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1. 发明申请

US20080293336A1 METHODS AND APPARATUS TO CONTROL SUBSTRATE BEVEL AND EDGE POLISHING PROFILES OF FILMS 审中-公开
标题翻译：控制薄膜的基材水平和边缘抛光轮廓的方法和装置
公开(公告)号：US20080293336A1
公开(公告)日：2008-11-27
申请号：US12124128
申请日：2008-05-20
申请人： Zhenhua Zhang , Paul D. Butterfield , Shou-Sung Chang , Eashwer Kollata , Sen-Hou Ko
发明人： Zhenhua Zhang , Paul D. Butterfield , Shou-Sung Chang , Eashwer Kollata , Sen-Hou Ko
IPC分类号： B24B1/00
CPC分类号： B24B37/042 , B24B9/065
摘要： Methods and apparatus are provided for polishing a film on an edge of a substrate. In some embodiments, a polishing head is provided having a backing plate adapted to press polishing material against a film on an edge of a substrate. The backing plate has a profiled portion adapted to provide a pre-set film profile. Numerous other aspects are provided.
摘要翻译：提供了用于在衬底的边缘上抛光膜的方法和装置。在一些实施例中，提供了抛光头，其具有适于将抛光材料压靠在衬底的边缘上的膜上的背板。背板具有适于提供预设薄膜轮廓的成型部分。提供了许多其他方面。

2. 发明申请

US20080293334A1 METHODS AND APPARATUS FOR USING A BEVEL POLISHING HEAD WITH AN EFFICIENT TAPE ROUTING ARRANGEMENT 审中-公开
标题翻译：使用高效光栅路由布置的水平抛光头的方法和装置
公开(公告)号：US20080293334A1
公开(公告)日：2008-11-27
申请号：US12124145
申请日：2008-05-21
申请人： Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
发明人： Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
IPC分类号： B24B1/00
CPC分类号： B24B9/065 , B24B21/004
摘要： Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head, adapted to contact an edge of a substrate, wherein the polishing head includes one pair of front guide rollers and two pairs of back clamping rollers. Numerous other aspects are provided.
摘要翻译：提供了设备和方法来抛光衬底的边缘。本发明包括一个适于接触基片边缘的抛光头，其中抛光头包括一对前引导辊和两对后夹紧辊。提供了许多其他方面。

3. 发明授权

US08142260B2 Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads 有权
标题翻译：使用背衬从基板两侧的边缘去除薄膜和薄片的方法和装置
公开(公告)号：US08142260B2
公开(公告)日：2012-03-27
申请号：US12124142
申请日：2008-05-20
申请人： Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
发明人： Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
IPC分类号： B24B1/00
CPC分类号： B24B9/065 , H01L21/02087
摘要： Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head adapted to retain a backing pad having a selected contour, wherein the polishing head is adapted to press the backing pad against an edge of a substrate. Numerous other aspects are provided.
摘要翻译：提供了设备和方法来抛光衬底的边缘。本发明包括一种适于保持具有选定轮廓的背衬垫的抛光头，其中抛光头适于将衬垫压靠在衬底的边缘上。提供了许多其他方面。

4. 发明申请

US20080293341A1 METHODS AND APPARATUS FOR USING A ROLLING BACKING PAD FOR SUBSTRATE POLISHING 审中-公开
标题翻译：用于衬底抛光的滚动支撑垫的方法和装置
公开(公告)号：US20080293341A1
公开(公告)日：2008-11-27
申请号：US12124147
申请日：2008-05-21
申请人： Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
发明人： Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
IPC分类号： B24B5/00 , B24B1/00
CPC分类号： B24B9/065 , B24B21/002
摘要： An apparatus and method are provided to polish an edge of a substrate. The invention includes a polishing head including a backing pad, wherein a width of the backing pad that contacts the substrate edge is larger than a width of a notch in the substrate edge. Numerous other aspects are provided.
摘要翻译：提供了一种用于抛光衬底边缘的装置和方法。本发明包括一个包括背衬垫的抛光头，其中背衬垫的接触衬底边缘的宽度大于衬底边缘中的凹口的宽度。提供了许多其他方面。

5. 发明申请

US20080293340A1 METHODS AND APPARATUS FOR REMOVAL OF FILMS AND FLAKES FROM THE EDGE OF BOTH SIDES OF A SUBSTRATE USING BACKING PADS 有权
标题翻译：使用背面垫片从基板两侧边缘移除薄膜和花瓣的方法和装置
公开(公告)号：US20080293340A1
公开(公告)日：2008-11-27
申请号：US12124142
申请日：2008-05-20
申请人： Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
发明人： Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
IPC分类号： B24B29/00 , H01L21/302 , B24B1/00
CPC分类号： B24B9/065 , H01L21/02087
摘要： Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head adapted to retain a backing pad having a selected contour, wherein the polishing head is adapted to press the backing pad against an edge of a substrate. Numerous other aspects are provided.
摘要翻译：提供了设备和方法来抛光衬底的边缘。本发明包括一种适于保持具有选定轮廓的背衬垫的抛光头，其中抛光头适于将衬垫压靠在衬底的边缘上。提供了许多其他方面。

6. 发明申请

US20080293344A1 METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE USING A POLISHING PAD 审中-公开
标题翻译：使用抛光垫抛光底板的方法和装置
公开(公告)号：US20080293344A1
公开(公告)日：2008-11-27
申请号：US12124137
申请日：2008-05-20
申请人： Gary C. Ettinger , Paul D. Butterfield , Antoine P. Manens , Zhenhua Zhang , Eashwer Kollata , Shou-Sung Chang
发明人： Gary C. Ettinger , Paul D. Butterfield , Antoine P. Manens , Zhenhua Zhang , Eashwer Kollata , Shou-Sung Chang
IPC分类号： B24D11/00 , B24B55/00
CPC分类号： B24B21/002 , B24B1/002 , B24B9/065
摘要： Methods and apparatus are provided for polishing a notch of a substrate using a polishing tape. In some embodiments, a polishing head may be provided that is adapted to apply the polishing tape against the notch of the substrate, including: a polishing pad having a cavity adapted to be filled with a pressure-controlled medium; and a tip region having a shape that corresponds to a shape of the notch, wherein the polishing pad is adapted to contact the polishing tape and press the polishing tape against the notch. Numerous other aspects are provided.
摘要翻译：提供了使用抛光带对衬底的凹口进行抛光的方法和装置。在一些实施例中，可以提供适于将抛光带应用于衬底的凹口的抛光头，包括：抛光垫，其具有适于填充有压力控制介质的空腔; 以及具有对应于所述凹口的形状的形状的尖端区域，其中所述抛光垫适于接触所述研磨带并将所述研磨带压在所述凹口上。提供了许多其他方面。

7. 发明申请

US20090264053A1 APPARATUS AND METHODS FOR USING A POLISHING TAPE CASSETTE 审中-公开
标题翻译：装置和使用抛光胶带的方法
公开(公告)号：US20090264053A1
公开(公告)日：2009-10-22
申请号：US12427504
申请日：2009-04-21
申请人： Antoine P. Manens , Gary C. Ettinger , Paul D. Butterfield , Shou-Sung Chang , Ricardo Martinez , Eashwer Kollata , Robert A. Ewald , Kuldip Sumbria
发明人： Antoine P. Manens , Gary C. Ettinger , Paul D. Butterfield , Shou-Sung Chang , Ricardo Martinez , Eashwer Kollata , Robert A. Ewald , Kuldip Sumbria
IPC分类号： B24B1/00 , B24D17/00
CPC分类号： B24B21/004 , B24B9/065
摘要： Methods and apparatus are provided for housing a polishing tape adapted to polish a substrate. The invention includes a cassette comprising a body portion; and a head portion, wherein the head portion includes: a pair of guide walls; one or more supply rollers positioned between the guide walls in the head portion; and wherein the guide walls are adapted to guide a polishing tape housed in the body over the one or more supply rollers. Numerous other aspects are provided.
摘要翻译：提供了用于容纳适于抛光衬底的抛光带的方法和装置。本发明包括一个盒体，包括一个主体部分; 和头部，其中所述头部包括：一对引导壁; 一个或多个供应辊定位在头部中的引导壁之间; 并且其中所述引导壁适于将容纳在所述主体中的抛光带引导到所述一个或多个供给辊上。提供了许多其他方面。

8. 发明授权

US08550879B2 Polishing pad conditioner 有权
标题翻译：抛光垫调理剂
公开(公告)号：US08550879B2
公开(公告)日：2013-10-08
申请号：US12256845
申请日：2008-10-23
申请人： Hung Chih Chen , Sen-Hou Ko , Shou-Sung Chang
发明人： Hung Chih Chen , Sen-Hou Ko , Shou-Sung Chang
IPC分类号： B24B1/00 , B24B21/18
CPC分类号： B24B53/017
摘要： Embodiments of the present invention generally provide an improved conditioning module and conditioning disks for improved pressure distribution during the process of conditioning a polishing pad of a chemical mechanical polishing (CMP) system. In one embodiment, a conditioning module comprising multiple, small conditioning disks is provided. In one embodiment, a conditioning disk having a compliant backing member is provided. In one embodiment, the compliant backing member comprises a semi-rigid backing member cut into a spiral shape to provide compliancy. In another embodiment, the compliant backing member comprises a fluid-pressurized, flexible membrane. Each embodiment of the present invention provides an improved pressure distribution across the face of each conditioning disk, resulting in increased disk life as well as increased conditioning rate and uniformity.
摘要翻译：本发明的实施例通常提供改进的调节模块和调节盘，用于在调节化学机械抛光（CMP）系统的抛光垫的过程中改善压力分布。在一个实施例中，提供了包括多个小调节盘的调节模块。在一个实施例中，提供了具有柔顺背衬构件的调节盘。在一个实施例中，柔顺背衬构件包括切割成螺旋形状以提供符合性的半刚性背衬构件。在另一个实施例中，顺从背衬构件包括流体加压的柔性膜。本发明的每个实施例提供了在每个调节盘的表面上的改进的压力分布，导致增加的盘寿命以及增加的调节速率和均匀性。

9. 发明申请

US20050092621A1 Composite pad assembly for electrochemical mechanical processing (ECMP) 审中-公开
标题翻译：电化学机械加工复合垫组件（ECMP）
公开(公告)号：US20050092621A1
公开(公告)日：2005-05-05
申请号：US10980888
申请日：2004-11-03
申请人： Yongqi Hu , Stan Tsai , Feng Liu , Liang-Yuh Chen , Ralph Wadensweiler , Paul Butterfield , Donald Olgado , Martin Wohlert , Sen-Hou Ko , Shou-Sung Chang
发明人： Yongqi Hu , Stan Tsai , Feng Liu , Liang-Yuh Chen , Ralph Wadensweiler , Paul Butterfield , Donald Olgado , Martin Wohlert , Sen-Hou Ko , Shou-Sung Chang
IPC分类号： B23H5/00
CPC分类号： B23H5/06
摘要： Embodiments of a pad assembly for processing a substrate is provided herein. In one embodiment, the pad assembly includes a body that has a non-conductive first surface and an opposing second surface. A conductive element has a planar first surface laterally disposed from the non-conductive first surface and defines a top processing surface therewith. An electrode is coupled to the second surface of the body. A first set of holes is formed through the body and exposes the electrode to the processing surface.
摘要翻译：本文提供了用于处理衬底的焊盘组件的实施例。在一个实施例中，垫组件包括具有非导电的第一表面和相对的第二表面的主体。导电元件具有从非导电的第一表面横向设置的平坦的第一表面，并且与其形成顶部处理表面。电极连接到主体的第二表面。第一组孔穿过主体形成并将电极暴露于处理表面。

10. 发明申请

US20100105302A1 POLISHING PAD CONDITIONER 有权
标题翻译：抛光垫调节器
公开(公告)号：US20100105302A1
公开(公告)日：2010-04-29
申请号：US12256845
申请日：2008-10-23
申请人： Hung Chih Chen , Sen-Hou Ko , Shou-Sung Chang
发明人： Hung Chih Chen , Sen-Hou Ko , Shou-Sung Chang
IPC分类号： B24D11/00
CPC分类号： B24B53/017
摘要： Embodiments of the present invention generally provide an improved conditioning module and conditioning disks for improved pressure distribution during the process of conditioning a polishing pad of a chemical mechanical polishing (CMP) system. In one embodiment, a conditioning module comprising multiple, small conditioning disks is provided. In one embodiment, a conditioning disk having a compliant backing member is provided. In one embodiment, the compliant backing member comprises a semi-rigid backing member cut into a spiral shape to provide compliancy. In another embodiment, the compliant backing member comprises a fluid-pressurized, flexible membrane. Each embodiment of the present invention provides an improved pressure distribution across the face of each conditioning disk, resulting in increased disk life as well as increased conditioning rate and uniformity.
摘要翻译：本发明的实施例通常提供改进的调节模块和调节盘，用于在调节化学机械抛光（CMP）系统的抛光垫的过程中改善压力分布。在一个实施例中，提供了包括多个小调节盘的调节模块。在一个实施例中，提供了具有柔顺背衬构件的调节盘。在一个实施例中，柔顺背衬构件包括切割成螺旋形状以提供符合性的半刚性背衬构件。在另一个实施例中，顺从背衬构件包括流体加压的柔性膜。本发明的每个实施例提供了在每个调节盘的表面上的改进的压力分布，导致增加的盘寿命以及增加的调节速率和均匀性。

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