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1. 发明授权

US09333690B2 Method for manufacturing a fiber-reinforced composite material 有权
标题翻译：纤维增强复合材料的制造方法
公开(公告)号：US09333690B2
公开(公告)日：2016-05-10
申请号：US13392729
申请日：2011-03-25
申请人： Masahiro Bessho , Shiki Matsuo , Wataru Nishimura , Toshihiko Kariya , Naoki Toda
发明人： Masahiro Bessho , Shiki Matsuo , Wataru Nishimura , Toshihiko Kariya , Naoki Toda
IPC分类号： B29C45/56 , B29C45/14 , B29C44/12 , B29K105/08
CPC分类号： B29C45/561 , B29C44/1209 , B29C45/14631 , B29K2105/0809
摘要： A method for manufacturing a fiber-reinforced composite material of the present invention includes: the step (a) of placing a non-woven fabric N made of a reinforcement fiber in a movable mold 12; and the step (b) of moving the movable mold 12 toward a fixed mold 11 to close the mold and then injecting a thermoplastic resin into the mold to obtain a molded article formed of the non-woven fabric N and the thermoplastic resin. The mechanical strength of the obtained fiber-reinforced composite material can be enhanced by applying an injection compression molding process as the injection molding process in the step (b).
摘要翻译：本发明的纤维增强复合材料的制造方法包括：将由强化纤维制成的无纺布N配置在活动模具12中的工序（a）以及将活动模具12朝向固定模具11移动以关闭模具，然后将热塑性树脂注入模具中以获得由无纺布N和热塑性树脂形成的模制品的步骤（b）。通过在步骤（b）中作为注射成型方法应用注射压缩成型方法，可以提高所得到的纤维增强复合材料的机械强度。

2. 发明申请

US20110090657A1 PRINTED WIRING BOARD WITH BUILT-IN SEMICONDUCTOR ELEMENT, AND PROCESS FOR PRODUCING THE SAME 有权
标题翻译：具有内置半导体元件的印刷电路板及其制造方法
公开(公告)号：US20110090657A1
公开(公告)日：2011-04-21
申请号：US12966251
申请日：2010-12-13
申请人： Yutaka YOSHINO , Takahiro Shirai , Shinji Kadono , Mineo Kawamoto , Minoru Enomoto , Masakatsu Goto , Makoto Araki , Naoki Toda
发明人： Yutaka YOSHINO , Takahiro Shirai , Shinji Kadono , Mineo Kawamoto , Minoru Enomoto , Masakatsu Goto , Makoto Araki , Naoki Toda
IPC分类号： H05K1/18
CPC分类号： H01L23/5389 , H01L25/105 , H01L2224/16237 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73204 , H01L2224/73265 , H01L2224/82039 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12044 , H01L2924/3011 , H05K1/023 , H05K1/186 , H05K3/4602 , H05K3/4623 , H05K3/4652 , H05K2201/0187 , H05K2201/10674 , Y10T29/49146 , H01L2924/00014
摘要： A printed wiring board includes a built-in semiconductor element. A protective film is formed on a semiconductor element-mounted surface of a base substrate to which the built-in semiconductor element is connected to protect the semiconductor element-mounted surface excepting a mounting pad. Upper and side surfaces of the built-in semiconductor element are covered with a first insulating film formed by filling a sealing material. The first insulating film is covered with a second insulating film formed of an insulating resin melted from an insulating layer that is provided in side and upper portions of the built-in semiconductor element.
摘要翻译：印刷电路板包括内置的半导体元件。在与内置半导体元件连接的基底基板的半导体元件安装面上形成保护膜，以保护除了安装焊盘之外的半导体元件安装表面。通过填充密封材料形成的第一绝缘膜覆盖内置半导体元件的上表面和侧表面。第一绝缘膜被由设置在内置半导体元件的侧部和上部的绝缘层熔化的绝缘树脂形成的第二绝缘膜覆盖。

3. 发明申请

US20110049762A1 INJECTION MOLDING MACHINE AND INJECTION MOLDING METHOD 有权
标题翻译：注射成型机和注塑成型方法
公开(公告)号：US20110049762A1
公开(公告)日：2011-03-03
申请号：US12991264
申请日：2009-08-05
申请人： Toshihiko Kariya , Satoshi Miyagawa , Naoki Toda , Gen Hamada , Michitaka Hattori
发明人： Toshihiko Kariya , Satoshi Miyagawa , Naoki Toda , Gen Hamada , Michitaka Hattori
IPC分类号： B29C45/78 , B29C45/73 , B29C45/03
CPC分类号： B29C45/73 , B29C45/78 , B29C2045/7368
摘要： An injection molding machine is provided with a mold forming a cavity into which a resin is injected, a liquid supplying device which supplies a liquid continuously to an internal flow channel of the mold during a preparation period prior to injection of the resin and an injection period in which the resin after the preparation period is injected, an electricity supplying device which supplies electricity to an electric heater arranged on the mold at least during a part of the preparation period, thereby heating the mold, and a controller which carries out a predetermined procedure for making different a temperature of a liquid in the internal flow channel between the preparation period and the injection period.
摘要翻译：注射成型机设置有形成注入树脂的空腔的模具，在注射树脂之前的制备期间将液体连续地供给到模具的内部流路的液体供给装置以及注射期间其中注射了制备期间的树脂后，至少在制备期间的一部分期间向配置在模具上的电加热器供电，从而加热模具的电力供给装置以及执行预定程序的控制器用于在制备周期和喷射周期之间使内部流动通道中的液体的温度不同。

4. 发明授权

US5615000A Convey belt and conveying apparatus with it 失效
标题翻译：输送带和输送设备
公开(公告)号：US5615000A
公开(公告)日：1997-03-25
申请号：US28133
申请日：1993-03-09
申请人： Noriyoshi Ueda , Naoki Toda
发明人： Noriyoshi Ueda , Naoki Toda
IPC分类号： B65G15/64 , B65H5/02 , F16G1/00 , F16G1/04 , G03G15/00 , G03G21/00
CPC分类号： B65H5/026 , G03G15/60 , B65H2401/10 , B65H2402/00 , Y10T428/249922
摘要： The present invention provides a conveying apparatus comprising a plurality of rotary members; a frame for supporting the plurality of rotary members; and an endless belt wound around the plurality of rotary members and moved by rotation of the rotary members to convey a sheet, the belt including a core embedded within the belt and formed by weaving threads extending in a circumferential direction of the belt and threads extending in a widthwise direction of the belt; and wherein, in order to cancel a deflection force of the belt generated by the cause of distortion of the frame when the rotary members are rotated to shift the belt, each of the threads extending in the circumferential direction in the core has a constant twist direction to generate a deflection force opposite to the aforementioned deflection force.
摘要翻译：本发明提供一种包括多个旋转构件的输送装置，用于支撑所述多个旋转构件的框架; 以及围绕所述多个旋转构件缠绕的环形带，并且通过所述旋转构件的旋转而移动以输送片材，所述带包括嵌入所述带内的芯，并且通过在所述带的圆周方向上延伸的线编织而形成，带的宽度方向; 并且其中，为了消除由旋转构件转动而使框架发生扭曲的原因而产生的带的偏转力，在芯体中沿圆周方向延伸的每个螺纹具有恒定的扭转方向以产生与上述偏转力相反的偏转力。

5. 发明申请

US20130200552A1 PLASTICIZING SCREW FOR INJECTION MOLDING AND INJECTION MOLDING METHOD USING SAME 有权
标题翻译：用于注塑成型和注射成型方法的塑化螺杆
公开(公告)号：US20130200552A1
公开(公告)日：2013-08-08
申请号：US13699858
申请日：2010-10-29
申请人： Toshihiko Kariya , Naoki Toda , Munehiro Nobuta
发明人： Toshihiko Kariya , Naoki Toda , Munehiro Nobuta
IPC分类号： B29C45/17
CPC分类号： B29C45/1775 , B29C45/47 , B29C45/60 , B29K2105/12
摘要： A plasticizing screw for injection molding according to the present invention is a plasticizing screw for injection molding that is installed in an injection molding machine which performs injection molding by plasticizing granular thermoplastic resin feedstock containing reinforcement fibers, and includes a shaft, a flight, and a mixer. The mixer is provided in plural stages in an axial direction, and the number of fins of the mixer of each stage increases toward a leading end side in the axial direction from a rear end side in the axial direction. Further, the protrusion height of each fin from the peripheral surface of the shaft is lower than the protrusion height of the flight from the peripheral surface of the shaft.
摘要翻译：根据本发明的用于注射成型的增塑螺杆是用于注射成型的增塑螺杆，其安装在注射成型机中，该注射成型机通过增塑含有增强纤维的颗粒状热塑性树脂原料进行注射成型，并且包括轴，飞行和混合器。混合器在轴向方向上设置成多级，每级的混合器的散热片的数量从轴向的后端侧朝轴向的前端侧增加。此外，每个翅片从轴的周面的突出高度低于从轴的外周表面的飞行的突出高度。

6. 发明申请

US20120211921A1 RESIN INJECTION MOLDING METHOD 有权
标题翻译：树脂注塑成型方法
公开(公告)号：US20120211921A1
公开(公告)日：2012-08-23
申请号：US13503935
申请日：2010-04-07
申请人： Naoki Toda , Satoshi Imaeda , Takeshi Yamaguchi , Toshihiko Kariya
发明人： Naoki Toda , Satoshi Imaeda , Takeshi Yamaguchi , Toshihiko Kariya
IPC分类号： B29C45/18
CPC分类号： B29C45/0046 , B29C2945/76133 , B29K2995/0041
摘要： The resin injection molding method of the present invention is a method for molding resins inside a cavity formed within a mold. The method comprises injecting resins into the cavity through a plurality of paths installed so as to be openable and closable and optionally maintaining the resin inside the cavity at a pressure; closing each of the plurality of paths such that the resins injected from each path converge, there being a time difference between when a first path and a second path of the plurality of paths are closed; and solidifying at least the resin which is injected from the path closed earliest with a crystallinity greater than or equal to a predetermined crystallinity degree.
摘要翻译：本发明的树脂注射成型方法是在模具内形成的空腔内模塑树脂的方法。该方法包括通过安装成可打开和关闭的多个路径将树脂注入到空腔中，并且可选地将空腔内的树脂保持在压力下; 闭合多个路径中的每一个，使得从每个路径注入的树脂会聚，在多个路径中的第一路径和第二路径关闭时存在时间差; 并且至少将从最早闭合的路径注入的结晶度达到预定的结晶度的树脂固化。

7. 发明授权

US07894200B2 Printed wiring board with built-in semiconductor element, and process for producing the same 有权
标题翻译：具有内置半导体元件的印刷电路板及其制造方法
公开(公告)号：US07894200B2
公开(公告)日：2011-02-22
申请号：US11913559
申请日：2006-11-28
申请人： Yutaka Yoshino , Takahiro Shirai , Shinji Kadono , Mineo Kawamoto , Minoru Enomoto , Masakatsu Goto , Makoto Araki , Naoki Toda
发明人： Yutaka Yoshino , Takahiro Shirai , Shinji Kadono , Mineo Kawamoto , Minoru Enomoto , Masakatsu Goto , Makoto Araki , Naoki Toda
IPC分类号： H05K1/18
CPC分类号： H01L23/5389 , H01L25/105 , H01L2224/16237 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73204 , H01L2224/73265 , H01L2224/82039 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12044 , H01L2924/3011 , H05K1/023 , H05K1/186 , H05K3/4602 , H05K3/4623 , H05K3/4652 , H05K2201/0187 , H05K2201/10674 , Y10T29/49146 , H01L2924/00014
摘要： The present invention provides a printed wiring board with a built-in semiconductor element in which an insufficient or excessive amount of filled sealing material does not affect excellent adhesion of the printed wiring board to an overlying wiring board. The printed wiring board with a built-in semiconductor element comprises a built-in semiconductor element, in which at least the lower surface, the upper surface, or the side surface of the semiconductor element is covered with an insulating film, and an insulating layer is provided in the side and upper portions of the semiconductor element. There is also provided a process for producing a printed wiring board with a built-in semiconductor element, comprising the steps of mounting a semiconductor element on a base substrate and covering at least the lower surface, the upper surface, or the side surface of the semiconductor element with an insulating film, disposing and stacking a semicured insulating sheet in the side portion of the semiconductor element, and disposing and stacking a semicured insulating sheet in the upper portion of the semiconductor element.
摘要翻译：本发明提供一种具有内置半导体元件的印刷电路板，其中填充的密封材料的量不足或过量不会影响印刷电路板对上覆布线板的优异的粘附性。具有内置半导体元件的印刷线路板包括内置半导体元件，其中至少半导体元件的下表面，上表面或侧表面被绝缘膜覆盖，绝缘层设置在半导体元件的侧部和上部。还提供了一种用于制造具有内置半导体元件的印刷线路板的方法，包括以下步骤：将半导体元件安装在基底基板上，并且至少覆盖基底基板的下表面，上表面或侧表面具有绝缘膜的半导体元件，在半导体元件的侧部设置和层叠半固化绝缘片，并且在半导体元件的上部设置和层叠半固化绝缘片。

8. 发明授权

US07323127B2 Mold temperature adjusting method 有权
标题翻译：模具温度调节方法
公开(公告)号：US07323127B2
公开(公告)日：2008-01-29
申请号：US11045113
申请日：2005-01-31
申请人： Osamu Muranaka , Naoki Toda , Masahiro Bessho
发明人： Osamu Muranaka , Naoki Toda , Masahiro Bessho
IPC分类号： B29C45/73
CPC分类号： B29C35/007 , B29C45/7306 , B29C2045/7393 , Y02P70/26
摘要： A mold temperature adjusting apparatus is provided in which change-over timing of high temperature medium and low temperature medium is adjusted by a heat transmission delay in heating and cooling of a mold being taken into consideration, so that a cycle time of molding steps is shortened, a temperature deflection from a set temperature of the high temperature and low temperature medium is reduced, an energy loss is reduced and an optimal mold temperature for an injection step can be obtained. The mold temperature adjusting apparatus comprises a high temperature fluid tank and a low temperature fluid tank, a high temperature fluid supply system and a high temperature fluid return system between the mold and the high temperature fluid tank, a low temperature fluid supply system and a low temperature fluid return system between the mold and the low temperature fluid tank, a high temperature fluid by-pass system and a low temperature fluid by-pass system, a heat recovery tank connected to the high temperature fluid tank and a pressure adjusting means.
摘要翻译：提供一种模具温度调节装置，其中通过考虑到模具的加热和冷却中的热传递延迟来调节高温介质和低温介质的转换时间，从而缩短成型步骤的循环时间从高温低温介质的设定温度的温度偏差降低，能量损失降低，并且可以获得注射步骤的最佳模具温度。模具温度调节装置包括高温流体箱和低温流体箱，高温流体供应系统和模具与高温流体箱之间的高温流体回流系统，低温流体供应系统和低温流体供应系统模具与低温流体箱之间的高温流体回流系统，高温流体旁通系统和低温流体旁通系统，连接到高温流体箱的热回收罐和压力调节装置。

9. 发明申请

US20070184139A1 Mold temperature adjusting apparatus/method and mold temperature control unit 失效
标题翻译：模具温度调节装置/方法和模具温度控制单元
公开(公告)号：US20070184139A1
公开(公告)日：2007-08-09
申请号：US11708561
申请日：2007-02-21
申请人： Osamu Muranaka , Naoki Toda , Masahiro Bessho , Satoshi Miyagawa , Koji Kubota
发明人： Osamu Muranaka , Naoki Toda , Masahiro Bessho , Satoshi Miyagawa , Koji Kubota
IPC分类号： B29C45/73
CPC分类号： B29C35/007 , B29C45/7306 , B29C2045/7393 , Y02P70/26
摘要： A mold temperature adjusting apparatus is provided in which change-over timing of high temperature medium and low temperature medium is adjusted by a heat transmission delay in heating and cooling of a mold being taken into consideration, so that a cycle time of molding steps is shortened, a temperature deflection from a set temperature of the high temperature and low temperature medium is reduced, an energy loss is reduced and an optimal mold temperature for an injection step can be obtained. The mold temperature adjusting apparatus comprises a high temperature fluid tank and a low temperature fluid tank, a high temperature fluid supply system and a high temperature fluid return system between the mold and the high temperature fluid tank, a low temperature fluid supply system and a low temperature fluid return system between the mold and the low temperature fluid tank, a high temperature fluid by-pass system and a low temperature fluid by-pass system, a heat recovery tank connected to the high temperature fluid tank and a pressure adjusting means.
摘要翻译：提供一种模具温度调节装置，其中通过考虑到模具的加热和冷却中的热传递延迟来调节高温介质和低温介质的转换时间，从而缩短成型步骤的循环时间从高温低温介质的设定温度的温度偏差降低，能量损失降低，并且可以获得注射步骤的最佳模具温度。模具温度调节装置包括高温流体箱和低温流体箱，高温流体供应系统和模具与高温流体箱之间的高温流体回流系统，低温流体供应系统和低温流体供应系统模具与低温流体箱之间的高温流体回流系统，高温流体旁通系统和低温流体旁通系统，连接到高温流体箱的热回收罐和压力调节装置。

10. 发明授权

US09322376B2 Control device for internal combustion engine 有权
标题翻译：内燃机控制装置
公开(公告)号：US09322376B2
公开(公告)日：2016-04-26
申请号：US14129434
申请日：2012-06-29
申请人： Yuji Ikeda , Naoki Toda , Shigeo Nomura
发明人： Yuji Ikeda , Naoki Toda , Shigeo Nomura
IPC分类号： F02M69/46 , F02D41/14 , F02D41/40 , F02B23/10 , F02P5/04 , F02M61/18 , F02M45/04 , F02B31/08 , F02M25/07 , F02P3/04 , F02P23/04
CPC分类号： F02M69/46 , F02B23/101 , F02B31/085 , F02B2023/103 , F02B2023/108 , F02D41/1497 , F02D41/402 , F02D41/403 , F02D2200/101 , F02M26/13 , F02M45/04 , F02M61/1813 , F02P3/04 , F02P5/045 , F02P23/045 , Y02T10/125 , Y02T10/44
摘要： An internal combustion engine has an ignition promotion unit that has a function of promoting ignition of fuel sprays formed by the small quantity injections by supplying the fuel sprays with electric energy. The engine is provided with a control device which has a combustion control unit that carries out processing of causing the fuel injection valve to perform the plurality of times of small quantity injections so that fuel sprays formed by the first-time small quantity injection from among the plurality of times of small quantity injections are connected with one another by the fuel sprays formed by the subsequent small quantity injections from among the plurality of times of small quantity injections.
摘要翻译：内燃机具有点燃促进单元，其具有通过向燃料喷雾供给电能来促进由少量喷射形成的燃料喷射的点火的功能。发动机设有控制装置，该控制装置具有燃烧控制单元，该燃烧控制单元执行使燃料喷射阀进行多次小量喷射的处理，使得从第一次小量喷射形成的燃料喷射从通过由多次小批量喷射之后的后续的小量喷射形成的燃料喷雾，将多次的小量喷射相互连接。

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