了基板载体与输送机的接合，同时匹配输送机的水平速度。没有载体的单个基底可以类似地从输送机装载和/或卸载。

5. 发明申请

US20040052624A1 Automated guided vehicle 失效
标题翻译：自动导引车
公开(公告)号：US20040052624A1
公开(公告)日：2004-03-18
申请号：US10416168
申请日：2003-05-16
发明人： Ken Miyano , Takahiko Murayama , Takashi Nakao , Shuji Akiyama
IPC分类号： B60P001/64 , B65G049/07
CPC分类号： H01L21/6835 , H01L21/67092 , H01L21/67265 , H01L21/673 , H01L21/6735 , H01L21/67724 , H01L21/67763 , H01L21/681
摘要： In an automated guided vehicle including a transfer equipment which transfers a wafer, a buffer cassette which temporarily stores the wafer, and a pressing member which is provided at an opening of the buffer cassette, when traveling the automated guided vehicle, if the pressing member is slid to a center position from an end position of the opening of the buffer cassette to contact and press against the edge of the wafer, the pressing member was easily damaged by being rubbed against a periphery of the wafer, and there was a problem in durability of the pressing member. The pressing member 55 can transfer between a nullpressingnull position which contacts against the edge of the wafer 10 to press the wafer 10, and a nullrecedingnull position which is located away from the edge of the wafer 10. A transferring direction A of the pressing member 55 of a moment in which the pressing member 55 contacts against the edge of the wafer 10 when the pressing member 55 transfers from the nullrecedingnull position to the nullpressingnull position, is approximately perpendicular to an outline of the part of the wafer 10 contacted against the pressing member 55.
摘要翻译：在包括传送晶片的传送设备，临时存储晶片的缓冲盒和设置在缓冲盒的开口处的按压构件的自动引导车辆中，当行进自动引导车辆时，如果按压构件是从缓冲盒的开口的端部位置滑动到中心位置以接触并压靠晶片的边缘，由于与晶片的周边摩擦而使按压部件容易损坏，并且存在耐久性问题的按压构件。按压构件55可以在与晶片10的边缘接触以按压晶片10的“按压”位置之间传递，以及位于远离晶片10的边缘的“后退”位置。传送方向A 当按压构件55从“后退”位置转移到“按压”位置时，按压构件55接触到晶片10的边缘的时刻的按压构件55大致垂直于晶片10与按压部件55接触。

6. 发明申请

US20040002299A1 Ventilation system and method of using 审中-公开
标题翻译：通风系统及使用方法
公开(公告)号：US20040002299A1
公开(公告)日：2004-01-01
申请号：US10185864
申请日：2002-06-27
申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
发明人： Mu-Tsang Lin , Yu-Chih Liou , Tu-Yi Chiu , Ji-Liang Wu , Wie-Liang Tsai
IPC分类号： H05K005/00 , B65G049/07
CPC分类号： H01L21/67201 , H01L21/67017
摘要： The present invention provides a ventilation system and method that operates to remove outgassing of chemicals formed on a wafer during a wafer fabrication process to prevent contamination in a sealed wafer handling chamber. More particularly, the present invention discloses a ventilation system having a hood body having a gas supply conduit attached to a sealed outer side chamber of the ventilation hood such that contaminating particles in an interior of the hood are carried out by a purge gas flown into the hood interior through an inlet of the hood connected to the gas supply conduit into a facility vacuum exhaust system attached to an outlet of the hood. Preferably, the chamber is a load-lock chamber that operates to perform load lock processing on wafers and further operates to load and unload wafers to another location for further processing after using the ventilation system.
摘要翻译：本发明提供了一种通风系统和方法，其操作以在晶片制造过程中除去在晶片上形成的化学物质的除气，以防止密封的晶片处理室中的污染。更具体地说，本发明公开了一种通风系统，其具有罩主体，该主体具有附接到通风罩的密封外侧室的气体供给导管，使得罩内部的污染颗粒通过流入机罩内部通过连接到气体供应管道的发动机罩的入口进入连接到发动机罩的出口的设备真空排气系统。优选地，室是负载锁定室，其操作以在晶片上执行负载锁定处理，并进一步操作以将晶片加载和卸载到另一位置，以在使用通气系统之后进行进一步处理。

7. 发明申请

US20030152445A1 Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections 有权
标题翻译：半导体处理设备包括分隔成反应和转移段的腔室
公开(公告)号：US20030152445A1
公开(公告)日：2003-08-14
申请号：US10072620
申请日：2002-02-08
发明人： Takayuki Yamagishi , Masaei Suwada , Takeshi Watanabe
IPC分类号： B65G049/07
CPC分类号： H01L21/67742 , H01L21/67748 , Y10S414/139
摘要： Semiconductor processing equipment that has increased efficiency, throughput, and stability, as well as reduced operating cost, footprint, and faceprint is provided. Other than during deposition, the atmosphere of both the reaction chamber and the transfer chamber are evacuated using the transfer chamber exhaust port, which is located below the surface of the semiconductor wafer. This configuration prevents particles generated during wafer transfer or during deposition from adhering to the surface of the semiconductor wafer. Additionally, by introducing a purge gas into the transfer chamber during deposition, and by using an insulation separating plate 34, the atmospheres of the transfer and reaction chambers can be effectively isolated from each other, thereby preventing deposition on the walls and components of the transfer chamber. Finally, the configuration described herein permits a wafer buffer mechanism to be used with the semiconductor processing equipment, thereby further increasing throughput and efficiency.
摘要翻译：提供了提高效率，吞吐量和稳定性以及降低运营成本，占地面积和面部印刷的半导体处理设备。除了沉积之外，使用位于半导体晶片表面下方的转移室排气口将反应室和转移室的气氛抽真空。这种构造防止在晶片转移期间或在沉积期间产生的颗粒粘附到半导体晶片的表面。此外，通过在沉积期间将吹扫气体引入转移室，并且通过使用绝缘分隔板34，可以有效地将转移室和反应室的气氛彼此隔离，从而防止沉积在转移的壁和组分上房间。最后，本文描述的配置允许晶片缓冲机构与半导体处理设备一起使用，从而进一步提高吞吐量和效率。

8. 发明申请

US20030147728A1 Wafer transport pod with linear door opening mechanism 失效
标题翻译：晶圆运输荚带线性开门机构
公开(公告)号：US20030147728A1
公开(公告)日：2003-08-07
申请号：US10072704
申请日：2002-02-07
申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
发明人： Hsien-Hua Tseng , Chia-Hung Chung
IPC分类号： B65G049/07
CPC分类号： H01L21/67373 , H01L21/67772 , Y10S414/14
摘要： A pod for transporting a cassette of semiconductor wafers that is equipped with a linearly operated door opening/closing mechanism is provided. The pod includes a body member, a cover member and a latch means carried on the cover member for latching the cover member onto the body member. The latch means is acuatable and operable linearly from a latched condition in which the cover member is latched onto the body member to a released condition allowing removal of the cover member from the body member when engaged linearly by a latch key of a door opener situated in a loadport onto which the cassette pod is positioned.
摘要翻译：提供一种用于运送装有线性操作的门开/关机构的半导体晶片盒的盒。荚包括主体构件，盖构件和承载在盖构件上的闩锁装置，用于将盖构件锁定在主体构件上。闩锁装置是可插拔的并且可以从锁定状态线性地操作，其中盖构件被锁定到主体构件上以释放状态，从而当位于其中的开门器的闩锁键线性地接合时允许从主体构件移除盖构件磁带盒的定位位置。

9. 发明申请

US20030108417A1 Semiconductor chip assembly system with a suction nipple for removing a semiconductor chip 失效
标题翻译：具有用于去除半导体芯片的吸嘴的半导体芯片组装系统
公开(公告)号：US20030108417A1
公开(公告)日：2003-06-12
申请号：US10314175
申请日：2002-12-06
发明人： Gerhard Holzapfel , Raimund Schindler
IPC分类号： B65G049/07
CPC分类号： H01L21/6835 , H01L21/6838 , H01L24/75 , H01L2221/68322 , H05K13/021 , H05K13/0409
摘要： A semiconductor chip assembly system has a suction nipple for picking up a semiconductor chip from a carrier film. For this purpose, the suction nipple has a dimensionally stable cylindrical mouthpiece with a suction bore. The mouthpiece is adjoined by a rubber-elastic region of the suction nipple and goes over into a dimensionally stable suction tube attachment of the suction nipple.
摘要翻译：半导体芯片组装系统具有用于从载体膜拾取半导体芯片的吸嘴。为此，吸嘴具有尺寸稳定的带有吸孔的圆筒形接口。接口与吸嘴的橡胶弹性区相邻，并进入吸嘴的尺寸稳定的吸管附件。

10. 发明申请

US20030082032A1 Wafer management system and methods for managing wafers 失效
标题翻译：晶圆管理系统和晶圆管理方法
公开(公告)号：US20030082032A1
公开(公告)日：2003-05-01
申请号：US10016610
申请日：2001-10-30
申请人： Motorola, Inc.
发明人： Richard McGowan
IPC分类号： B65G049/07
CPC分类号： H01L21/67727 , H01L21/67769 , Y10S414/135 , Y10S414/14
摘要： A wafer management system has a first stationary wafer storage system (100) with a first buffer (110) for storing a plurality of wafers in slots, a first load-and-unload station (115) for transferring the wafers between the first buffer (110) and intra-bay pods (120, 130) assigned to a first bay (160), and a second load-and-unload station (184) for transferring wafers between the first buffer (110) and further pods (520, 530). The storage system (100) and the bay (160) form a single unit. Multiple units are linked together by tracks (500).
摘要翻译：晶片管理系统具有第一固定晶片存储系统（100），第一固定晶片存储系统（100）具有用于在槽中存储多个晶片的第一缓冲器（110），第一负载和卸载站（115），用于在第一缓冲器 110）和分配给第一间隔（160）的舱内舱（120,130）和用于在第一缓冲器（110）和另外的舱（520,530）之间传送晶片的第二负载和卸载站（184））。存储系统（100）和托架（160）形成单个单元。多个单元通过轨道（500）链接在一起。

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