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1. 发明授权

KR101118711B1 Enhanced stacked microelectric assemblies with central contacts 有权
标题翻译：具有中央触点的增强型堆叠式微电池组件
公开(公告)号：KR101118711B1
公开(公告)日：2012-03-12
申请号：KR20100129890
申请日：2010-12-17
申请人： TESSERA INC
发明人： HABA BELGACEM , ZOHNI WAEL , CRISP RICHARD DEWITT
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L25/065 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L25/105 , H01L27/14618 , H01L2223/6611 , H01L2224/0401 , H01L2224/06135 , H01L2224/06136 , H01L2224/16225 , H01L2224/32145 , H01L2224/45014 , H01L2224/45015 , H01L2224/45144 , H01L2224/48096 , H01L2224/4824 , H01L2224/48477 , H01L2224/48599 , H01L2224/49111 , H01L2224/49174 , H01L2224/4945 , H01L2224/73215 , H01L2225/0651 , H01L2225/06562 , H01L2225/1023 , H01L2225/1058 , H01L2924/01014 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2924/00 , H01L2924/20752 , H01L2924/00012
摘要： PURPOSE: Enhanced stacked micro-electric assemblies with central contacts are provided to help a user to make the device smaller than a conventional device by installing a system having a integrated chip and an electronic device in a single housing. CONSTITUTION: A first microelectronics element(12) comprises a front side(16), a rear side(18), and a first edge(27). A second microelectronics element(14) comprises a front side(22), a rear side(24), and a first edge(35). A microelectronics assembly(10) comprises a dielectric element(30) having a first side(32) and a second side(34). A space layer(31) is formed between the first end of the second microelectronics element and the dielectric element. An electrical connector or a lead(70) comprises a plurality of wire bonds(72,74).
摘要翻译：目的：提供具有中心触点的增强堆叠式微型电气组件，以帮助用户通过将具有集成芯片和电子设备的系统安装在单个外壳中来使设备小于常规设备。构成：第一微电子元件（12）包括前侧（16），后侧（18）和第一边缘（27）。第二微电子元件（14）包括前侧（22），后侧（24）和第一边缘（35）。微电子组件（10）包括具有第一侧（32）和第二侧（34）的电介质元件（30）。空间层（31）形成在第二微电子元件的第一端和电介质元件之间。电连接器或引线（70）包括多个引线接合（72,74）。

2. 发明专利

BR112013015117A2 conjunto microeletrônico, e, sistema 未知
公开(公告)号：BR112013015117A2
公开(公告)日：2016-09-20
申请号：BR112013015117
申请日：2011-10-21
申请人： TESSERA INC
发明人： HABA BELGACEM , CRISP RICHARD DEWITT , ZOHNI WAEL
IPC分类号： H01L23/50 , H01L25/065

3. 发明专利

BR112013027142A2 conjunto microeletrônico 未知
公开(公告)号：BR112013027142A2
公开(公告)日：2017-01-10
申请号：BR112013027142
申请日：2012-04-11
申请人： TESSERA INC
发明人： HABA BELGACEM , CRISP RICHARD DEWITT , ZOHNI WAEL
IPC分类号： H01L25/065 , H01L23/31 , H01L25/10
摘要： conjunto microeletrônico é descrito um conjunto microeletrônico (10) que pode incluir um substrato (30) com primeira e segunda superfícies (34,58), e um orifício (39) que se estende entre elas e terminais (36). o conjunto (10) também pode incluir um primeiro elemento microeletrônico (12) com uma superfície frontal (16) voltada para a primeira superfície (34), um segundo elemento microeletrônico (14) com uma superfície frontal (22) que se projeta além de uma borda (29) do primeiro elemento microeletrônico, primeiro e segundo condutores (70,76) que conectam eletricamente os contatos (20,52) dos microeletrônicos nos terminais e terceiros condutores (73) que interconectam eletricamente os contatos do primeiro e do segundo elementos microeletrônicos. os contatos (20) do primeiro elemento microeletrônico (12) podem ficar dispostos adjacentes à borda (29). os contatos (26) do segundo elemento microeletrônico (14) podem ficar dispostos em uma região central (19) da superfície frontal (22) deste. os condutores (70,76,99) podem ter partes alinhadas com o orifício (39).

4. 发明专利

BR112013015111A2 conjunto microeletrônico, sistema, módulo incluindo uma pluralidade de conjuntos microeletrônicos, e, arranjo 未知
公开(公告)号：BR112013015111A2
公开(公告)日：2016-09-20
申请号：BR112013015111
申请日：2011-04-06
申请人： TESSERA INC
发明人： HABA BELGACEM , CRISP RICHARD DEWITT , ZOHNI WAEL
IPC分类号： H01L23/13 , H01L23/49 , H01L23/66 , H01L25/065 , H01L25/10

5. 发明申请

WO2013009741A9 DE-SKEWED MULTI-DIE PACKAGES 审中-公开
标题翻译： DE-SKEWED多重包装
公开(公告)号：WO2013009741A9
公开(公告)日：2013-03-07
申请号：PCT/US2012046049
申请日：2012-07-10
申请人： TESSERA INC , CRISP RICHARD DEWITT , HABA BELGACEM , ZOHNI WAEL
发明人： CRISP RICHARD DEWITT , HABA BELGACEM , ZOHNI WAEL
IPC分类号： H01L25/065 , G11C5/06
CPC分类号： H01L23/48 , G11C5/06 , H01L23/3128 , H01L24/06 , H01L24/13 , H01L24/29 , H01L24/48 , H01L24/50 , H01L24/73 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/18 , H01L2224/0401 , H01L2224/05554 , H01L2224/06135 , H01L2224/06136 , H01L2224/12105 , H01L2224/13024 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/291 , H01L2224/2919 , H01L2224/29193 , H01L2224/32145 , H01L2224/32225 , H01L2224/48011 , H01L2224/48227 , H01L2224/4824 , H01L2224/73203 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06565 , H01L2924/00014 , H01L2924/01322 , H01L2924/1203 , H01L2924/1205 , H01L2924/1431 , H01L2924/1432 , H01L2924/1433 , H01L2924/14335 , H01L2924/1434 , H01L2924/1436 , H01L2924/1438 , H01L2924/1443 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/157 , H01L2924/15786 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/18161 , H01L2924/18165 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package (10) may have a plurality of terminals (36) disposed at a face (32) thereof which are configured for connection to at least one external component, e.g., a circuit panel (70). First and second microelectronic elements (12), (14) can be affixed with packaging structure (30) therein. A first electrical connection (51A, 40A, 74A) can extend from a respective terminal (36A) of the package (10) to a corresponding contact (20A) on the first microelectronic element (12), and a second electrical connection (53A, 40B, 52A) can extend from the respective terminal (36A) to a corresponding contact (26A) on the second microelectronic element (14), the first and second connections being configured such that a respective signal carried by the first and second connections is subject to propagation delay of the same duration between the respective terminal (36A) and each of the corresponding contacts (20A, 26A) coupled thereto.
摘要翻译：微电子封装（10）可以具有设置在其面（32）处的多个端子（36），其被配置为连接到至少一个外部部件，例如电路板（70）。第一和第二微电子元件（12），（14）可以在其中固定有包装结构（30）。第一电连接（51A，40A，74A）可以从封装（10）的相应端子（36A）延伸到第一微电子元件（12）上的对应触点（20A），并且第二电连接（53A， 40B，52A）可以从相应的端子（36A）延伸到第二微电子元件（14）上的相应的触点（26A），第一和第二连接被配置为使得由第一和第二连接承载的相应信号是对象在相应的端子（36A）和与其耦合的相应的触点（20A，26A）中的每一个之间具有相同持续时间的传播延迟。

6. 发明申请

WO2012071325A4 LEAD STRUCTURES WITH VERTICAL OFFSETS 审中-公开
标题翻译：具有垂直偏移的铅结构
公开(公告)号：WO2012071325A4
公开(公告)日：2012-10-04
申请号：PCT/US2011061647
申请日：2011-11-21
申请人： TESSERA INC , CRISP RICHARD DEWITT , HABA BELGACEM , ZOHNI WAEL
发明人： CRISP RICHARD DEWITT , HABA BELGACEM , ZOHNI WAEL
IPC分类号： H01L21/60
CPC分类号： H01L23/49575 , H01L23/13 , H01L24/06 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/06136 , H01L2224/45015 , H01L2224/4809 , H01L2224/48091 , H01L2224/48095 , H01L2224/4824 , H01L2224/48465 , H01L2224/49052 , H01L2224/49111 , H01L2224/49175 , H01L2224/49176 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/1432 , H01L2924/1433 , H01L2924/1434 , H01L2924/20751 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2224/48227 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A microelectronic structure includes a first row of contacts (14) and a second row of contacts (24) offset from the first row, so that the first and second rows cooperatively define pairs of contacts. These pairs of contacts include first pairs (30a) and second pairs (30b) arranged in alternating sequence in the row direction. The first pairs are provided with low connectors (32a), whereas the second pairs are provided with high connectors (32b). The high connectors and low connectors have sections vertically offset from one another to reduce mutual impedance between adjacent connectors.
摘要翻译：微电子结构包括第一排接触件（14）和偏离第一排的第二排接触件（24），使得第一排和第二排配合地限定成对的接触件。这些触点对包括在行方向上交替排列的第一对（30a）和第二对（30b）。第一对设有低连接器（32a），而第二对设有高连接器（32b）。高连接器和低连接器具有彼此垂直偏移的部分以减少相邻连接器之间的相互阻抗。

7. 发明申请

WO2012082227A2 ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND IMPROVED GROUND OR POWER DISTRIBUTION 审中-公开
标题翻译：具有中央接触和改进接地或功率分配的增强型堆叠式微电子组件
公开(公告)号：WO2012082227A2
公开(公告)日：2012-06-21
申请号：PCT/US2011057294
申请日：2011-10-21
申请人： TESSERA INC , HABA BELGACEM , ZOHNI WAEL , CRISP RICHARD DEWITT
发明人： HABA BELGACEM , ZOHNI WAEL , CRISP RICHARD DEWITT
IPC分类号： H01L25/065
CPC分类号： H05K1/11 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/50 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/06136 , H01L2224/32145 , H01L2224/32225 , H01L2224/45014 , H01L2224/45144 , H01L2224/48095 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/48599 , H01L2224/49111 , H01L2224/49175 , H01L2224/49427 , H01L2224/73215 , H01L2225/0651 , H01L2225/06562 , H01L2225/06575 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/1434 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2924/19103 , H01L2924/19107 , H01L2924/30107 , H05K1/115 , H05K1/181 , H05K2201/10507 , H05K2201/10628 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A microelectronic assembly 700 includes a dielectric element 730 having at least one aperture 733 and electrically conductive elements thereon including terminals 740 exposed at the second surface of the dielectric element 730; a first microelectronic element 712 having a rear surface and a front surface facing the dielectric element 730, the first microelectronic element 712 having a plurality of contacts exposed at the front surface thereof; a second microelectronic element 714 having a rear surface and a front surface facing the rear surface of the first microelectronic element 712, the second microelectronic element 714 having a plurality of contacts exposed at the front surface and projecting beyond an edge of the first microelectronic element 712; and an electrically conductive plane 790 attached to the dielectric element 730 and at least partially positioned between the first and second apertures 733,739, the electrically conductive plane 790 being electrically connected with one or more of the contacts of at least one of the first or second microelectronic elements 712,714.
摘要翻译：微电子组件700包括具有至少一个孔733的介电元件730和其上的导电元件，其中包括在电介质元件730的第二表面处暴露的端子740; 第一微电子元件712具有后表面和面向电介质元件730的前表面，第一微电子元件712具有在其前表面处暴露的多个触点; 第二微电子元件714具有后表面和面向第一微电子元件712的后表面的前表面，第二微电子元件714具有在前表面处暴露并突出超过第一微电子元件712的边缘的多个触点 ; 以及连接到电介质元件730并且至少部分地定位在第一和第二孔733,739之间的导电平面790，导电平面790与第一或第二微电子中的至少一个的一个或多个触点电连接元素712,714。

8. 发明申请

WO2012054335A1 ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND IMPROVED THERMAL CHARACTERISTIC 审中-公开
标题翻译：具有中央触点的增强堆叠微电子组件和改进的热特性
公开(公告)号：WO2012054335A1
公开(公告)日：2012-04-26
申请号：PCT/US2011056352
申请日：2011-10-14
申请人： TESSERA INC , HABA BELGACEM , ZOHNI WAEL , CRISP RICHARD DEWITT
发明人： HABA BELGACEM , ZOHNI WAEL , CRISP RICHARD DEWITT
IPC分类号： H01L25/065 , H01L23/36 , H01L23/367 , H01L23/42 , H01L23/498 , H01L25/10
CPC分类号： H01L25/0652 , H01L23/13 , H01L23/3128 , H01L23/367 , H01L23/3677 , H01L23/3731 , H01L23/3736 , H01L23/4334 , H01L23/49816 , H01L24/14 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L2224/06136 , H01L2224/13014 , H01L2224/14519 , H01L2224/32145 , H01L2224/32188 , H01L2224/32225 , H01L2224/48091 , H01L2224/48106 , H01L2224/4824 , H01L2224/484 , H01L2224/49111 , H01L2224/731 , H01L2224/73215 , H01L2224/73253 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06575 , H01L2225/06589 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/00014 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/10253 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19107 , H01L2924/30107 , H01L2224/48227 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A microelectronic assembly includes a dielectric element 930B having oppositely-facing first and second surfaces and one or more apertures 972 extending between the surfaces, the dielectric element further having conductive elements thereon; a first microelectronic element 900A having a rear surface and a front surface facing the first surface of the dielectric element 930B, the first microelectronic element 900A having a first edge and a plurality of contacts exposed at the front surface thereof; a second microelectronic element 900B including having a rear surface and a front surface facing the rear surface of the first microelectronic element 900A, a projecting portion of the front surface of the second microelectronic element 900B extending beyond the first edge of the first microelectronic element 900A, the projecting portion being spaced from the first surface of the dielectric element 930B, the second microelectronic element 900B having a plurality of contacts exposed at the projecting portion of the front surface; leads extending from contacts of the microelectronic elements through the at least one aperture to at least some of the conductive elements; and a heat spreader 970 thermally coupled to at least one of the first microelectronic element 900A or the second microelectronic element 900B.
摘要翻译：微电子组件包括具有相对面对的第一和第二表面的介电元件930B和在表面之间延伸的一个或多个孔972，该介电元件还具有导电元件; 第一微电子元件900A，其具有背面和与介质元件930B的第一表面相对的前表面，第一微电子元件900A具有第一边缘和在其前表面处暴露的多个触点; 第二微电子元件900B，包括具有背面和面向第一微电子元件900A的后表面的前表面，第二微电子元件900B的前表面的突出部分延伸超过第一微电子元件900A的第一边缘，所述突出部分与所述电介质元件930B的第一表面间隔开，所述第二微电子元件900B具有在所述前表面的突出部分处露出的多个触点; 从微电子元件的接触通过至少一个孔延伸到至少一些导电元件的引线; 以及热耦合到第一微电子元件900A或第二微电子元件900B中的至少一个的散热器970。

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