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1. 发明专利

JP2005101638A Microelectronic bonding with lead motion 有权
标题翻译：微电子与铅运动结合
公开(公告)号：JP2005101638A
公开(公告)日：2005-04-14
申请号：JP2004325234
申请日：2004-11-09
申请人： Tessera Inc , テセラ,インコーポレイテッド
发明人： DISTEFANO THOMAS H , KOVAC ZLATA , GRANGE JOHN
IPC分类号： H01L21/60 , H01L21/00 , H01L21/607 , H05K3/32 , H05K13/04
CPC分类号： H01L21/67144 , H01L24/86 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , Y10T29/4913 , Y10T29/49135
摘要： PROBLEM TO BE SOLVED: To accurately connect a portion of a microelectronic assembly having multiple contacts to a connection component including multiple leads each of which is equipped with a long narrow connector having at least one projection extending outward. SOLUTION: There are provided a process of juxtaposing a connection component 20 to a portion of a semiconductor chip assembly 10 so that respective leads are adjacent to their corresponding contacts; and a process of engaging a connector 32 on a tool so that the connector is engaged on at least one projection of the tool for restricting the motion of the tool in the longitudinal direction relative to the connector, and of displacing a bonding region 29 of the connector 32 so that the bonding region is engaged on a contact 18 for connecting the bonding region of the connector to its corresponding contact 18. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了将具有多个触点的微电子组件的一部分精确地连接到包括多个引线的连接部件，每个引线配备有具有向外延伸的至少一个突起的长的窄连接器。解决方案：提供了将连接部件20并置到半导体芯片组件10的一部分的过程，使得各个引线与其相应的触点相邻; 以及将连接器32接合在工具上的过程，使得连接器接合在工具的至少一个突起上，用于限制工具相对于连接器在纵向方向上的运动，并且使接合区域29 连接器32，使得接合区域接合在接触件18上，用于将连接器的接合区域连接到其相应的接触件18.版权所有：（C）2005，JPO＆NCIPI

2. 发明专利

JP2008060585A Method for forming compliant interface of semiconductor chip 有权
标题翻译：形成半导体芯片合格接口的方法
公开(公告)号：JP2008060585A
公开(公告)日：2008-03-13
申请号：JP2007239062
申请日：2007-09-14
申请人： Tessera Inc , テセラ,インコーポレイテッド
发明人： KOVAC ZLATA , MITCHELL CRAIG , DISTEFANO THOMAS
IPC分类号： H01L21/60 , H01L23/12 , H01L21/56 , H01L23/28 , H01L23/32 , H01L23/48 , H01L23/498 , H05K1/11 , H05K3/36 , H05K3/40
CPC分类号： H01L24/81 , H01L21/56 , H01L21/563 , H01L23/49811 , H01L23/49827 , H01L23/4985 , H01L24/72 , H01L24/75 , H01L2224/16 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75301 , H01L2224/81801 , H01L2224/83136 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/1532 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H05K1/118 , H05K3/361 , H05K3/4084 , H05K2201/0133 , H05K2201/0394 , H05K2201/0397 , H05K2201/09081 , H05K2201/091 , H05K2203/063 , Y10T29/4913 , Y10T29/49144 , Y10T29/49174 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a compliant interface for coping with a discordance between the thermal expansion coefficients of a semiconductor chip and of a support structure, such as printed wiring board. SOLUTION: This method for forming a compliant interface of a semiconductor chip comprises processes of providing a first support structure 100 having a first face, a second face, a plurality of terminals 140 on the second face and a porous elastic layer disposed on the first face of the first supporting structure; butting a first face of a second supporting structure 120 to the porous layer so that the porous elastic layer is arranged between the first and second support structures and the first support structure is separated from the second support structure; arranging a first curable liquid within the porous layer after the butting process so that the first curable liquid is arranged between the first and second support structures; and substantially matching coplanarly a plurality of terminals to each other, by making a plurality of the terminals engage to a platen. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于应对半导体芯片的热膨胀系数和诸如印刷线路板的支撑结构之间的不一致性的兼容接口。解决方案：用于形成半导体芯片的兼容界面的方法包括提供具有第一面，第二面，第二面上的多个端子140的第一支撑结构100和设置在第二面上的多孔弹性层的工艺第一支撑结构的第一面; 将第二支撑结构120的第一面与多孔层对接，使得多孔弹性层布置在第一和第二支撑结构之间，并且第一支撑结构与第二支撑结构分离; 在对接过程之后，在多孔层内布置第一可固化液体，使得第一可固化液体布置在第一和第二支撑结构之间; 并且通过使多个端子接合到压板上而使多个端子彼此大致匹配。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2004186700A Adaptable interface of semiconductor chip 有权
公开(公告)号：JP2004186700A
公开(公告)日：2004-07-02
申请号：JP2003436008
申请日：2003-11-26
申请人： Tessera Inc , テセラ,インコーポレイテッド
发明人： KOVAC ZLATA , MITCHELL CRAIG S , DISTEFANO THOMAS H
IPC分类号： H01L23/12 , H01L21/56 , H01L21/60 , H01L23/28 , H01L23/48 , H01L23/498 , H05K1/11 , H05K3/36 , H05K3/40
CPC分类号： H01L24/81 , H01L21/56 , H01L21/563 , H01L23/49811 , H01L23/49827 , H01L23/4985 , H01L24/72 , H01L24/75 , H01L2224/16 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75301 , H01L2224/81801 , H01L2224/83136 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/1532 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H05K1/118 , H05K3/361 , H05K3/4084 , H05K2201/0133 , H05K2201/0394 , H05K2201/0397 , H05K2201/09081 , H05K2201/091 , H05K2203/063 , Y10T29/4913 , Y10T29/49144 , Y10T29/49174 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a method and a device to arrange a flat adaptable interface between a semiconductor chip and a supporting construction material to cope with the inconsistency of a thermal expansion coefficient between the semiconductor chip and the supporting construction material. SOLUTION: The adaptable interface comprises a plurality of adaptable pads 110 that define a channel 117 therebetween. The pads are frequently compressed between a flexible film chip carrier 100 and the chip 120. An adaptable filler is displaced in the channel, and forms a uniform sealing layer having a controlled thickness. COPYRIGHT: (C)2004,JPO&NCIPI

4. 发明专利

AU3555995A Microelectronic bonding with lead motion 未知
公开(公告)号：AU3555995A
公开(公告)日：1996-04-09
申请号：AU3555995
申请日：1995-09-19
申请人： TESSERA INC
发明人： DISTEFANO THOMAS H , KOVAC ZLATA , GRANGE JOHN
IPC分类号： H01L21/60 , H01L21/00 , H01L21/607 , H05K3/32 , H05K13/04 , H05K1/00
摘要： A method of connecting a semiconductor chip assembly having at least first and second contacts to a connection component including at least first and second connection leads by means of a tool consisting of the steps of juxtaposing moving and connecting the leads to the corresponding contacts. The connection component is juxtaposed with the semiconductor chip assembly so that the first and second connection leads are aligned with the first and second contacts in such a manner that the first connection lead is offset from the first contact in the first direction and the second connection lead is offset from the second contact in the same first direction. The first connection lead is moved by means of the tool substantially downwardly and towards the first contact in a second direction which is opposite to the first direction, so that an open space is formed between the first connection lead and the second contact and lead to facilitate movement of the second connection lead by the tool substantially downwardly and towards the second contact in the second direction.

5. 发明专利

AU3592895A Compliant interface for a semiconductor chip 未知
公开(公告)号：AU3592895A
公开(公告)日：1996-04-09
申请号：AU3592895
申请日：1995-09-20
申请人： TESSERA INC
发明人： KOVAC ZLATA , MITCHELL CRAIG S , DISTEFANO THOMAS H
IPC分类号： H01L23/12 , H01L21/56 , H01L21/60 , H01L23/28 , H01L23/48 , H01L23/498 , H05K1/11 , H05K3/36 , H05K3/40 , H05K1/02 , H05K3/30 , H01R9/09 , H01R4/58
摘要： A method of making a microelectronic assembly including a compliant interface includes providing a first support structure, such as a flexible dielectric sheet, having a first surface and a porous resilient layer on the first surface of the first support structure, stretching the first support structure and bonding the stretched first support structure to a ring structure. The first surface of a second support structure, such as a semiconductor wafer, is then abutted against the porous layer and, desirably after the abutting step, a first curable liquid is disposed between the first and second support structures and within the porous layer. The first curable liquid may then be at least partially cured.

6. 发明专利

DE69532682D1 未知
公开(公告)号：DE69532682D1
公开(公告)日：2004-04-15
申请号：DE69532682
申请日：1995-09-20
申请人： TESSERA INC
发明人： KOVAC ZLATA , MITCHELL CRAIG S , DISTEFANO THOMAS H
IPC分类号： H01L23/12 , H01L21/56 , H01L21/60 , H01L23/28 , H01L23/48 , H01L23/498 , H05K1/11 , H05K3/36 , H05K3/40 , H05K1/02 , H05K3/30 , H01R4/58
摘要： A method of making a microelectronic assembly including a compliant interface includes providing a first support structure, such as a flexible dielectric sheet, having a first surface and a porous resilient layer on the first surface of the first support structure, stretching the first support structure and bonding the stretched first support structure to a ring structure. The first surface of a second support structure, such as a semiconductor wafer, is then abutted against the porous layer and, desirably after the abutting step, a first curable liquid is disposed between the first and second support structures and within the porous layer. The first curable liquid may then be at least partially cured.

7. 发明专利

AT256378T 未知
公开(公告)号：AT256378T
公开(公告)日：2003-12-15
申请号：AT95932549
申请日：1995-09-19
申请人： TESSERA INC
发明人： DISTEFANO THOMAS H , KOVAC ZLATA , GRANGE JOHN
IPC分类号： H01L21/60 , H01L21/00 , H01L21/607 , H05K3/32 , H05K13/04 , H05K1/00
摘要： A method of connecting a semiconductor chip assembly having at least first and second contacts to a connection component including at least first and second connection leads by means of a tool consisting of the steps of juxtaposing moving and connecting the leads to the corresponding contacts. The connection component is juxtaposed with the semiconductor chip assembly so that the first and second connection leads are aligned with the first and second contacts in such a manner that the first connection lead is offset from the first contact in the first direction and the second connection lead is offset from the second contact in the same first direction. The first connection lead is moved by means of the tool substantially downwardly and towards the first contact in a second direction which is opposite to the first direction, so that an open space is formed between the first connection lead and the second contact and lead to facilitate movement of the second connection lead by the tool substantially downwardly and towards the second contact in the second direction.

8. 发明专利

AT261649T 未知
公开(公告)号：AT261649T
公开(公告)日：2004-03-15
申请号：AT95933164
申请日：1995-09-20
申请人： TESSERA INC
发明人： KOVAC ZLATA , MITCHELL CRAIG S , DISTEFANO THOMAS H
IPC分类号： H01L23/12 , H01L21/56 , H01L21/60 , H01L23/28 , H01L23/48 , H01L23/498 , H05K1/11 , H05K3/36 , H05K3/40 , H05K1/02 , H05K3/30 , H01R4/58
摘要： A method of making a microelectronic assembly including a compliant interface includes providing a first support structure, such as a flexible dielectric sheet, having a first surface and a porous resilient layer on the first surface of the first support structure, stretching the first support structure and bonding the stretched first support structure to a ring structure. The first surface of a second support structure, such as a semiconductor wafer, is then abutted against the porous layer and, desirably after the abutting step, a first curable liquid is disposed between the first and second support structures and within the porous layer. The first curable liquid may then be at least partially cured.

9. 发明专利

DE69532682T2 未知
公开(公告)号：DE69532682T2
公开(公告)日：2005-04-14
申请号：DE69532682
申请日：1995-09-20
申请人： TESSERA INC
发明人： KOVAC ZLATA , MITCHELL CRAIG S , DISTEFANO THOMAS H
IPC分类号： H01L23/12 , H01L21/56 , H01L21/60 , H01L23/28 , H01L23/48 , H01L23/498 , H05K1/11 , H05K3/36 , H05K3/40 , H05K1/02 , H05K3/30 , H01R4/58
摘要： A method of making a microelectronic assembly including a compliant interface includes providing a first support structure, such as a flexible dielectric sheet, having a first surface and a porous resilient layer on the first surface of the first support structure, stretching the first support structure and bonding the stretched first support structure to a ring structure. The first surface of a second support structure, such as a semiconductor wafer, is then abutted against the porous layer and, desirably after the abutting step, a first curable liquid is disposed between the first and second support structures and within the porous layer. The first curable liquid may then be at least partially cured.

10. 发明专利

DE69532298T2 未知
公开(公告)号：DE69532298T2
公开(公告)日：2004-09-16
申请号：DE69532298
申请日：1995-09-19
申请人： TESSERA INC
发明人： DISTEFANO H , KOVAC ZLATA , GRANGE JOHN
IPC分类号： H01L21/60 , H01L21/00 , H01L21/607 , H05K3/32 , H05K13/04 , H05K1/00
摘要： A method of connecting a semiconductor chip assembly having at least first and second contacts to a connection component including at least first and second connection leads by means of a tool consisting of the steps of juxtaposing moving and connecting the leads to the corresponding contacts. The connection component is juxtaposed with the semiconductor chip assembly so that the first and second connection leads are aligned with the first and second contacts in such a manner that the first connection lead is offset from the first contact in the first direction and the second connection lead is offset from the second contact in the same first direction. The first connection lead is moved by means of the tool substantially downwardly and towards the first contact in a second direction which is opposite to the first direction, so that an open space is formed between the first connection lead and the second contact and lead to facilitate movement of the second connection lead by the tool substantially downwardly and towards the second contact in the second direction.

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