专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07894200B2 Printed wiring board with built-in semiconductor element, and process for producing the same 有权
标题翻译：具有内置半导体元件的印刷电路板及其制造方法
公开(公告)号：US07894200B2
公开(公告)日：2011-02-22
申请号：US11913559
申请日：2006-11-28
申请人： Yutaka Yoshino , Takahiro Shirai , Shinji Kadono , Mineo Kawamoto , Minoru Enomoto , Masakatsu Goto , Makoto Araki , Naoki Toda
发明人： Yutaka Yoshino , Takahiro Shirai , Shinji Kadono , Mineo Kawamoto , Minoru Enomoto , Masakatsu Goto , Makoto Araki , Naoki Toda
IPC分类号： H05K1/18
CPC分类号： H01L23/5389 , H01L25/105 , H01L2224/16237 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73204 , H01L2224/73265 , H01L2224/82039 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12044 , H01L2924/3011 , H05K1/023 , H05K1/186 , H05K3/4602 , H05K3/4623 , H05K3/4652 , H05K2201/0187 , H05K2201/10674 , Y10T29/49146 , H01L2924/00014
摘要： The present invention provides a printed wiring board with a built-in semiconductor element in which an insufficient or excessive amount of filled sealing material does not affect excellent adhesion of the printed wiring board to an overlying wiring board. The printed wiring board with a built-in semiconductor element comprises a built-in semiconductor element, in which at least the lower surface, the upper surface, or the side surface of the semiconductor element is covered with an insulating film, and an insulating layer is provided in the side and upper portions of the semiconductor element. There is also provided a process for producing a printed wiring board with a built-in semiconductor element, comprising the steps of mounting a semiconductor element on a base substrate and covering at least the lower surface, the upper surface, or the side surface of the semiconductor element with an insulating film, disposing and stacking a semicured insulating sheet in the side portion of the semiconductor element, and disposing and stacking a semicured insulating sheet in the upper portion of the semiconductor element.
摘要翻译：本发明提供一种具有内置半导体元件的印刷电路板，其中填充的密封材料的量不足或过量不会影响印刷电路板对上覆布线板的优异的粘附性。具有内置半导体元件的印刷线路板包括内置半导体元件，其中至少半导体元件的下表面，上表面或侧表面被绝缘膜覆盖，绝缘层设置在半导体元件的侧部和上部。还提供了一种用于制造具有内置半导体元件的印刷线路板的方法，包括以下步骤：将半导体元件安装在基底基板上，并且至少覆盖基底基板的下表面，上表面或侧表面具有绝缘膜的半导体元件，在半导体元件的侧部设置和层叠半固化绝缘片，并且在半导体元件的上部设置和层叠半固化绝缘片。

2. 发明申请

US20110090657A1 PRINTED WIRING BOARD WITH BUILT-IN SEMICONDUCTOR ELEMENT, AND PROCESS FOR PRODUCING THE SAME 有权
标题翻译：具有内置半导体元件的印刷电路板及其制造方法
公开(公告)号：US20110090657A1
公开(公告)日：2011-04-21
申请号：US12966251
申请日：2010-12-13
申请人： Yutaka YOSHINO , Takahiro Shirai , Shinji Kadono , Mineo Kawamoto , Minoru Enomoto , Masakatsu Goto , Makoto Araki , Naoki Toda
发明人： Yutaka YOSHINO , Takahiro Shirai , Shinji Kadono , Mineo Kawamoto , Minoru Enomoto , Masakatsu Goto , Makoto Araki , Naoki Toda
IPC分类号： H05K1/18
CPC分类号： H01L23/5389 , H01L25/105 , H01L2224/16237 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73204 , H01L2224/73265 , H01L2224/82039 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12044 , H01L2924/3011 , H05K1/023 , H05K1/186 , H05K3/4602 , H05K3/4623 , H05K3/4652 , H05K2201/0187 , H05K2201/10674 , Y10T29/49146 , H01L2924/00014
摘要： A printed wiring board includes a built-in semiconductor element. A protective film is formed on a semiconductor element-mounted surface of a base substrate to which the built-in semiconductor element is connected to protect the semiconductor element-mounted surface excepting a mounting pad. Upper and side surfaces of the built-in semiconductor element are covered with a first insulating film formed by filling a sealing material. The first insulating film is covered with a second insulating film formed of an insulating resin melted from an insulating layer that is provided in side and upper portions of the built-in semiconductor element.
摘要翻译：印刷电路板包括内置的半导体元件。在与内置半导体元件连接的基底基板的半导体元件安装面上形成保护膜，以保护除了安装焊盘之外的半导体元件安装表面。通过填充密封材料形成的第一绝缘膜覆盖内置半导体元件的上表面和侧表面。第一绝缘膜被由设置在内置半导体元件的侧部和上部的绝缘层熔化的绝缘树脂形成的第二绝缘膜覆盖。

3. 发明授权

US08035979B2 Printed wiring board with built-in semiconductor element, and process for producing the same 有权
标题翻译：具有内置半导体元件的印刷电路板及其制造方法
公开(公告)号：US08035979B2
公开(公告)日：2011-10-11
申请号：US12966251
申请日：2010-12-13
申请人： Yutaka Yoshino , Takahiro Shirai , Shinji Kadono , Mineo Kawamoto , Minoru Enomoto , Masakatsu Goto , Makoto Araki , Naoki Toda
发明人： Yutaka Yoshino , Takahiro Shirai , Shinji Kadono , Mineo Kawamoto , Minoru Enomoto , Masakatsu Goto , Makoto Araki , Naoki Toda
IPC分类号： H05K1/18
CPC分类号： H01L23/5389 , H01L25/105 , H01L2224/16237 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73204 , H01L2224/73265 , H01L2224/82039 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12044 , H01L2924/3011 , H05K1/023 , H05K1/186 , H05K3/4602 , H05K3/4623 , H05K3/4652 , H05K2201/0187 , H05K2201/10674 , Y10T29/49146 , H01L2924/00014
摘要： A printed wiring board includes a built-in semiconductor element. A protective film is formed on a semiconductor element-mounted surface of a base substrate to which the built-in semiconductor element is connected to protect the semiconductor element-mounted surface excepting a mounting pad. Upper and side surfaces of the built-in semiconductor element are covered with a first insulating film formed by filling a sealing material. The first insulating film is covered with a second insulating film formed of an insulating resin melted from an insulating layer that is provided in side and upper portions of the built-in semiconductor element.
摘要翻译：印刷电路板包括内置的半导体元件。在与内置半导体元件连接的基底基板的半导体元件安装面上形成保护膜，以保护除了安装焊盘之外的半导体元件安装表面。通过填充密封材料形成的第一绝缘膜覆盖内置半导体元件的上表面和侧表面。第一绝缘膜被由设置在内置半导体元件的侧部和上部的绝缘层熔化的绝缘树脂形成的第二绝缘膜覆盖。

4. 发明授权

US08377752B2 Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08377752B2
公开(公告)日：2013-02-19
申请号：US13019926
申请日：2011-02-02
申请人： Masakatsu Goto , Minoru Enomoto
发明人： Masakatsu Goto , Minoru Enomoto
IPC分类号： H01L21/00
CPC分类号： H01L24/81 , H01L23/3121 , H01L23/49816 , H01L23/5389 , H01L23/552 , H01L24/73 , H01L25/105 , H01L25/16 , H01L2224/16225 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/81191 , H01L2224/83192 , H01L2225/1035 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01051 , H01L2924/01064 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H01L2924/00012 , H01L2924/00
摘要： In regard to a semiconductor device having a multilayered wiring board where a semiconductor chip is embedded inside, a technology which allows the multilayered wiring board to be made thinner is provided. A feature of the present invention is that, in a semiconductor device where bump electrodes are formed over a main surface (element forming surface) of a semiconductor chip embedded in a chip-embedded wiring board, an insulating film is formed over a back surface (a surface on the side opposite to the main surface) of the semiconductor chip. As a result, it becomes unnecessary to form a prepreg over the back surface of the semiconductor chip. Therefore, an effect of thinning the chip-embedded wiring board in which the semiconductor chip is embedded is obtained.
摘要翻译：关于具有嵌入半导体芯片的多层布线基板的半导体器件，提供了使多层布线基板制成薄型化的技术。本发明的特征在于，在埋设在芯片嵌入式布线基板上的半导体芯片的主表面（元件形成面）上形成凸起电极的半导体器件中，绝缘膜形成在背面（半导体芯片的与主表面相对的一侧的表面）。结果，不需要在半导体芯片的背面上形成预浸料。因此，获得了嵌入半导体芯片的芯片嵌入式布线基板的薄型化的效果。

5. 发明申请

US20110193203A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20110193203A1
公开(公告)日：2011-08-11
申请号：US13019926
申请日：2011-02-02
申请人： Masakatsu GOTO , Minoru Enomoto
发明人： Masakatsu GOTO , Minoru Enomoto
IPC分类号： H01L23/498 , H01L23/552 , H01L21/50
CPC分类号： H01L24/81 , H01L23/3121 , H01L23/49816 , H01L23/5389 , H01L23/552 , H01L24/73 , H01L25/105 , H01L25/16 , H01L2224/16225 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/81191 , H01L2224/83192 , H01L2225/1035 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01051 , H01L2924/01064 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H01L2924/00012 , H01L2924/00
摘要： In regard to a semiconductor device having a multilayered wiring board where a semiconductor chip is embedded inside, a technology which allows the multilayered wiring board to be made thinner is provided. A feature of the present invention is that, in a semiconductor device where bump electrodes are formed over a main surface (element forming surface) of a semiconductor chip embedded in a chip-embedded wiring board, an insulating film is formed over a back surface (a surface on the side opposite to the main surface) of the semiconductor chip. As a result, it becomes unnecessary to form a prepreg over the back surface of the semiconductor chip. Therefore, an effect of thinning the chip-embedded wiring board in which the semiconductor chip is embedded is obtained.
摘要翻译：关于具有嵌入半导体芯片的多层布线基板的半导体器件，提供了使多层布线基板制成薄型化的技术。本发明的特征在于，在埋设在芯片嵌入式布线基板上的半导体芯片的主表面（元件形成面）上形成凸起电极的半导体器件中，绝缘膜形成在背面（半导体芯片的与主表面相对的一侧的表面）。结果，不需要在半导体芯片的背面上形成预浸料。因此，获得了嵌入半导体芯片的芯片嵌入式布线基板的薄型化的效果。

6. 发明授权

US10255744B2 Disk transferring device and disk dispensing device 有权
公开(公告)号：US10255744B2
公开(公告)日：2019-04-09
申请号：US13316847
申请日：2011-12-12
申请人： Minoru Enomoto
发明人： Minoru Enomoto
IPC分类号： B65D83/04 , B65D59/00 , G07D9/00 , G07F11/34
摘要： A disk transferring device transferring disks delivered one by one from an disk reception opening to an disk ejection opening includes: a disk guide path having left and right guide surfaces that guide a peripheral surface of each of the disks and front and back guide surfaces that guide an front surface and a back surface of the disk, the disk guide path extending from the disk reception opening toward the disk ejection opening; and a plurality of disk pushers protruding into the disk guide path and pushing the disks by making a rotational movement about a plurality of rotational axis lines approximately at a right angle with respect to the front and back guide surfaces.

7. 发明申请

US20120051023A1 ELECTRONIC APPARATUS 审中-公开
标题翻译：电子设备
公开(公告)号：US20120051023A1
公开(公告)日：2012-03-01
申请号：US13218314
申请日：2011-08-25
申请人： Izen Sakuma , Minoru Enomoto
发明人： Izen Sakuma , Minoru Enomoto
IPC分类号： H05K7/00
CPC分类号： G06F1/1616 , G06F2200/1633
摘要： According to one embodiment, an electronic apparatus includes: a display device including a display screen; a first housing which houses the display device and which includes a first surface having an opening through which the display screen is exposed, and a second surface located on a opposite side to the first surface; a second housing connected to the first housing so that the first housing is rotatable between a first position where the display screen is uncovered and a second position where the display screen is covered; first guard portions attached to the second surface to guard corner portions of the first housing along a circumferential edge of the first housing; and second guard portions which are attached to the second housing to guard corner portions of the second housing along a circumferential edge of the second housing and which abut on the first housing in the second position.
摘要翻译：根据一个实施例，电子设备包括：显示装置，包括显示屏; 第一壳体，其容纳所述显示装置，所述第一壳体包括具有所述显示屏露出的开口的第一表面和位于所述第一表面相对侧的第二表面; 连接到所述第一壳体的第二壳体，使得所述第一壳体可在显示屏未被覆盖的第一位置与所述显示屏幕被覆盖的第二位置之间旋转; 第一防护部分附接到第二表面以沿着第一壳体的周缘保护第一壳体的角部; 以及第二保护部分，其附接到所述第二壳体，以沿着所述第二壳体的周向边缘保护所述第二壳体的角部，并且在所述第二位置抵靠所述第一壳体。

8. 发明授权

US07961468B2 Electronic apparatus and daughterboard 有权
标题翻译：电子仪器和子板
公开(公告)号：US07961468B2
公开(公告)日：2011-06-14
申请号：US12724195
申请日：2010-03-15
申请人： Masahiko Takakusaki , Minoru Enomoto
发明人： Masahiko Takakusaki , Minoru Enomoto
IPC分类号： H05K7/20
CPC分类号： H05K1/141 , G06F1/1616 , G06F1/1658 , G06F1/185 , G06F1/203 , H05K1/144 , H05K2201/045 , H05K2201/09954 , H05K2201/10189
摘要： An electronic apparatus includes: a housing; a motherboard that is accommodated in the housing; a first daughterboard that is accommodated in the housing; a second daughterboard that is accommodated in the housing; a host controller that is mounted on the motherboard; a bridge controller that is mounted on the first daughterboard and electrically connected to the host controller; a first chip that is mounted on the first daughterboard and electrically connected to the bridge controller; and a second chip that is mounted on the second daughterboard and electrically connected to the bridge controller.
摘要翻译：电子设备包括：壳体; 住在房屋中的主板; 容纳在壳体中的第一个子板; 容纳在壳体中的第二子板; 安装在主板上的主机控制器; 桥式控制器，其安装在第一子板上并电连接到主机控制器; 安装在第一子板上并电连接到桥接控制器的第一芯片; 以及安装在第二子板上并电连接到桥接控制器的第二芯片。

9. 发明申请

US20100172097A1 ELECTRONIC APPARATUS AND DAUGHTERBOARD 有权
标题翻译：电子设备和DAUGHTERBOARD
公开(公告)号：US20100172097A1
公开(公告)日：2010-07-08
申请号：US12724195
申请日：2010-03-15
申请人： Masahiko Takakusaki , Minoru Enomoto
发明人： Masahiko Takakusaki , Minoru Enomoto
IPC分类号： H05K7/20 , H01R12/16
CPC分类号： H05K1/141 , G06F1/1616 , G06F1/1658 , G06F1/185 , G06F1/203 , H05K1/144 , H05K2201/045 , H05K2201/09954 , H05K2201/10189
摘要： An electronic apparatus includes: a housing; a motherboard that is accommodated in the housing; a first daughterboard that is accommodated in the housing; a second daughterboard that is accommodated in the housing; a host controller that is mounted on the motherboard; a bridge controller that is mounted on the first daughterboard and electrically connected to the host controller; a first chip that is mounted on the first daughterboard and electrically connected to the bridge controller; and a second chip that is mounted on the second daughterboard and electrically connected to the bridge controller.
摘要翻译：电子设备包括：壳体; 住在房屋中的主板; 容纳在壳体中的第一个子板; 容纳在壳体中的第二子板; 安装在主板上的主机控制器; 桥式控制器，其安装在第一子板上并电连接到主机控制器; 安装在第一子板上并电连接到桥接控制器的第一芯片; 以及安装在第二子板上并电连接到桥接控制器的第二芯片。

10. 发明授权

US07628685B2 Coin hopper 有权
标题翻译：投币斗
公开(公告)号：US07628685B2
公开(公告)日：2009-12-08
申请号：US11869994
申请日：2007-10-10
申请人： Minoru Enomoto
发明人： Minoru Enomoto
IPC分类号： G07D1/00
CPC分类号： G07D9/008
摘要： A coin hopper is provided that can dispense coins of different diameters without any trouble. A rotating disk has coin stoppers that are upwardly inclined at a specified angle, and a circular supporting rack at the center of the upper surface thereof. The stoppers expand radially at regular intervals, from the supporting rack side to the circumferential direction. The rotating disk makes the coins contact a holding surface between the coin stoppers and receives the coins one by one, and supports them by the supporting rack and feeds them out. An outer covering unit covers at least the lower outer circumference of the rotating disk. A storing bowl stores coins in bulk following the outer covering unit. A coin receiving unit expands from the vicinity of the supporting rack to the circumferential direction of the rotating disk, wherein the coin stoppers are arranged in a state fixed to the rotating disk. The coin receiving unit is arranged so as to contact and get away from the holding surface of the rotating disk.
摘要翻译：提供了可以分配不同直径的硬币而没有任何麻烦的硬币漏斗。旋转盘具有以特定角度向上倾斜的硬币止动件和位于其上表面中心的圆形支撑齿条。止动件以规则的间隔从支撑架侧朝向圆周方向径向扩张。旋转盘使硬币接触硬币止动器之间的保持表面并逐个接收硬币，并由支撑架支撑并将其送出。外覆盖单元至少覆盖旋转盘的下外周。存储碗在外部覆盖单元之后大量存储硬币。硬币接收单元从支撑架附近朝向旋转盘的圆周方向膨胀，其中硬币止动器以固定到旋转盘的状态设置。硬币接收单元布置成接触并远离旋转盘的保持表面。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式