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1. 发明申请

US20090166005A1 VAPOR CHAMBER 审中-公开
标题翻译：蒸气室
公开(公告)号：US20090166005A1
公开(公告)日：2009-07-02
申请号：US11967069
申请日：2007-12-29
申请人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
发明人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
IPC分类号： F28D15/04 , H01L23/427
CPC分类号： F28D15/046 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A vapor chamber includes a base (100) and a cover (200). The cover is mounted on the base with a hermetically sealed cavity (102) defined between the base and the cover. A working fluid is contained in the cavity. A first wick structure (220) is spread on an inner surface (201) of the cover. A second wick structure (221) is disposed in the cavity. A third wick structure (110) is spread on an inner surface (101) of the base, and the second wick structure extends between the first wick structure and the third wick structure. A first vapor space (300) is defined in the cavity and surrounds the second wick structure. A second vapor space (400) is defined in the second wick structure and communicated with the first vapor space.
摘要翻译：蒸气室包括基座（100）和盖子（200）。盖子安装在基座上，并具有限定在基座和盖子之间的气密密封腔（102）。工作流体包含在空腔中。第一芯结构（220）分散在盖的内表面（201）上。第二芯结构（221）设置在空腔中。第三芯结构（110）分散在基座的内表面（101）上，第二芯结构在第一芯结构和第三芯结构之间延伸。第一蒸气空间（300）被限定在空腔中并且围绕第二芯结构。第二蒸汽空间（400）被限定在第二吸芯结构中并且与第一蒸气空间连通。

2. 发明申请

US20070263359A1 MEMORY MODULE ASSEMBLY INCLUDING A CLAMP FOR MOUNTING HEAT SINKS THEREON 失效
标题翻译：存储器模块组件，其中包括用于安装散热器的钳子
公开(公告)号：US20070263359A1
公开(公告)日：2007-11-15
申请号：US11308839
申请日：2006-05-12
申请人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
发明人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A memory module assembly includes a printed circuit board (10) having a main heat-generating electronic component (52) thereon, first and second heat sinks (20), (30) attached on opposite sides of the printed circuit board and a clamp (40) clamping the first, second heat sinks and the printed circuit board together. The first heat sink comprises a pair of positioning poles (24). The second heat sink comprises a heat pipe (36) disposed therein and thermally connecting therewith. The clamp comprises a connecting portion (42) and a pair of elastic pressing portions (44). The clamp resiliently presses the second heat sink toward the main heat-generating electronic component and the first heat sink engages with the second heat sink via the positioning poles of the first heat sink extending in and engaging with the second heat sink.
摘要翻译：存储模块组件包括其上具有主要发热电子部件（52）的印刷电路板（10），安装在印刷电路板的相对侧上的第一和第二散热器（20），（30）和夹具 40）将第一，第二散热器和印刷电路板夹在一起。第一散热器包括一对定位极（24）。第二散热器包括设置在其中并与其热连接的热管（36）。夹具包括连接部分（42）和一对弹性按压部分（44）。夹具将第二散热器弹性地压向主发热电子部件，并且第一散热器经由第一散热器的定位极与第二散热器接合，第一散热器的定位极延伸并与第二散热器接合。

3. 发明申请

US20090166003A1 HEAT SPREADER WITH VAPOR CHAMBER 失效
标题翻译：带蒸气室的散热器
公开(公告)号：US20090166003A1
公开(公告)日：2009-07-02
申请号：US11964912
申请日：2007-12-27
申请人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
发明人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
IPC分类号： F28D15/04
CPC分类号： F28D15/0233 , F28D15/046 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat spreader for cooling an electronic component includes a lower plate defining a chamber, an upper plate fixed on the lower plate to seal the chamber, a first wick layer and a second wick layer sandwiched between the upper plate, and a working liquid contained in the chamber. The first wick layer and the second wick layer respectively define a plurality of apertures, which include right-angled triangle, acute-angled triangle, and rhomb apertures communicating with each other for containing the working liquid therein.
摘要翻译：用于冷却电子部件的散热器包括限定室的下板，固定在下板上以密封室的上板，夹在上板之间的第一芯芯层和第二芯芯层，以及包含在其中的工作液体房间。第一灯芯层和第二灯芯层分别限定多个孔，其包括彼此连通的直角三角形，锐角三角形和菱形孔，用于在其中容纳工作液体。

4. 发明申请

US20090162225A1 PUMP FOR LIQUID COOLING SYSTEM 审中-公开
标题翻译：液体冷却系统泵
公开(公告)号：US20090162225A1
公开(公告)日：2009-06-25
申请号：US11961344
申请日：2007-12-20
申请人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
发明人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
IPC分类号： F04D13/08 , H02K5/132 , F04D7/04 , H02K16/04
CPC分类号： F04D13/0673 , F04D13/064 , F04D29/047 , H02K5/132 , H02K16/04 , H02K21/12
摘要： A pump comprises a base (10), a case (20) fixed on the base, a rotor (30) received between the case and the base, and an inner stator (40) and an outer stator (50) accommodated in the case. The rotor is sandwiched between the inner stator and the outer stator. When the inner stator and the outer stator are energized to generate respective magnetic fields, the rotor is driven to rotate by turning torques that are produced by mutual actions between the rotor and the magnetic fields. Thus, the interior and exterior magnetic fields of the rotor can be utilized sufficiently, and an operation efficiency of the pump is enhanced accordingly.
摘要翻译：泵包括基座（10），固定在基座上的壳体（20），容纳在壳体和基座之间的转子（30）和容纳在壳体中的内部定子（40）和外部定子（50）。转子夹在内定子和外定子之间。当内部定子和外部定子通电以产生相应的磁场时，通过转子和磁场之间的相互作用产生的转矩来驱动转子旋转。因此，可以充分利用转子的内部和外部磁场，并且相应地提高泵的运行效率。

5. 发明申请

US20090151905A1 HEAT SINK WITH VAPOR CHAMBER 审中-公开
标题翻译：与蒸汽房散热
公开(公告)号：US20090151905A1
公开(公告)日：2009-06-18
申请号：US11957349
申请日：2007-12-14
申请人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
发明人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
IPC分类号： F28D15/02 , F28D15/04
CPC分类号： F28D15/04 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes a tank and a plate covering on the tank and hermetically engaging with the tank. The tank includes a base for absorbing heat from heat-generating members and a sintered wick layer formed at an inner face of base. The plate has a meshed wick layer formed at an inner face thereof. A chamber is defined between the tank and the plate and contains working fluid therein.
摘要翻译：散热器包括一个罐和一个覆盖在罐上的板，并与油箱密封接合。该罐包括用于从发热元件吸收热量的基底和形成在基底内表面处的烧结芯芯层。该板具有在其内表面形成的网状芯芯层。在罐和板之间限定一个室，并在其中包含工作流体。

6. 发明申请

US20070223198A1 MEMORY MODULE ASSEMBLY INCLUDING A CLAMP FOR MOUNTING HEAT SINKS THEREON 失效
标题翻译：存储器模块组件，其中包括用于安装散热器的钳子
公开(公告)号：US20070223198A1
公开(公告)日：2007-09-27
申请号：US11309226
申请日：2006-07-13
申请人： CHENG-TIEN LAI , Zhi-Yong Zhou , Qiao-Li Ding
发明人： CHENG-TIEN LAI , Zhi-Yong Zhou , Qiao-Li Ding
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A memory module assembly includes a pair of heat-dissipation plates (10), a printed circuit board (20) sandwiched between the heat-dissipation plates (10), and four clamps (30) for securing the heat-dissipation plates (10) onto opposite sides of the printed circuit board (20). Each clamp includes a connecting portion (32) and a pair of elastic pressing portions (34) extending from opposite free ends of the connecting portion. Each pressing portion has a pair of hooks (342) extending from opposite lateral sides thereof and an engaging portion extending (344) from a free end thereof and clamping on an end of the heat-dissipation plate. The hooks are inserted into openings (18) defined in the heat-dissipation plates and engage with inner surfaces of the heat-dissipation plates.
摘要翻译：存储模块组件包括一对散热板（10），夹在散热板（10）之间的印刷电路板（20）和用于固定散热板（10）的四个夹具（30）在印刷电路板（20）的相对侧上。每个夹具包括连接部分（32）和从连接部分的相对的自由端延伸的一对弹性按压部分（34）。每个按压部分具有从其相对侧面延伸的一对钩（342）和从其自由端延伸（344）并且夹持在散热板的端部上的接合部。将钩插入到限定在散热板中的开口（18）中，并与散热板的内表面接合。

7. 发明申请

US20090166004A1 HEAT PIPE 审中-公开
标题翻译：热管
公开(公告)号：US20090166004A1
公开(公告)日：2009-07-02
申请号：US11967058
申请日：2007-12-29
申请人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
发明人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
IPC分类号： F28D15/04
CPC分类号： F28D15/046
摘要： A heat pipe includes a hollow metal casing and a wick structure arranged at an inner surface of the hollow metal casing. A part of the inner surface of the hollow metal casing is covered with the wick structure and other parts of the inner surface are uncovered with the wick structure.
摘要翻译：热管包括中空金属壳体和布置在中空金属壳体的内表面处的芯结构。中空金属外壳的内表面的一部分被芯体结构覆盖，并且内表面的其它部分被芯结构覆盖。

8. 发明申请

US20090155099A1 PUMP FOR LIQUID COOLING SYSTEM 审中-公开
标题翻译：液体冷却系统泵
公开(公告)号：US20090155099A1
公开(公告)日：2009-06-18
申请号：US11959436
申请日：2007-12-18
申请人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
发明人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
IPC分类号： F04B17/00
CPC分类号： F04D13/064 , F04D13/0673
摘要： A pump includes a base (10), a case (20) fixed on the base, a stator (30) embedded into the case, a rotor unit (40) sandwiched between the base and the case. The rotor unit includes an inner rotor (42) surrounded by the stator and an outer rotor (44) surrounding the stator. Magnetic fields produced by the stator have interior parts interacting with the inner rotor, and exterior parts interlinking with the outer rotor. Therefore, the magnetic fields are able to be utilized sufficiently to drive the rotor unit to have a high speed rotation, and an operation efficiency of the pump is enhanced accordingly.
摘要翻译：泵包括基座（10），固定在基座上的壳体（20），嵌入壳体中的定子（30），夹在基座和壳体之间的转子单元（40）。转子单元包括被定子包围的内转子（42）和围绕定子的外转子（44）。由定子产生的磁场具有与内转子相互作用的内部部分，以及与外转子相互连接的外部部件。因此，能够充分利用磁场来驱动转子单元进行高速旋转，从而相应地提高泵的运转效率。

9. 发明申请

US20090151906A1 HEAT SINK WITH VAPOR CHAMBER 审中-公开
标题翻译：与蒸汽房散热
公开(公告)号：US20090151906A1
公开(公告)日：2009-06-18
申请号：US11959313
申请日：2007-12-18
申请人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
发明人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
IPC分类号： F28D15/00
CPC分类号： F28D15/046 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes a tank and a plate covering on the tank and hermetically engaging with the tank. The tank includes a base for absorbing heat from heat-generating members and a first wick layer formed at an inner face of base. The plate has a second wick layer formed at an inner face thereof. A chamber is defined between the tank and the plate and contains working fluid therein. An artery mesh is located in the chamber between the tank and the plate. The artery mesh is in porosity communication with the first wick layer and the second wick layer.
摘要翻译：散热器包括一个罐和一个覆盖在罐上的板，并与油箱密封接合。该罐包括用于从发热部件吸收热量的基座和形成在基部内表面的第一芯线层。该板具有形成在其内表面的第二芯吸层。在罐和板之间限定一个室，并在其中包含工作流体。动脉网位于罐和板之间的腔室中。动脉网与第一芯线层和第二芯线层连通。

10. 发明申请

US20080158885A1 LIGHT EMITTING DIODE MODULE 失效
标题翻译：发光二极管模块
公开(公告)号：US20080158885A1
公开(公告)日：2008-07-03
申请号：US11617117
申请日：2006-12-28
申请人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
发明人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
IPC分类号： H01L33/00 , H01L23/36 , F21V29/00
CPC分类号： F21V29/51 , F21V29/004 , F21V29/763 , F21Y2115/10 , H01L2924/0002 , Y10S362/80 , H01L2924/00
摘要： An LED module includes a housing component, a frame holding an LED thereon and covered by the housing component, a fastener located in and secured to the housing component, a heat spreader located in the fastener and secured to the fastener and a heat transfer member having a heat-dissipating unit remote from the LED and a heat pipe thermally connecting with the heat spreader, the LED and the heat-dissipating unit. The housing component tightly presses the frame on the fastener to make a close contact between the heat pipe and the frame. The heat pipe transfers heat from the LED to the heat spreader and the heat-dissipating unit. The heat spreader and the heat-dissipating unit each have a large heat-dissipating surface, whereby the heat generated by the LED can be quickly dissipated by the heat spreader and the heat-dissipating unit.
摘要翻译： LED模块包括壳体部件，在其上保持LED并被壳体部件覆盖的框架，位于壳体部件中并固定到壳体部件上的紧固件，位于紧固件中并固定到紧固件的散热器和传热部件，传热部件具有远离LED的散热单元和与散热器，LED和散热单元热连接的热管。外壳部件将紧固件上的框架紧紧地按压在热管和框架之间的紧密接触。热管将热量从LED传递到散热器和散热单元。散热器和散热单元各自具有大的散热表面，由此由散热器和散热单元可以快速地消散由LED产生的热量。

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