专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2014060431A Multilayer wiring element having pin interface 有权
标题翻译：具有接口接口的多层接线元件
公开(公告)号：JP2014060431A
公开(公告)日：2014-04-03
申请号：JP2013238596
申请日：2013-11-19
申请人： Tessera Inc , テッセラ,インコーポレイテッド
发明人： BELGACEM HABA
IPC分类号： H05K3/46
CPC分类号： H05K3/4007 , H01L21/4853 , H01L23/49811 , H01L23/49833 , H01L24/16 , H01L24/48 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/181 , H05K3/06 , H05K3/4652 , H05K2201/0355 , H05K2201/0361 , H05K2203/0384 , Y10T29/49144 , Y10T29/49165 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide a method of forming contacts for an interconnection element.SOLUTION: A method of forming contacts for an interconnection element includes the steps of: joining a conductive element 16 to an interconnection element 10 having multiple wiring layers; patterning the conductive element 16 to form conductive pins 20; and electrically interconnecting the conductive pins 20 with conductive features of the interconnection element 10. The interconnection element 10 has the multiple wiring layers separated by at least one dielectric layer 24, the multiple wiring layers including the plurality of conductive features exposed at a first face of the interconnection element 10; the plurality of conductive pins 20 protruding in a direction away from the first face; and metal traces 22 electrically interconnecting the conductive features with the conductive pins 20.
摘要翻译：要解决的问题：提供一种形成用于互连元件的触点的方法。解决方案：形成用于互连元件的触点的方法包括以下步骤：将导电元件16接合到具有多个布线层的互连元件10; 图案化导电元件16以形成导电销20; 并且将导电引脚20与互连元件10的导电特征电互连。互连元件10具有由至少一个介电层24隔开的多个布线层，多个布线层包括在第一面处暴露的多个导电特征互连元件10; 所述多个导电销20沿远离所述第一面的方向突出; 以及将导电特征与导电针20电连接的金属迹线22。

2. 发明专利

JP2013058763A Edge connect wafer level stacking 有权
标题翻译：边缘连接水平堆叠
公开(公告)号：JP2013058763A
公开(公告)日：2013-03-28
申请号：JP2012225973
申请日：2012-10-11
申请人： Tessera Inc , テッセラ,インコーポレイテッド
发明人： BELGACEM HABA , VAGE OGANESIAN
IPC分类号： H01L25/065 , H01L25/07 , H01L25/10 , H01L25/11 , H01L25/18
CPC分类号： H01L25/0657 , H01L21/78 , H01L23/5382 , H01L24/48 , H01L25/50 , H01L2224/24145 , H01L2224/48091 , H01L2224/48145 , H01L2225/06506 , H01L2225/0651 , H01L2225/06517 , H01L2225/06524 , H01L2225/06541 , H01L2225/06551 , H01L2225/06568 , H01L2225/06582 , H01L2924/00014 , H01L2924/01004 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide stacked microelectronic packages fabricated at a wafer level, and methods of making such packages.SOLUTION: A stacked assembly 280 is formed by stacking a first subassembly 210 including a plurality of microelectronic elements onto a second subassembly 210 including a plurality of microelectronic elements, and has traces extending to their edges. In the assembly, notches partway through the microelectronic assembly are then formed so as to expose the traces, and leads 2666 are subsequently formed at the sidewalls of the notches to provide ends 2668 of electrical contacts on a planar surface of the assembly.
摘要翻译：要解决的问题：提供在晶片级制造的堆叠微电子封装以及制造这种封装的方法。解决方案：堆叠的组件280通过将包括多个微电子元件的第一子组件210堆叠到包括多个微电子元件的第二子组件210上并且具有延伸到其边缘的迹线而形成。在组件中，然后形成通过微电子组件的凹口以露出迹线，并且引线2666随后形成在凹口的侧壁处，以在组件的平坦表面上提供电触点的端部2668。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2002313839A MOLDED LEAD STRUCTURE AND METHOD OF FORMING THE SAME 审中-公开
公开(公告)号：JP2002313839A
公开(公告)日：2002-10-25
申请号：JP2002057976
申请日：2002-03-04
申请人： TESSERA INC
发明人： GRUBE GARY W , MATHIEU GAETAN , SWEIS JASON , GRANGE JOHN
IPC分类号： H01L23/12 , B23K20/10 , H01L21/60 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor inner lead bonding method in which an operation is not affected by a little size change in a connection element. SOLUTION: The connection element having a lead is arranged on the surface of a chip such that the lead is above a contact 54. The bonding region 62 of each lead is energized down by engaging a bonding tool 60 with the contact 54 of a chip, whereas the first end, that is, base end 38 of the lead is fixed to and held by a dielectric layer structure. This lead is deformed in the shape of a letter S by moving the bonding tool 60 toward the base end, that is, the first end 38 of the lead to urge the bonding region 62 toward the first end 38 and to bend the lead, or the lead is bent down by the tool 60 and then the tool is separated from the lead to be separated from the base end 38 of the lead, and then is moved down so as to fix the lead to the contact 54 of the chip.

4. 发明授权

KR101118711B1 Enhanced stacked microelectric assemblies with central contacts 有权
标题翻译：具有中央触点的增强型堆叠式微电池组件
公开(公告)号：KR101118711B1
公开(公告)日：2012-03-12
申请号：KR20100129890
申请日：2010-12-17
申请人： TESSERA INC
发明人： HABA BELGACEM , ZOHNI WAEL , CRISP RICHARD DEWITT
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L25/065 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L25/105 , H01L27/14618 , H01L2223/6611 , H01L2224/0401 , H01L2224/06135 , H01L2224/06136 , H01L2224/16225 , H01L2224/32145 , H01L2224/45014 , H01L2224/45015 , H01L2224/45144 , H01L2224/48096 , H01L2224/4824 , H01L2224/48477 , H01L2224/48599 , H01L2224/49111 , H01L2224/49174 , H01L2224/4945 , H01L2224/73215 , H01L2225/0651 , H01L2225/06562 , H01L2225/1023 , H01L2225/1058 , H01L2924/01014 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2924/00 , H01L2924/20752 , H01L2924/00012
摘要： PURPOSE: Enhanced stacked micro-electric assemblies with central contacts are provided to help a user to make the device smaller than a conventional device by installing a system having a integrated chip and an electronic device in a single housing. CONSTITUTION: A first microelectronics element(12) comprises a front side(16), a rear side(18), and a first edge(27). A second microelectronics element(14) comprises a front side(22), a rear side(24), and a first edge(35). A microelectronics assembly(10) comprises a dielectric element(30) having a first side(32) and a second side(34). A space layer(31) is formed between the first end of the second microelectronics element and the dielectric element. An electrical connector or a lead(70) comprises a plurality of wire bonds(72,74).
摘要翻译：目的：提供具有中心触点的增强堆叠式微型电气组件，以帮助用户通过将具有集成芯片和电子设备的系统安装在单个外壳中来使设备小于常规设备。构成：第一微电子元件（12）包括前侧（16），后侧（18）和第一边缘（27）。第二微电子元件（14）包括前侧（22），后侧（24）和第一边缘（35）。微电子组件（10）包括具有第一侧（32）和第二侧（34）的电介质元件（30）。空间层（31）形成在第二微电子元件的第一端和电介质元件之间。电连接器或引线（70）包括多个引线接合（72,74）。

5. 发明专利

JP2013178760A Electronic apparatus 审中-公开
标题翻译：电子设备
公开(公告)号：JP2013178760A
公开(公告)日：2013-09-09
申请号：JP2013021509
申请日：2013-02-06
申请人： Tessera Inc , テッセラ,インコーポレイテッド
发明人： NELS JEWELL-LARSEN , KENNETH A HONER , RON GOLDMAN , MATTHEW K SCHWIEBERT
IPC分类号： G06F1/20 , G09F9/00 , H01L23/467 , H05K7/20
CPC分类号： G06F1/203 , H01L2924/0002 , H05K7/20172 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a minute cooling device which generates ions and an electric field to induce a flux of a fluid such as air with respect to heat management within a device of a small-sized electronic apparatus.SOLUTION: Surfaces for electromagnetic shielding, retaining electrostatic charge, and indeed collecting ion current in EHD fluid mover design are formed in an electronic device. In some cases, electrostatically operative portions (e.g., 792, 793, and 794) of an EHD fluid mover 710 are formed as or on surfaces of an enclosure, an EMI shield, a circuit board and/or a heat pipe or spreader. Heat dispersed from the electronic apparatus (e.g., a microprocessor or a graphic device) and/or other components is transferred to a fluid flux induced by EHD and is discharged from the enclosure through a ventilation boundary.
摘要翻译：要解决的问题：提供一种微小的冷却装置，其产生离子和电场以引起诸如空气的流体的流量相对于小型电子设备的装置内的热管理。解决方案：用于电磁屏蔽的表面在电子设备中形成了保持静电电荷，并且确实在EHD流体移动器设计中采集离子电流。在一些情况下，EHD流体驱动器710的静电操作部分（例如，792,793和794）形成为外壳，EMI屏蔽，电路板和/或热管或扩展器的表面或其表面。从电子装置（例如，微处理器或图形装置）分散的热量和/或其他部件被转移到由EHD引起的流体通量，并通过通风边界从外壳排出。

6. 发明专利

JP2011115791A Electro-kinetic air transporter-conditioner 有权
标题翻译：电动空调输送机
公开(公告)号：JP2011115791A
公开(公告)日：2011-06-16
申请号：JP2011022315
申请日：2011-02-04
申请人： Tessera Inc , テセラインコーポレイテッドTessera, Inc.
发明人： TAYLOR CHARLES E , LAU SHEK FAI
IPC分类号： A61L9/015 , B03C3/40 , A61L9/22 , B01D53/32 , B01J19/08 , B03C3/02 , B03C3/08 , B03C3/12 , B03C3/32 , B03C3/41 , B03C3/45 , B03C3/47 , B03C3/74 , C01B13/11 , H01T23/00
CPC分类号： B03C3/743 , B01D53/32 , B01D53/323 , B01D2251/104 , B03C3/08 , B03C3/12 , B03C3/32 , B03C3/47 , B03C3/68 , B03C2201/08 , B03C2201/14 , C01B13/11 , C01B13/115 , C01B2201/12 , C01B2201/20 , C01B2201/22 , C01B2201/62 , F24F2003/1682 , F24F2003/1685 , H01T23/00
摘要： PROBLEM TO BE SOLVED: To provide an electro-kinetic air transporter-conditioner capable of improving efficiency of conventional systems without requiring expensive manufacturing technologies for producing electrodes, preferably capable of effectively functioning without requiring a third array of electrodes and, for example, capable of removing smell from surrounding environments and being selected a safe amount of generated ozone by users. SOLUTION: An electro-kinetic electro-static air conditioner includes a self-contained ion generator that provides electro-kinetically moved air with ions and safe amounts of ozone. The ion generator includes a high voltage pulse generator whose output pulses are coupled between first and second electrode arrays. Preferably the first array comprises one or more wire electrodes spaced considerably apart from a second array comprising hollow U-shaped electrodes. Preferably a ratio of the effective area of an electrode in the second array to the effective area of an electrode in the first array is about 15:1, preferably about 20:1. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够提高常规系统效率的电动空气传送器调节器，而不需要昂贵的用于制造电极的制造技术，优选地能够在不需要第三阵列电极的情况下有效地起作用能够从周围环境中除去气味，并被用户选择安全量的生成的臭氧。解决方案：一种电动静电空调包括一个独立的离子发生器，它提供电离动态空气与离子和安全量的臭氧。离子发生器包括高电压脉冲发生器，其输出脉冲耦合在第一和第二电极阵列之间。优选地，第一阵列包括与包括中空U形电极的第二阵列相距分开的一个或多个线电极。优选地，第二阵列中的电极的有效面积与第一阵列中的电极的有效面积的比率为约15:1，优选约20:1。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2005101638A Microelectronic bonding with lead motion 有权
标题翻译：微电子与铅运动结合
公开(公告)号：JP2005101638A
公开(公告)日：2005-04-14
申请号：JP2004325234
申请日：2004-11-09
申请人： Tessera Inc , テセラ,インコーポレイテッド
发明人： DISTEFANO THOMAS H , KOVAC ZLATA , GRANGE JOHN
IPC分类号： H01L21/60 , H01L21/00 , H01L21/607 , H05K3/32 , H05K13/04
CPC分类号： H01L21/67144 , H01L24/86 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , Y10T29/4913 , Y10T29/49135
摘要： PROBLEM TO BE SOLVED: To accurately connect a portion of a microelectronic assembly having multiple contacts to a connection component including multiple leads each of which is equipped with a long narrow connector having at least one projection extending outward. SOLUTION: There are provided a process of juxtaposing a connection component 20 to a portion of a semiconductor chip assembly 10 so that respective leads are adjacent to their corresponding contacts; and a process of engaging a connector 32 on a tool so that the connector is engaged on at least one projection of the tool for restricting the motion of the tool in the longitudinal direction relative to the connector, and of displacing a bonding region 29 of the connector 32 so that the bonding region is engaged on a contact 18 for connecting the bonding region of the connector to its corresponding contact 18. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了将具有多个触点的微电子组件的一部分精确地连接到包括多个引线的连接部件，每个引线配备有具有向外延伸的至少一个突起的长的窄连接器。解决方案：提供了将连接部件20并置到半导体芯片组件10的一部分的过程，使得各个引线与其相应的触点相邻; 以及将连接器32接合在工具上的过程，使得连接器接合在工具的至少一个突起上，用于限制工具相对于连接器在纵向方向上的运动，并且使接合区域29 连接器32，使得接合区域接合在接触件18上，用于将连接器的接合区域连接到其相应的接触件18.版权所有：（C）2005，JPO＆NCIPI

8. 发明专利

JP2004140412A Multilayer circuit unit, components of the unit, and method for producing same 有权
公开(公告)号：JP2004140412A
公开(公告)日：2004-05-13
申请号：JP2004032363
申请日：2004-02-09
申请人： Tessera Inc , テッセラ・インコーポレーテッドTessera,Inc.
发明人： DISTEFANO THOMAS H , KHANDROS IGOR , GRUBE GARY W , EHRENBERG SCOTT G
IPC分类号： H05K1/11 , H01L21/48 , H01L23/538 , H05K1/00 , H05K3/00 , H05K3/40 , H05K3/46
CPC分类号： H05K3/462 , H01L21/4857 , H01L23/5383 , H01L2924/0002 , H01L2924/09701 , H01R12/523 , H05K1/0287 , H05K1/029 , H05K1/0298 , H05K3/4038 , H05K3/4069 , H05K3/4602 , H05K3/4623 , H05K2201/0195 , H05K2201/0305 , H05K2201/09509 , H05K2201/09536 , H05K2201/096 , H05K2201/09609 , H05K2201/09945 , H05K2201/10378 , H05K2201/10666 , H05K2203/175 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a multilayer circuit unit. SOLUTION: A first circuit panel (544) having a dielectric material body, a contact (538), an electrode portion (530), and a skeleton conductor (527), and a second circuit panel (562) having a dielectric material body and an electrode portion (530) are prepared. A top of the first circuit panel is selectively treated, thereby the panel is specified in a customer-oriented manner; and part of the skeleton conductor of the panel is connected to the contact of the panel, the circuit panels are stacked in a top-and-bottom opposed style, where a top of the first circuit panel faces a bottom of the second circuit panel in a first interfacial area, first patterns on opposed faces are aligned with each other, the contact of the first panel is aligned with the electrode of the second panel in at least part of the aligned pattern, and the contacts and the electrodes, which are aligned with each other in the interfacial area, are all connected non-selectively to each other. Thus, part of the specified panel in the customer-oriented manner is connected to the electrode of the panel. COPYRIGHT: (C)2004,JPO

9. 发明专利

JP2014168094A Micro electronic component package and method therefor 审中-公开
标题翻译：微电子元件封装及其方法
公开(公告)号：JP2014168094A
公开(公告)日：2014-09-11
申请号：JP2014095937
申请日：2014-05-07
申请人： Tessera Inc , テッセラ,インコーポレイテッド
发明人： BELGACEM HABA , MASUD BEROZ , KANG TECK-GYU , KUBOTA YOICHI , SRIDHAR KRISHNAN , JOHN B RILEY III , ILYAS MOHAMMED
IPC分类号： H01L23/12 , H01L23/02 , H01L23/31 , H01L23/367 , H01L23/498 , H01L25/10
CPC分类号： H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide a micro electronic component package to be examined easier.SOLUTION: A micro electronic component package comprises a micro electronic device 62. A flexible dielectric layer 42 overlaps a first face of the micro electronic device having an interval therebetween. A periphery 86 of the flexible dielectric layer 42 extends beyond a periphery of the micro electronic device. The micro electronic component package has a plurality of conductive posts 40a-40f exposed on a surface of the flexible dielectric layer, and mutually connected to the micro electronic device electrically. One of the plurality conductive posts is arranged on the periphery of the flexible dielectric layer. A soft layer 74 is arranged between the first face of the micro electronic device and the flexible dielectric layer. The soft layer overlaps at least one of the conductive posts arranged on the periphery of the flexible dielectric layer. The package comprises a support body 84 in contact with the micro electronic device and the soft layer. The support body overlaps the periphery of the flexible dielectric layer.
摘要翻译：要解决的问题：提供容易检查的微电子部件封装。解决方案：微电子部件封装包括微电子器件62.柔性介电层42与微电子器件的在其间具有间隔的第一面重叠。柔性介电层42的周边86延伸超出微电子器件的周边。微电子部件封装具有在柔性介电层的表面上露出的多个导电柱40a-40f，并且电连接到微电子器件。多个导电柱中的一个布置在柔性介电层的周边上。柔性层74布置在微电子器件的第一面和柔性介电层之间。软层与布置在柔性介电层的周边上的至少一个导电柱重叠。该包装包括与微电子装置和软层接触的支撑体84。支撑体与柔性介电层的周边重叠。

10. 发明专利

JP2010004062A Method of encapsulating plural microelectronic assemblies 有权
标题翻译：封装聚合物微电子组件的方法
公开(公告)号：JP2010004062A
公开(公告)日：2010-01-07
申请号：JP2009188707
申请日：2009-08-17
申请人： Tessera Inc , テッセラ・インコーポレーテッドTessera,Inc.
发明人： NGUYEN TAN , MITCHELL CRAIG S , DISTEFANO THOMAS H
IPC分类号： B29C45/14 , H01L21/56 , H01L21/28 , H01L21/44
CPC分类号： H01L21/565 , H01L21/56 , H01L24/73 , H01L24/97 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/12042 , H01L2924/15311 , H01L2924/00012 , H01L2224/81 , H01L2224/85 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To prevent contamination due to an encapsulating material in a manufacturing method of microelectronic assemblies.
SOLUTION: This manufacturing method of semiconductor chip assemblies comprise the steps of: (a) providing semiconductor chip assemblies 104, by attaching a plurality of semiconductor chips on a bottom face of an integral tape 86 held on a frame 72 and electrically connecting the chips to terminals exposed on an upper face of the tape 86, wherein the semiconductor chip assemblies 104 have a tape area coordinated with one or more chips, and the chips are located in a hole enclosed by the frame 72; (b) depositing an upper seal layer on upper faces of the tape 86 and the frame 72; (c) depositing a bottom seal layer on bottom faces of the chips and the frame facing a direction apart from the tape 86; (d) injecting a liquid encapsulating material into the circumference of the chips so as to contact with the chips and the tape 86; and (e) curing the encapsulating material, to prevent the encapsulating material from contacting with the bottom face of the chips and the upper face of the tape, while the frame 72 and the seal layers hold the encapsulating material, when curing.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了防止在微电子组件的制造方法中由于封装材料引起的污染。解决方案：这种半导体芯片组件的制造方法包括以下步骤：（a）通过在保持在框架72上的整体磁带86的底面上安装多个半导体芯片来提供半导体芯片组件104，并且电连接芯片到端子暴露在带86的上表面上，其中半导体芯片组件104具有与一个或多个芯片配合的带区域，并且芯片位于由框架72包围的孔中; （b）在带86和框架72的上表面上沉积上密封层; （c）将底部密封层沉积在芯片的底面上，并且框架面向离开带86的方向; （d）将液体密封材料注入到芯片的圆周中以与芯片和带86接触; 和（e）固化封装材料，以防止封装材料在固化时与芯片的底面和带的上表面接触，同时框架72和密封层保持封装材料。版权所有（C）2010，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式