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    • 6. 发明申请
    • Heat dissipating structure and method for fabricating the same
    • 散热结构及其制造方法
    • US20070296079A1
    • 2007-12-27
    • US11818225
    • 2007-06-12
    • Chien-Ping HuangHan-Ping PuHo-Yi Tsai
    • Chien-Ping HuangHan-Ping PuHo-Yi Tsai
    • H01L23/34H01L21/58
    • H01L23/4334H01L23/3121H01L24/48H01L2224/4824H01L2224/73204H01L2924/00014H01L2924/01019H01L2924/01079H01L2924/1815H01L2924/18165H01L2224/45099H01L2224/45015H01L2924/207
    • A heat sink package structure and a method for fabricating the same are disclosed. The method includes mounting and electrically connecting a semiconductor chip to a chip carrier, forming an interface layer or a second heat dissipating element having the interface layer on the semiconductor chip and installing a first heat dissipating element having a heat dissipating portion and a supporting portion onto the chip carrier. The method further includes forming openings corresponding to the semiconductor chip in the heat dissipating portion, and forming an encapsulant for covering the semiconductor chip, the interface layer or the second heat dissipating element, and the first heat dissipating element. A height is reserved on top of the interface layer for the formation of the encapsulant for covering the interface layer. The method further includes cutting the encapsulant along edges of the interface layer, and removing the redundant encapsulant on the interface layer. Therefore, the drawbacks of the prior art of the burrs caused by a cutting tool for cutting the heat dissipating element and wearing of the cutting tool are overcome.
    • 公开了一种散热器封装结构及其制造方法。 该方法包括将半导体芯片安装并电连接到芯片载体,在半导体芯片上形成具有界面层的界面层或第二散热元件,并将具有散热部分和支撑部分的第一散热元件安装到 芯片载体。 该方法还包括形成对应于散热部分中的半导体芯片的开口,以及形成用于覆盖半导体芯片,界面层或第二散热元件的密封剂和第一散热元件。 在接口层顶部保留一个高度,用于形成覆盖界面层的密封剂。 该方法还包括沿着界面层的边缘切割密封剂,以及去除界面层上的冗余密封剂。 因此,克服了用于切割散热元件的切削工具和切削工具的磨损引起的毛刺现有技术的缺陷。