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1. 发明公开

CN1806339A 用于微结构和半导体器件的新封装方法无效
公开(公告)号：CN1806339A
公开(公告)日：2006-07-19
申请号：CN200480016667.5
申请日：2004-05-24
申请人：反射公司
发明人： T·达恩
IPC分类号： H01L29/22
CPC分类号： B81C1/00269 , B81C2203/0181 , G02B26/0841 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/16195 , Y10T156/10 , H01L2924/00
摘要：本发明提供了一种封装电子器件(例如接收或发送电子信号的任何器件)的新方法，上述电子器件包括微机电器件、半导体器件、发光器件、光调制器件及光检测器件。电子器件被置于两个衬底之间，其中的至少一个衬底具有一个用于容纳所述电子器件的空腔。随后，两个衬底被结合在一起，并用密封介质对它们进行气密密封。密封介质对衬底的粘附力，特别是当两个衬底中的一个为陶瓷时，可通过对该衬底的表面施加一个金属化层而得到改善。

2. 发明公开

CN106904569A 在激光再封闭时有针对性地控制吸收特性有权
公开(公告)号：CN106904569A
公开(公告)日：2017-06-30
申请号：CN201611108181.5
申请日：2016-12-06
申请人：罗伯特·博世有限公司
发明人： M·阿梅特沃布拉 , P·卡佩
IPC分类号： B81C1/00 , G01P15/08 , G01C19/5769 , B81B7/02 , B23K26/18
CPC分类号： B81C1/00325 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81C2203/0109 , B81C2203/0145 , B81C2203/0181 , B81C1/00015 , B23K26/18 , G01C19/5769 , G01P15/08
摘要：本发明提出一种用于制造微机械构件的方法，该微机械构件具有衬底和与衬底连接并且与衬底包围第一空穴的罩，其中，在第一空穴中存在第一压力并且包含具有第一化学组分的第一气体混合物，其中，‑在第一方法步骤中，在衬底或在罩中构造连接第一空穴与微机械构件周围环境的进入开口，其中，‑在第二方法步骤中，调节在第一空穴中的第一压力和/或第一化学组分，其中，‑在第三方法步骤中，通过借助于激光将能量或热量引入到衬底或罩的吸收部分中来封闭进入开口，其特征在于，通过调节吸收部分的延伸尺度并且通过调节在吸收部分中的吸收强度以使在衬底或罩中出现的应力最小化，来进行能量或热量的引入。

3. 发明授权

US6086705A Bonding of micro elements 有权
标题翻译：微元件粘合
公开(公告)号：US6086705A
公开(公告)日：2000-07-11
申请号：US152669
申请日：1998-09-14
申请人： Shih-Ping Lee , Kuo-Kang Liu
发明人： Shih-Ping Lee , Kuo-Kang Liu
IPC分类号： B81C3/00 , H01L21/60 , B32B31/24 , H05K3/30
CPC分类号： B81C3/001 , H01L24/80 , B81C2203/0181 , H01L2924/01013 , H01L2924/01025 , H01L2924/01033 , H01L2924/01049 , H01L2924/01078 , H01L2924/014 , Y10T29/4913
摘要： A novel method for bonding of micro elements with in-situ bonding means is disclosed. Suited bonding means include heating coils and bonding materials. The bonding means are provided in the elements to be bonded during their preparation. While the elements are bonded, electric power is applied to the heating coil such that the bonding material is melt and that the elements are bonded. An elastic calibration means is provided in at least one of the elements to be bonded such that the distance and parallelism of the elements may be calibrated during the bonding process.
摘要翻译：公开了一种用于与原位接合装置结合微元件的新颖方法。适合的接合装置包括加热线圈和接合材料。接合装置在其制备期间被提供在待结合的元件中。当元件结合时，将电力施加到加热线圈，使得接合材料熔化并且元件被接合。在待接合的元件中的至少一个元件中提供弹性校准装置，使得可以在接合过程期间校准元件的距离和平行度。

4. 发明公开

EP1625623A2 A NOVEL PACKAGING METHOD FOR MICROSTRUCTURE AND SEMICONDUCTOR DEVICES 审中-公开
标题翻译：新型封装微结构和半导体器件
公开(公告)号：EP1625623A2
公开(公告)日：2006-02-15
申请号：EP04753277.5
申请日：2004-05-24
申请人： Reflectivity Inc.
发明人： TARN, Terry
IPC分类号： H01L29/22
CPC分类号： B81C1/00269 , B81C2203/0181 , G02B26/0841 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/16195 , Y10T156/10 , H01L2924/00
摘要： A novel method of packaging electronic devices (105) (e.g. any device that receives or transmits electronic signals) including microelectromechanical devices, semiconductor devices, light emitting devices, light modulating devices, and light detecting device has been provided herein. The electronic device (105) is placed between two substrates (102, 110), at least one of which has a cavity for holding the electronic device. The two substrates are then bonded and hermetically sealed with a sealing medium (106). The adhesion of the healing medium (106) to the substrates, especially when one of the two substrate is ceramic, can be improved by applying a metallization layer (104) to the surface of the substrate.

5. 发明申请

US20120180949A1 Microelectromechanical Device Packages with Integral Heaters 审中-公开
标题翻译：带集成加热器的微机电器件封装
公开(公告)号：US20120180949A1
公开(公告)日：2012-07-19
申请号：US11872825
申请日：2007-10-16
申请人： Terry Tarn
发明人： Terry Tarn
IPC分类号： B32B37/06 , B23K11/00 , B23K1/20 , B32B37/14 , B23K31/02
CPC分类号： B81C1/00269 , B81C2203/0181 , G02B26/0841 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/16195 , Y10T156/10 , H01L2924/00
摘要： A microelectromechanical device package with integral a heater and a method for packaging the microelectromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate and second substrate, between which a microelectromechanical device, such as a micromirror array device is located. In order to bonding the first and second package substrates so as to package the microelectromechanical device inside, a sealing medium layer is deposited, and heated by the heater so as to bond the first and second package substrates together.
摘要翻译：具有集成加热器的微机电装置封装和用于封装微机电装置的方法在本发明中公开。微机电器件封装包括第一封装衬底和第二衬底，微机电器件如微镜阵列器件之间位于该第一衬底和第二衬底之间。为了将第一和第二封装基板接合以将微机电装置封装在内部，密封介质层被沉积并被加热器加热，以将第一和第二封装基板接合在一起。

6. 发明授权

US07402878B2 Packaging method for microstructure and semiconductor devices 有权
标题翻译：微结构和半导体器件的封装方法
公开(公告)号：US07402878B2
公开(公告)日：2008-07-22
申请号：US10852981
申请日：2004-05-24
申请人： Terry Tarn
发明人： Terry Tarn
IPC分类号： H01L27/088
CPC分类号： B81C1/00269 , B81C2203/0181 , G02B26/0841 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/16195 , Y10T156/10 , H01L2924/00
摘要： A novel method of packaging electronic devices (e.g. any device that receives or transmits electronic signals) including microelectromechanical devices, semiconductor devices, light emitting devices, light modulating devices, light modulating devices, and light detecting device has been provided herein. The electronic device is placed between two substrates, at least one of which has a cavity for holding the electronic device. The two substrates are then bonded and hermetically sealed with a sealing medium. The adhesion of the sealing medium to the substrates, especially when one of the two substrates is ceramic, can be improved by applying a metallization layer to the surface of the substrate.
摘要翻译：本文提供了一种包括微机电装置，半导体装置，发光装置，光调制装置，光调制装置和光检测装置的电子装置（例如接收或发射电子信号的装置）的新颖方法。电子设备放置在两个基板之间，其中至少一个具有用于保持电子设备的空腔。然后将两个基板粘合并用密封介质气密密封。通过将金属化层施加到基板的表面，可以改善密封介质对基板的粘合性，特别是当两个基板之一是陶瓷时。

7. 发明授权

US06326682B1 Hermetically sealed transducer and methods for producing the same 有权
标题翻译：密封式传感器及其制造方法
公开(公告)号：US06326682B1
公开(公告)日：2001-12-04
申请号：US09217877
申请日：1998-12-21
申请人： Anthony D. Kurtz , Alexander Ned
发明人： Anthony D. Kurtz , Alexander Ned
IPC分类号： H01L2302
CPC分类号： B81B7/0077 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81C1/00269 , B81C2203/0181
摘要： A reduced size, hermetically sealed semiconductor transducer and methods for fabricating the same. In a preferred embodiment, the transducer comprises a transducer wafer including a diaphragm which deflects upon the application of a force thereto. At least one semiconductor transducer element and one electrical contact are disposed on a top surface of the transducer wafer, with the electrical contact coupled to the semiconductor element and extending to a peripheral portion of the wafer. A cover member is provided that is dimensioned to surround the semiconductor element. A peripheral glass frit bond is formed between the cover member and the transducer wafer, and between the cover member and at least a portion of the electrical contact. An aperture is formed in a top portion of the cover member, positioned above a region bounded by the peripheral glass bond. This aperture functions to prevent air gap formation in the peripheral glass frit bond. A sealing member hermetically seals the aperture, whereby a vacuum is maintained between the transducer element and the cover member, the transducer element thereby being hermetically sealed from the external environment, while at least a portion of the electrical contact remains exposed to enable subsequent wire bonding thereto.
摘要翻译：尺寸减小，密封的半导体换能器及其制造方法。在优选实施例中，换能器包括换能器晶片，其包括在施加力时偏转的隔膜。至少一个半导体换能器元件和一个电触点设置在换能器晶片的顶表面上，其中电触点耦合到半导体元件并延伸到晶片的周边部分。设置有围绕半导体元件的盖构件。在盖构件和换能器晶片之间以及在盖构件和至少一部分电接触件之间形成周边玻璃料接合。在盖构件的顶部形成有孔，位于由周边玻璃接合界定的区域的上方。该孔用于防止外围玻璃料接合中的气隙形成。密封构件气密地密封孔，由此在换能器元件和盖构件之间保持真空，因此换能器元件与外部环境气密密封，同时电触点的至少一部分保持暴露以使得能够接下来的引线键合到此。

8. 发明申请

WO2004107829A2 A NOVEL PACKAGING METHOD FOR MICROSTRUCTURE AND SEMICONDUCTOR DEVICES 审中-公开
标题翻译：一种用于微结构和半导体器件的新型封装方法
公开(公告)号：WO2004107829A2
公开(公告)日：2004-12-09
申请号：PCT/US2004/016421
申请日：2004-05-24
申请人： REFLECTIVITY, INC. , TARN, Terry
发明人： TARN, Terry
IPC分类号： H05K
CPC分类号： B81C1/00269 , B81C2203/0181 , G02B26/0841 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/16195 , Y10T156/10 , H01L2924/00
摘要： A novel method of packaging electronic devices (e.g. any device that receives or transmits electronic signals) including microelectromechanical devices, semiconductor devices, light emitting devices, light modulating devices, and light detecting device has been provided herein. The electronic device is placed between two substrates, at least one of which has a cavity for holding the electronic device. The two substrates are then bonded and hermetically sealed with a sealing medium. The adhesion of the sealing medium to the substrates, especially when one of the two substrates is ceramic, can be improved by applying a metallization layer to the surface of the substrate.
摘要翻译：本文提供了一种包括微机电装置，半导体装置，发光装置，光调制装置和光检测装置的电子装置（例如接收或发送电子信号的装置）的新颖方法。电子设备放置在两个基板之间，其中至少一个具有用于保持电子设备的空腔。然后将两个基板粘合并用密封介质气密密封。密封介质对基材的粘附，特别是当两个基材中的一个是陶瓷时，可以通过将金属化层施加到基材的表面来改善。

9. 发明申请

WO2004106221A2 MICROELECTROMECHANICAL DEVICE PACKAGES WITH INTEGRAL HEATERS 审中-公开
标题翻译：具有整体加热器的微电子设备包装
公开(公告)号：WO2004106221A2
公开(公告)日：2004-12-09
申请号：PCT/US2004014895
申请日：2004-05-12
申请人： REFLECTIVITY INC , TARN TERRY
发明人： TARN TERRY
IPC分类号： B81B7/00 , G02B26/08 , H01L23/10 , B81B
CPC分类号： B81C1/00269 , B81C2203/0181 , G02B26/0841 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/16195 , Y10T156/10 , H01L2924/00
摘要： A microelectromechanical device package with integral a heater and a method for packaging the micro-electromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate and second substrate, between which a microelectromechanical device, such as a micromirror array device is located. In order to bonding the first and second package substrates so as to package the microelectromechanical device inside, a sealing medium layer is deposited, and heated by the heater so as to bond the first and second package substrates together.
摘要翻译：具有集成加热器的微机电装置封装和用于封装微机电装置的方法在本发明中公开。微机电器件封装包括第一封装衬底和第二衬底，微机电器件如微镜阵列器件之间位于该第一衬底和第二衬底之间。为了将第一和第二封装基板接合以将微机电装置封装在内部，密封介质层被沉积并被加热器加热，以将第一和第二封装基板接合在一起。

10. 发明申请

WO2004107829A3 A NOVEL PACKAGING METHOD FOR MICROSTRUCTURE AND SEMICONDUCTOR DEVICES 审中-公开
标题翻译：一种用于微结构和半导体器件的新型封装方法
公开(公告)号：WO2004107829A3
公开(公告)日：2005-08-11
申请号：PCT/US2004016421
申请日：2004-05-24
申请人： REFLECTIVITY INC , TARN TERRY
发明人： TARN TERRY
IPC分类号： B81B7/00 , G02B26/08 , H01L23/10 , H01L29/22
CPC分类号： B81C1/00269 , B81C2203/0181 , G02B26/0841 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/16195 , Y10T156/10 , H01L2924/00
摘要： A novel method of packaging electronic devices (105) (e.g. any device that receives or transmits electronic signals) including microelectromechanical devices, semiconductor devices, light emitting devices, light modulating devices, and light detecting device has been provided herein. The electronic device (105) is placed between two substrates (102, 110), at least one of which has a cavity for holding the electronic device. The two substrates are then bonded and hermetically sealed with a sealing medium (106). The adhesion of the healing medium (106) to the substrates, especially when one of the two substrate is ceramic, can be improved by applying a metallization layer (104) to the surface of the substrate.
摘要翻译：本文提供了一种包括微机电装置，半导体装置，发光装置，光调制装置和光检测装置的电子装置（105）（例如接收或发送电子信号的装置）的新型方法。电子设备（105）被放置在两个基板（102,110）之间，其中至少一个具有用于保持电子设备的空腔。然后将两个基板粘合并用密封介质（106）气密密封。通过将金属化层（104）施加到基板的表面，可以改善愈合介质（106）对基板的粘附，特别是当两个基板中的一个是陶瓷时。

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