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    • 7. 发明授权
    • Treatment apparatus
    • US5829939A
    • 1998-11-03
    • US667584
    • 1996-06-24
    • Hiroyuki IwaiTamotsu TanifujiTakanobu AsanoRyoichi Okura
    • Hiroyuki IwaiTamotsu TanifujiTakanobu AsanoRyoichi Okura
    • H01L21/304H01L21/677H01L21/00
    • H01L21/67769H01L21/67772Y10S414/137Y10S414/139Y10S414/14
    • A treatment apparatus comprises a treatment chamber for performing a treatment for a workpiece W, a loading chamber connected to the treatment chamber, for loading and unloading a holding member which contains the workpiece into and from the treatment chamber, and an input/output chamber for inputting and outputting the workpiece to and from the loading chamber. The input/output chamber includes a cassette accommodating vessel port which holds a cassette accommodating vessel. The vessel is filled with clean air or an inert gas, and is airtightly closed. A cassette receiving mechanism is disposed below the port and lowers only the cassette of the vessel so as to receive the cassette. Thus, when the cassette is input and output to and from the outside of the treatment apparatus, the workpiece contained within the cassette is not exposed to the atmosphere in a working region. Consequently, it is not necessary to improve the cleanliness level of the atmosphere in the working region. As a result, the construction cost of the clean room and the operation cost thereof can be reduced. A clean air blowing device is disposed below the port. The clean air blowing device blows a side flow of clean air. Thus, the atmosphere at a position below the port where air tends to stay is circulated. Thus, since the surface of the workpiece loaded in the treatment chamber is exposed to the side flow, particles and the like that adhere thereto are purged.
    • 8. 发明授权
    • Vertical heat treatment apparatus
    • 立式热处理设备
    • US5951282A
    • 1999-09-14
    • US91420
    • 1998-06-24
    • Kazunari SakataTamotsu TanifujiAkihiko Tsukada
    • Kazunari SakataTamotsu TanifujiAkihiko Tsukada
    • H01L21/00F27D3/12
    • H01L21/67109
    • The vertical heat treatment apparatus for semiconductor wafers (W) includes a heat treatment furnace (19). In the heat treatment furnace (19), the wafers (W) are subjected to a batch treatment in a state mounted on a boat (16). To the lower side of the heat treatment furnace (19), a preparatory vacuum chamber (102) is airtightly connected through a manifold (33). The manifold (33) has first and second parts (33a and 33b) separably coupled to each other, which are connected to the heat treatment furnace (19) and the preparatory vacuum chamber (102), respectively. The second part (33b) defines a valve seat on which a lid (22) is seated to cut off the communication between the heat treatment furnace (19) and the preparatory vacuum chamber (102). In a state where the lid (22) is seated on the valve seat to maintain the preparatory vacuum chamber (102) airtight, the heat treatment furnace (19) can be separated together with the first part (33a) of the manifold from the preparatory vacuum chamber (102) and the second part (33b) of the manifold.
    • PCT No.PCT / JP97 / 03791 Sec。 371日期:1998年6月24日 102(e)1998年6月24日PCT 1997年10月21日PCT PCT。 第WO98 / 19335号公报 日期1998年5月7日半导体晶片用立式热处理装置(W)包括热处理炉(19)。 在热处理炉(19)中,在安装在船(16)上的状态下对晶片(W)进行批处理。 在热处理炉(19)的下侧,准备真空室(102)通过歧管(33)气密连接。 歧管(33)具有分别彼此分离地连接到热处理炉(19)和预备真空室(102)的第一和第二部分(33a和33b)。 第二部分(33b)限定了一个阀座,在其上安置有盖(22)以截断热处理炉(19)和预备真空室(102)之间的连通。 在将盖(22)安置在阀座上以保持预备真空室(102)气密的状态下,热处理炉(19)可与歧管的第一部分(33a)一起从预备 真空室(102)和歧管的第二部分(33b)。
    • 9. 发明授权
    • Treatment apparatus
    • 治疗仪器
    • US5562383A
    • 1996-10-08
    • US583669
    • 1996-01-05
    • Hiroyuki IwaiTamotsu TanifujiTakanobu AsanoRyoichi Okura
    • Hiroyuki IwaiTamotsu TanifujiTakanobu AsanoRyoichi Okura
    • H01L21/304H01L21/677H01L21/00
    • H01L21/67769H01L21/67772Y10S414/137Y10S414/139Y10S414/14
    • A treatment apparatus comprises a treatment chamber for performing a treatment for a workpiece W, a loading chamber connected to the treatment chamber, for loading and unloading a holding member which contains the workpiece into and from the treatment chamber, and an input/output chamber for inputting and outputting the workpiece to and from the loading chamber. The input/output chamber includes a cassette accommodating vessel port which holds a cassette accommodating vessel. The vessel is filled with clean air or an inert gas, and is airtightly closed. A cassette receiving mechanism is disposed below the port and lowers only the cassette of the vessel so as to receive the cassette. Thus, when the cassette is input and output to and from the outside of the treatment apparatus, the workpiece contained within the cassette is not exposed to the atmosphere in a working region. Consequently, it is not necessary to improve the cleanliness level of the atmosphere in the working region. As a result, the construction cost of the clean room and the operation cost thereof can be reduced. A clean air blowing device is disposed below the port. The clean air blowing device blows a side flow of clean air. Thus, the atmosphere at a position below the port where air tends to stay is circulated. Thus, since the surface of the workpiece loaded in the treatment chamber is exposed to the side flow, particles and the like that adhere thereto are purged.
    • 处理装置包括:处理室,用于对工件W进行处理,连接到处理室的装载室,用于将包含工件的保持构件装载到处理室和从处理室中卸载;以及输入/输出室, 将工件输入和输出到装载室。 输入/输出室包括容纳容纳容器的盒式磁带容纳容器端口。 容器内装有清洁空气或惰性气体,并且气密地关闭。 盒接收机构设置在端口下方,并且仅降低容器的盒以便接收盒。 因此,当盒子从处理设备的外部输入和输出时,包含在盒内的工件不会暴露在工作区域中的大气中。 因此,不需要提高工作区域的气氛的清洁度。 因此,能够降低洁净室的建筑成本及其运转成本。 清洁吹风装置设置在端口下方。 清洁吹风装置吹扫清洁空气的侧流。 因此,空气倾向于停留的港口下方的气氛被循环。 因此,由于装载在处理室中的工件的表面暴露于侧流,所以清除附着在其上的颗粒等。