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1. 发明申请

US20080121371A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20080121371A1
公开(公告)日：2008-05-29
申请号：US11626716
申请日：2007-01-24
申请人： ZHI-YONG ZHOU , MIN-QI XIAO , ZENG-JUN GAO
发明人： ZHI-YONG ZHOU , MIN-QI XIAO , ZENG-JUN GAO
IPC分类号： F28D15/00 , H05K7/20
CPC分类号： H01L23/467 , F28D15/0275 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base including a base plate made of a first heat conductive material and a substrate made of a second heat conductive material having a heat conductivity lower than that of the first heat conductive material. The substrate comprises a frame with a window receiving the base plate therein and an engaging plate spanning over the window. A fin set includes a plurality of fins parallel with and spaced from each other, and is mounted on the base. A heat pipe has an evaporating section sandwiched between the base plate and the engaging plate, and two condensing sections extending through the fin set and thermally connecting therewith. The evaporating section has a substantially V-shaped configuration.
摘要翻译：散热装置包括：底座，其包括由第一导热材料制成的基板和由导热率低于第一导热材料的第二导热材料制成的基板。衬底包括具有窗口的框架，窗口在其中容纳基板，并且跨越窗口的接合板。翅片组包括彼此平行并间隔开的多个翅片，并且安装在基座上。热管具有夹在基板和接合板之间的蒸发部分，以及延伸穿过翅片组并与其热连接的两个冷凝部分。蒸发部分具有大致V形的构造。

2. 发明申请

US20100294200A1 VAPOR CHAMBER AND METHOD FOR MANUFACTURING THE SAME 失效
标题翻译：蒸气室及其制造方法
公开(公告)号：US20100294200A1
公开(公告)日：2010-11-25
申请号：US12534880
申请日：2009-08-04
申请人： SHENG-CHAO ZHANG , ZHI-YONG ZHOU , QIAO-LI DING
发明人： SHENG-CHAO ZHANG , ZHI-YONG ZHOU , QIAO-LI DING
IPC分类号： C23C16/458 , B23P19/04
CPC分类号： F28D15/0233 , F28D15/046 , F28F2225/04 , F28F2240/00 , H01L23/427 , H01L2924/0002 , Y10T29/4935 , Y10T29/49888 , H01L2924/00
摘要： A vapor chamber includes a sealed flattened casing containing working liquid therein, a wick structure arranged on an inner face of the casing, a supporting plate received in the casing and a plurality of supporting posts. The supporting plate defines a plurality of fixing holes therein. The supporting posts are engagingly received in the fixing holes of the supporting plate. Top and bottom ends of the supporting posts engage with the wick structure to reinforce a structure of the vapor chamber.
摘要翻译：蒸气室包括容纳工作液体的密封扁平壳体，布置在壳体内表面上的芯结构，容纳在壳体中的支撑板和多个支撑柱。支撑板在其中限定多个固定孔。支撑柱被卡合在支撑板的固定孔中。支撑柱的顶端和底端与油绳结构接合以加强蒸气室的结构。

3. 发明申请

US20100128482A1 LIGHT SOURCE DEVICE HAVING HEAT DISSIPATION MODULE 失效
标题翻译：具有散热模块的光源装置
公开(公告)号：US20100128482A1
公开(公告)日：2010-05-27
申请号：US12277239
申请日：2008-11-24
申请人： ZHI-YONG ZHOU , QIAO-LI DING , HAI-BING CAO
发明人： ZHI-YONG ZHOU , QIAO-LI DING , HAI-BING CAO
IPC分类号： F21V33/00 , F21V29/00
CPC分类号： F21V29/51 , F21V29/004 , F21V29/67 , F21V29/717 , F21V29/75 , F21V29/763 , F21V29/777 , F21Y2115/10 , Y02W30/829 , Y10S362/80
摘要： A light source device includes a first heat dissipation structure, an LED module, a heat energy convertor and a fan. The first heat dissipation structure includes a heat dissipation base, a first fin group attached on a top surface of the heat dissipation base. The LED module is attached on a bottom surface of the heat dissipation base of the first heat dissipation structure. The heat energy convertor is thermally connected to the heat dissipation base of the first heat dissipation structure through heat pipes, and configured for changing heat energy generated by the LED module into kinetic energy. The fan is disposed over the first fin group and driven by the heat energy convertor.
摘要翻译：光源装置包括第一散热结构，LED模块，热能转换器和风扇。第一散热结构包括散热基座，第一翅片组附接在散热基座的顶表面上。 LED模块安装在第一散热结构的散热基底的底面上。热能转换器通过热管热连接到第一散热结构的散热基座，并且被配置为将由LED模块产生的热能改变成动能。风扇设置在第一散热片组上并由热能转换器驱动。

4. 发明申请

US20100103674A1 LED LAMP HAVING A VAPOR CHAMBER FOR DISSIPATING HEAT GENERATED BY LEDS OF THE LED LAMP 失效
标题翻译： LED灯具，用于散发由LED灯产生的热量的蒸发室
公开(公告)号：US20100103674A1
公开(公告)日：2010-04-29
申请号：US12422300
申请日：2009-04-13
申请人： CHENG-TIEN LAI , ZHI-YONG ZHOU , CHI-YUAN LAI
发明人： CHENG-TIEN LAI , ZHI-YONG ZHOU , CHI-YUAN LAI
IPC分类号： F21S4/00 , F21V29/00
CPC分类号： F21V29/70 , F21V29/004 , F21V29/51 , F21V29/75 , F21V29/763 , F21Y2105/10 , F21Y2115/10 , H01L2924/0002 , H01L2924/00
摘要： An LED lamp comprises a lamp housing, a heat sink made of metal and mounted at a bottom side of the lamp housing, a plurality of LED modules, and a vapor chamber having a bottom surface thereof attached to a top surface of the heat sink and having a top surface thereof to which the LED modules are attached, a working liquid is sealed in the vapor chamber. The vapor chamber defines a sealed chamber therein, and the working liquid is phase changeable liquid and is sealed in the sealed chamber. A plurality of ribs is arranged in the vapor chamber for strengthening an integrity of the vapor chamber, and the ribs divide the sealed chamber into a plurality of communicating spaces.
摘要翻译： LED灯包括灯壳体，由金属制成的散热器并安装在灯壳的底侧，多个LED模块和蒸汽室，其底表面连接到散热器的顶表面，具有其上附接有LED模块的顶表面，工作液体被密封在蒸气室中。蒸气室在其中限定了一个密封室，工作液体是相变液体，并被密封在密封室中。多个肋布置在蒸气室中，用于加强蒸气室的完整性，并且肋将密封室分成多个连通空间。

5. 发明申请

US20090310372A1 LED LAMP HAVING ACTIVE HEAT DISSIPATION STRUCTURE 失效
标题翻译： LED灯具有主动散热结构
公开(公告)号：US20090310372A1
公开(公告)日：2009-12-17
申请号：US12238422
申请日：2008-09-25
申请人： ZHI-YONG ZHOU , QIAO-LI DING
发明人： ZHI-YONG ZHOU , QIAO-LI DING
IPC分类号： F21V29/02
CPC分类号： F21V29/67 , F21V29/763 , F21Y2115/10
摘要： An LED lamp includes a heat sink, a centrifugal blower and a plurality of LED modules. The heat sink includes a base plate defining an air intake adjacent to an end of the base plate and a plurality of fins extending downwardly from a bottom surface of the base plate, between the air intake and an opposite remote end of the base plate. The centrifugal blower is mounted on the bottom surface of the base plate and located between the air intake and the fins. The LED modules are fixed on a top surface of the base plate of the heat sink. The housing engages with the base plate to enclose the centrifugal blower and the fins therein and cooperates with the base plate to define an exhaust port between the opposite remote end of the base plate and a corresponding sidewall of the housing.
摘要翻译： LED灯包括散热器，离心鼓风机和多个LED模块。散热器包括限定与基板的端部相邻的进气口的基板和从基板的底表面向下延伸的多个翅片，位于进气口和基板的相对的远端之间。离心鼓风机安装在基板的底面上，位于进气口和散热片之间。 LED模块固定在散热器底板的顶面上。壳体与基板接合以将离心鼓风机和翅片封闭在其中并与底板协作以在基板的相对的远端和壳体的相应侧壁之间限定排气口。

6. 发明申请

US20090266513A1 HEAT DISSIPATION DEVICE 审中-公开
标题翻译：散热装置
公开(公告)号：US20090266513A1
公开(公告)日：2009-10-29
申请号：US12239832
申请日：2008-09-29
申请人： HAI-GANG XIONG , ZHI-YONG ZHOU
发明人： HAI-GANG XIONG , ZHI-YONG ZHOU
IPC分类号： F28F7/00 , F28D15/00
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device adapted for removing heat from a heat-generating electronic device, includes a base, a first fin unit arranged on a top surface of the base. The base includes a base plate, a spreader and a heat pipe group sandwiched between the base plate and the spreader. The base plate defines therein an opening. The heat pipe group has an inserting protrusion and a receiving recession opposing the inserting protrusion. The inserting protrusion protrudes upwardly from a top surface of the heat pipe group and is embedded in the opening of the base plate. The receiving recession recesses upwardly from a bottom surface of the heat pipe group and receives therein the spreader.
摘要翻译：一种适用于从发热电子装置中除去热量的散热装置，包括底座，布置在基座顶面上的第一翅片单元。基座包括夹在基板和吊具之间的基板，吊具和热管组。基板在其中限定开口。热管组具有与插入突起相对的插入突起和接收凹部。插入突起从热管组的顶表面向上突出并嵌入基板的开口中。接收凹部从热管组的底表面向上凹陷并在其中容纳扩展器。

7. 发明申请

US20080104992A1 MINIATURE LIQUID COOLING DEVICE HAVING AN INTEGRAL PUMP 失效
标题翻译：具有整体泵的微型液体冷却装置
公开(公告)号：US20080104992A1
公开(公告)日：2008-05-08
申请号：US11556618
申请日：2006-11-03
申请人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
发明人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
IPC分类号： F25D17/02
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling device includes a casing having an outer wall, a bottom base attached to a bottom end of the outer wall and a top cover attached to a top end of the outer wall. The casing defines a receiving space therein for receiving an impeller therein. A sealed chamber is defined in the casing and isolated from the receiving space. A motor driving unit is received in the sealed chamber and magnetically interacts with the impeller to drive the impeller to rotate. The motor driving unit comprises a motor having a stator and a printed circuit board electrically connecting with the stator. The top cover covers the motor driving unit and thermally contacts with electronic components on the printed circuit board for dissipating heat generated by the electronic components when the motor driving unit is operated.
摘要翻译：液体冷却装置包括具有外壁，附接到外壁的底端的底部基座和附接到外壁的顶端的顶盖的壳体。壳体在其中限定了容纳空间，用于在其中容纳叶轮。密封室限定在外壳中并与接收空间隔离。马达驱动单元被容纳在密封室中并且与叶轮磁力相互作用以驱动叶轮旋转。马达驱动单元包括具有定子和与定子电连接的印刷电路板的马达。顶盖覆盖电动机驱动单元并与印刷电路板上的电子部件热接触，用于在电动机驱动单元操作时散发由电子部件产生的热量。

8. 发明申请

US20070263360A1 MEMORY MODULE ASSEMBLY INCLUDING A CLIP FOR MOUNTING A HEAT SINK THEREON 失效
标题翻译：存储模块组件，其中包括用于安装散热片的夹子
公开(公告)号：US20070263360A1
公开(公告)日：2007-11-15
申请号：US11308848
申请日：2006-05-15
申请人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
发明人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A memory module assembly includes a printed circuit board (30) having a heat-generating electronic component (32) thereon, a heat sink (10) and a clip (20) for securing the heat sink onto the heat-generating electronic component. The heat sink includes a base (12) and a plurality of fins (14) arranged on the base. A plurality of recesses is defined in the heat sink. The clip includes a body (22) resting against a face of the printed circuit board and elastic hooks (24) extending from the body. The hooks are received in the recesses and resiliently press the base of the heat sink toward the heat-generating electronic component, whereby the clip clamps the heat sink and the printed circuit board together.
摘要翻译：存储器模块组件包括其上具有发热电子部件（32）的印刷电路板（30），散热器（10）和用于将散热器固定到发热电子部件上的夹子（20）。散热器包括基座（12）和布置在基座上的多个翅片（14）。在散热器中限定多个凹部。夹子包括靠在印刷电路板的表面上的主体（22）和从主体延伸的弹性钩（24）。钩子被容纳在凹部中并将散热器的基座弹性地压向发热电子部件，由此夹子将散热器和印刷电路板夹在一起。

9. 发明申请

US20110030921A1 VAPOR CHAMBER AND METHOD FOR MANUFACTURING THE SAME 失效
标题翻译：蒸气室及其制造方法
公开(公告)号：US20110030921A1
公开(公告)日：2011-02-10
申请号：US12581172
申请日：2009-10-19
申请人： SHENG-CHAO ZHANG , ZHI-YONG ZHOU
发明人： SHENG-CHAO ZHANG , ZHI-YONG ZHOU
IPC分类号： F28D15/02 , B23P15/26
CPC分类号： F28D15/046 , F28F2225/04 , Y10T29/49393
摘要： A vapor chamber includes a sealed flattened casing containing working liquid therein, a wick structure arranged on an inner face of the casing, a plurality of supporting posts received in the casing and at least a metallic wire connecting the supporting posts. Each supporting post defines at least a channel therein. The at least a metallic wire engagingly extends through the channels of the supporting posts. Top and bottom ends of the supporting posts engage the wick structure to reinforce a structure of the vapor chamber.
摘要翻译：蒸气室包括容纳工作液体的密封扁平壳体，布置在壳体内表面上的芯体结构，容纳在壳体中的多个支撑柱和至少连接支撑柱的金属线。每个支撑柱至少在其中限定一个通道。所述至少一个金属丝线通过所述支撑柱的通道接合地延伸。支撑柱的顶端和底端接合芯结构以加强蒸气室的结构。

10. 发明申请

US20090225518A1 HEAT SINK AND A METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：散热器及其制造方法
公开(公告)号：US20090225518A1
公开(公告)日：2009-09-10
申请号：US12202393
申请日：2008-09-01
申请人： CHI-YUAN LAI , ZHI-YONG ZHOU , CHENG-TIEN LAI
发明人： CHI-YUAN LAI , ZHI-YONG ZHOU , CHENG-TIEN LAI
IPC分类号： H05K7/20 , B23P6/00
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0275 , F28F3/02 , H01L23/467 , H01L2924/0002 , Y10T29/49353 , H01L2924/00
摘要： A heat sink for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate forms a protrusion projecting downwardly therefrom. A bottom surface of the protrusion is milled to be flat and smooth, whereby the bottom surface can intimately contact the electronic component. A method for manufacturing the heat sink comprising milling a bottom surface of a protrusion punched downwardly from a lower plate, whereby the bottom surface can be flat and smooth sufficiently to have an intimate contact with an electronic component, and sequentially welding an upper plate on the lower plate and a plurality of fins on the lower plate and the upper plate, respectively.
摘要翻译：用于冷却电子部件的散热器包括分别固定在上板和下板上的下板，上板，上翅片组和下翅片组，以及夹在上板和下板之间的多个热管下板下板形成从其向下突出的突起。突起的底面被研磨成平坦和平滑的，由此底部表面可以紧密接触电子部件。一种用于制造散热器的方法，包括：铣削从下板向下冲压的突起的底面，由此底表面可以平坦和平滑，足以与电子元件紧密接触，并且将上板依次焊接在下板和分别在下板和上板上的多个翅片。

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