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1. 发明授权

US5894251A High frequency filter having saw and dielectric filters with different frequency temperature characteristic signs 失效
标题翻译：高频滤波器具有不同频率温度特征符号的锯和介质滤波器
公开(公告)号：US5894251A
公开(公告)日：1999-04-13
申请号：US872857
申请日：1997-06-11
申请人： Yutaka Taguchi , Kazuo Eda , Shun-ichi Seki , Keiji Onishi , Toru Yamada
发明人： Yutaka Taguchi , Kazuo Eda , Shun-ichi Seki , Keiji Onishi , Toru Yamada
IPC分类号： H01P1/20 , H01P1/30 , H03H9/02 , H03H9/64 , H01P1/202
CPC分类号： H03H9/6483 , H03H9/02834
摘要： 36.degree. -rotated Y-cut X-propagation lithium niobate substrate (LiNbO.sub.3) was used as a piezoelectric substrate to compose a surface acoustic wave filter and is connected with a dielectric filter in series. The dielectric filter having a sign of the frequency temperature characteristic which is opposite to that of the surface acoustic wave filter was used. Accordingly, a high frequency filter, comprising a surface acoustic filter and a dielectric filter connected in series, which can secure sufficient attenuation without an increase in the insertion loss within the band can be provided.
摘要翻译：使用36°旋转Y切X传播铌酸锂基板（LiNbO3）作为压电基板，构成表面声波滤波器，并与介质滤波器串联连接。使用具有与声表面波滤波器相反的频率温度特性的符号的介质滤波器。因此，可以提供包括表面声学滤波器和串联连接的介质滤波器的高频滤波器，其可以确保足够的衰减而不增加频带内的插入损耗。

2. 发明授权

US6166611A Resonator ladder type surface acoustic wave filter 失效
标题翻译：谐振梯型声表面波滤波器
公开(公告)号：US6166611A
公开(公告)日：2000-12-26
申请号：US57916
申请日：1998-04-09
申请人： Shun-ichi Seki , Yutaka Taguchi , Keiji Onishi , Osamu Kawasaki , Kazuo Eda
发明人： Shun-ichi Seki , Yutaka Taguchi , Keiji Onishi , Osamu Kawasaki , Kazuo Eda
IPC分类号： H03H9/145 , H03H9/05 , H03H9/25 , H03H9/64
CPC分类号： H03H9/1085 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/00014 , H01L2924/16195 , H03H9/059 , H03H9/6483 , H01L2924/00 , H01L2224/05599
摘要： A resonator ladder type surface acoustic wave filter, has an input electrical terminal, an output electrical terminal, and a grounding terminal being formed on a piezoelectric substrate, a series arm surface acoustic wave resonator and a parallel arm surface acoustic wave resonator, each constructed from an interdigital transducer for exciting a surface acoustic wave, being formed between said input electrical terminal and said output electrical terminal, and when the center frequency of said resonator ladder type surface acoustic wave filter is denoted by fc, and capacitance determined by the number of electrode finger pairs and electrode finger overlap width in said interdigital transducer of said parallel arm surface acoustic wave resonator is denoted by Cp (fc: center frequency [GHz], Cp: capacitance of the interdigital transducer of the parallel arm surface acoustic wave resonator), capacitance C of multiples of said parallel arm surface acoustic wave resonator, connected to the same node between said input electrical terminal and said output electrical terminal, always satisfies the relationfc.multidot.Cp
摘要翻译：一种谐振梯型声表面波滤波器，具有输入电端子，输出电端子和形成在压电基板上的接地端子，串联臂声表面波谐振器和平行臂表面声波谐振器，每个由在所述输入电端子和所述输出电端子之间形成用于激励表面声波的叉指换能器，并且当所述共振器梯型表面声波滤波器的中心频率由fc表示时，并且由电极数量确定的电容所述平行臂声表面波谐振器的叉指式换能器中的手指对和电极指重叠宽度由Cp（fc：中心频率[GHz]，Cp：并联臂声表面波谐振器的叉指式换能器的电容），电容所述平行臂声表面波谐振器的倍数为C，连接到s 所述输入电端子和所述输出电端子之间的ame节点总是满足关系fcxCp <4

3. 发明授权

US5920142A Electronic part and a method of production thereof 失效
公开(公告)号：US5920142A
公开(公告)日：1999-07-06
申请号：US813279
申请日：1997-03-10
申请人： Keiji Onishi , Hideki Iwaki , Shun-ichi Seki , Yutaka Taguchi , Tsukasa Shiraishi , Yoshihiro Bessho , Osamu Kawasaki , Kazuo Eda
发明人： Keiji Onishi , Hideki Iwaki , Shun-ichi Seki , Yutaka Taguchi , Tsukasa Shiraishi , Yoshihiro Bessho , Osamu Kawasaki , Kazuo Eda
IPC分类号： H03H3/08 , H03H9/10 , H01L41/08
CPC分类号： H03H9/0509 , H03H3/08 , H03H9/0585 , H03H9/059 , H03H9/1042 , H03H9/1071 , H03H9/1085 , H03H9/1092 , H01L2224/1134 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/45144 , H01L2924/00013 , H01L2924/09701 , H01L2924/16152 , Y10T29/42 , Y10T29/4913 , Y10T29/49146
摘要： The present invention relates to an electronic part used for mobile communications apparatuses and the like, and more particularly to an electronic part, such as an acoustic surface-wave device, a piezoelectric ceramic device or the like, which requires an oscillation space near the surface of the functional device chip thereof, and a method of production thereof. With this method, a space retainer for forming a sealed space at the functional portion of the chip can be hermetically sealed and have high moisture resistance, and the process of forming the space retainer can be carried out easily.The electronic part of the present invention comprises a functional device chip, a space retainer for forming a sealed space at the functional portion of the chip, a circuit substrate to which the chip is secured, electrode interconnection portions for establishing electric connection between the chip and the circuit substrate, and a sealing resin for covering and sealing at least the space retainer, wherein the space retainer comprises a support layer made of a synthetic resin film, provided with an opening enclosing the functional portion and joined onto the main surface, and a cover formed and joined onto the support layer so as to cover the functional portion and form a sealed space between the cover and the functional portion.

4. 发明授权

US5998907A Surface acoustic wave devices and their manufacturing method 失效
标题翻译：表面声波器件及其制造方法
公开(公告)号：US5998907A
公开(公告)日：1999-12-07
申请号：US087079
申请日：1998-05-29
申请人： Yutaka Taguchi , Kazuo Eda , Osamu Kawasaki , Yosihiro Tomita , Keiji Onishi , Shun-ichi Seki , Akihiko Namba , Hiroki Sato , Tetsuyosi Ogura
发明人： Yutaka Taguchi , Kazuo Eda , Osamu Kawasaki , Yosihiro Tomita , Keiji Onishi , Shun-ichi Seki , Akihiko Namba , Hiroki Sato , Tetsuyosi Ogura
IPC分类号： H03H9/145 , H03H9/02 , H03H9/25 , H03H9/64
CPC分类号： H03H9/02834 , H03H9/02574 , H03H9/02921
摘要： A surface acoustic wave device has a main substrate; a comb-like electrode formed on one of the main surfaces of said main substrate; and a supplementary substrate joined with the other main surface of said main substrate, wherein said supplementary substrate has a smaller thermal expansion coefficient and a larger thickness than said main substrate.
摘要翻译：表面声波装置具有主基板; 形成在所述主基板的一个主表面上的梳状电极; 以及与所述主基板的另一个主表面接合的辅助基板，其中所述辅助基板具有比所述主基板更小的热膨胀系数和更大的厚度。

5. 发明授权

US5821665A Surface acoustic wave device and method of manufacture 失效
标题翻译：声表面波装置及其制造方法
公开(公告)号：US5821665A
公开(公告)日：1998-10-13
申请号：US646716
申请日：1996-05-08
申请人： Keiji Onishi , Shun-ichi Seki , Yutaka Taguchi , Kazuo Eda
发明人： Keiji Onishi , Shun-ichi Seki , Yutaka Taguchi , Kazuo Eda
IPC分类号： H03H3/08 , H03H9/05 , H03H9/25 , H01L41/08
CPC分类号： H03H9/1071 , H03H9/02937 , H03H9/059 , H03H9/1092 , H01L2224/1134 , H01L2224/13082 , H01L2224/13144 , H01L2224/1329 , H01L2224/133 , H01L2224/45144 , H01L2924/00013 , H01L2924/09701 , Y10T29/42
摘要： A compact, low height, low cost, and high reliability surface acoustic wave device, and its method of manufacture. The surface acoustic wave device consists of a substrate, a comb-electrode disposed on the main surface of the substrate, plural electrode pads disposed around the comb-electrode, protecting means covering the comb-electrode through a closed space produced by combining the comb-electrode and the electrode pads with the substrate by using substantially covalent bonding force acting between conductive bumps formed on the electrode bumps, a conductive adhesive layer disposed at least on the top of the conductive bumps, and a package adhered on the conductive bumps by means of the conductive adhesive, and insulation adhesive filled into the package contacting the conductive adhesive, the conductive bumps and the protective means.
摘要翻译：紧凑，低高，低成本，高可靠性的声表面波器件及其制造方法。表面声波装置由基板，设置在基板的主表面上的梳状电极，设置在梳状电极周围的多个电极焊盘构成，保护装置通过将梳状电极组合而形成的闭合空间覆盖梳状电极，通过使用作用在形成在电极凸点上的导电凸起之间的基本上共价的结合力，至少设置在导电凸块的顶部上的导电粘合剂层，以及通过以下方式附着在导电凸块上的封装，导电粘合剂和填充到包装中的绝缘粘合剂接触导电粘合剂，导电凸块和保护装置。

6. 发明授权

US5729186A Resonator ladder surface acoustic wave filter suppressing spurious signals 失效
标题翻译：谐振器梯形声波滤波器抑制杂散信号
公开(公告)号：US5729186A
公开(公告)日：1998-03-17
申请号：US629978
申请日：1996-04-09
申请人： Shun-ichi Seki , Kazuo Eda , Yutaka Taguchi , Keiji Onishi , Hiroki Sato , Osamu Kawasaki
发明人： Shun-ichi Seki , Kazuo Eda , Yutaka Taguchi , Keiji Onishi , Hiroki Sato , Osamu Kawasaki
IPC分类号： H03H9/145 , H03H9/64
CPC分类号： H03H9/6483 , H03H9/1452
摘要： A resonator ladder surface acoustic wave (SAW) filter, which has a wide and flat pass band without spurious signals therein is provided. An input electrode, a serial arm SAW resonator, an output electrode, a parallel arm SAW resonator and a ground electrode are respectively formed on a 41.degree.-rotated Y-cut X-propagation lithium niobate substrate. The serial arm SAW resonator comprises a pair of interdigital transducers (IDTs) to excite SAW, one of which is connected to the input electrode. The output electrode is connected to the other IDT of the serial arm SAW resonator. The parallel arm SAW resonator comprises a pair of IDTs to excite SAW, one of which is connected to the output electrode. And the ground electrode is connected to the other IDT of the parallel arm SAW resonator. The IDTs are metal films of Al or Al-based alloy, and the thickness of the metal films ranges from 2.5% to 7.5% of the electrode cycle of the IDT of the parallel arm SAW resonator.
摘要翻译：提供了一种谐振器梯形声表面波（SAW）滤波器，其具有宽而平坦的通带，无杂散信号。分别在41°旋转的Y切X传播铌酸锂基板上形成输入电极，串联臂SAW谐振器，输出电极，并联臂SAW谐振器和接地电极。串联臂SAW谐振器包括一对用于激励SAW的叉指式换能器（IDT），其中一个连接到输入电极。输出电极连接到串联臂SAW谐振器的另一IDT。并联臂SAW谐振器包括一对激励SAW的IDT，其中一个连接到输出电极。并且接地电极连接到并联臂SAW谐振器的另一个IDT。 IDT是Al或Al基合金的金属膜，金属膜的厚度在平行臂SAW谐振器的IDT的电极周期的2.5〜7.5的范围内。

7. 发明授权

US5847626A Balanced-type surface acoustic wave lattice filter 失效
标题翻译：平衡型声表面波阵列滤波器
公开(公告)号：US5847626A
公开(公告)日：1998-12-08
申请号：US655049
申请日：1996-05-29
申请人： Yutaka Taguchi , Kazuo Eda , Shun-ichi Seki , Keiji Onishi
发明人： Yutaka Taguchi , Kazuo Eda , Shun-ichi Seki , Keiji Onishi
IPC分类号： H03H9/00 , H03H9/64 , H03H9/52
CPC分类号： H03H9/0028
摘要： A balanced-type surface acoustic wave filter is provided which can attain a balanced-type of high frequency circuit without connecting a balance-unbalanced conversion circuit. A substrate of tantalic acid lithium substrate with 36 degrees rotation, Y cut, and X propagation is used, and aluminium is used for electrode to form resonators. Then, two resonators in a serial arm and two resonators in a parallel arm are connected in the form of symmetry and lattice to form a balanced-type surface acoustic wave filter. In this configuration, antiresonance frequency in the serial arms and resonance frequency in the parallel arms are substantially equal to each other.
摘要翻译：提供一种平衡型表面声波滤波器，其可以在不连接平衡不平衡转换电路的情况下获得平衡型高频电路。使用具有36度旋转，Y切割和X传播的钽酸锂衬底的衬底，并且使用铝用于电极以形成谐振器。然后，串联臂中的两个谐振器和并联臂中的两个谐振器以对称和格子的形式连接以形成平衡型表面声波滤波器。在这种结构中，串联臂中的反谐振频率和并联臂中的共振频率基本相等。

8. 发明授权

US5506552A Surface acoustic wave filter with multiple ground terminals 失效
标题翻译：具有多个接地端子的表面声波滤波器
公开(公告)号：US5506552A
公开(公告)日：1996-04-09
申请号：US334673
申请日：1994-11-04
申请人： Shun-ichi Seki , Kazuo Eda , Yutaka Taguchi , Keiji Onishi
发明人： Shun-ichi Seki , Kazuo Eda , Yutaka Taguchi , Keiji Onishi
IPC分类号： H03H9/64
CPC分类号： H03H9/6483
摘要： In a surface acoustic wave (SAW) filter, on a 36.degree. Y-cut X-propagation lithium tantalate substrate, series branch SAW resonators, which are connected in series between an input terminal and an output terminal, and parallel branch SAW resonators, which are connected between respective pairs of the series branch resonators by wirings and which are grounded, are provided. Two series branch resonators and one parallel branch resonator are connected in a T shape, so as to form a fundamental unit. In the SAW filter, three fundamental units are serially connected. An interdigital transducer (IDT) included in each resonator is made of a metal film containing aluminum as the main component. The thickness of the metal film is in the range of 8% to 10% of the electrode pitch of the IDT of the parallel branch resonator.
摘要翻译：在表面声波（SAW）滤波器中，在36°Y切割的X传播的钽酸锂衬底上串联连接在输入端子和输出端子之间的分支SAW谐振器以及并联支路SAW谐振器，其中通过布线连接在各对串联支路谐振器之间并且被接地。两个串联支路谐振器和一个并联支路谐振器以T形连接起来形成基本单元。在SAW滤波器中，三个基本单元串联。包含在每个谐振器中的叉指式换能器（IDT）由以铝为主要成分的金属膜制成。金属膜的厚度在并联支路谐振器的IDT的电极间距的8％〜10％的范围内。

9. 发明授权

US6154940A Electronic part and a method of production thereof 失效
标题翻译：电子部件及其制造方法
公开(公告)号：US6154940A
公开(公告)日：2000-12-05
申请号：US90489
申请日：1998-06-03
申请人： Keiji Onishi , Hideki Iwaki , Shun-ichi Seki , Yutaka Taguchi , Tsukasa Shiraishi , Yoshihiro Bessho , Osamu Kawasaki , Kazuo Eda
发明人： Keiji Onishi , Hideki Iwaki , Shun-ichi Seki , Yutaka Taguchi , Tsukasa Shiraishi , Yoshihiro Bessho , Osamu Kawasaki , Kazuo Eda
IPC分类号： H03H3/08 , H03H9/10 , H04R17/00
CPC分类号： H03H9/0509 , H03H3/08 , H03H9/0585 , H03H9/059 , H03H9/1042 , H03H9/1071 , H03H9/1085 , H03H9/1092 , H01L2224/1134 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/45144 , H01L2924/00013 , H01L2924/09701 , H01L2924/16152 , Y10T29/42 , Y10T29/4913 , Y10T29/49146
摘要： The present invention relates to an electronic part used for mobile communications apparatuses and the like, and more particularly to an electronic part, such as an acoustic surface-wave device, a piezoelectric ceramic device or the like, which requires an oscillation space near the surface of the functional device chip thereof, and a method of production thereof. With this method, a space retainer for forming a sealed space at the functional portion of the chip can be hermetically sealed and have high moisture resistance, and the process of forming the space retainer can be carried out easily.The electronic part of the present invention comprises a functional device chip, a space retainer for forming a sealed space at the functional portion of the chip, a circuit substrate to which the chip is secured, electrode interconnection portions for establishing electric connection between the chip and the circuit substrate, and a sealing resin for covering and sealing at least the space retainer, wherein the space retainer comprises a support layer made of a synthetic resin film, provided with an opening enclosing the functional portion and joined onto the main surface, and a cover formed and joined onto the support layer so as to cover the functional portion and form a sealed space between the cover and the functional portion.
摘要翻译：本发明涉及用于移动通信设备等的电子部件，更具体地涉及需要在表面附近的振荡空间的诸如声表面波器件，压电陶瓷器件等的电子部件的功能元件芯片及其制造方法。利用这种方法，在芯片的功能部分处形成密封空间的空间保持器可以被气密地密封并且具有高的耐湿性，并且可以容易地进行形成空间保持器的工艺。本发明的电子部件包括功能元件芯片，用于在芯片的功能部分形成密封空间的空间保持器，固定有芯片的电路基板，用于建立芯片与芯片之间的电连接的电极互连部分电路基板和用于至少覆盖和密封空间保持器的密封树脂，其中，所述空间保持器包括由合成树脂膜制成的支撑层，所述支撑层设置有封闭所述功能部分并且接合到所述主表面上的开口，以及盖形成并接合到支撑层上以覆盖功能部分并在盖和功能部分之间形成密封空间。

10. 发明授权

US5991989A Method of manufacture of surface acoustic wave device 失效
标题翻译：表面声波装置的制造方法
公开(公告)号：US5991989A
公开(公告)日：1999-11-30
申请号：US37103
申请日：1998-03-09
申请人： Keiji Onishi , Shun-ichi Seki , Yutaka Taguchi , Kazuo Eda
发明人： Keiji Onishi , Shun-ichi Seki , Yutaka Taguchi , Kazuo Eda
IPC分类号： H03H3/08 , H03H9/05 , H03H9/25 , H01L41/22
CPC分类号： H03H9/1071 , H03H9/02937 , H03H9/059 , H03H9/1092 , H01L2224/1134 , H01L2224/13082 , H01L2224/13144 , H01L2224/1329 , H01L2224/133 , H01L2224/45144 , H01L2924/00013 , H01L2924/09701 , Y10T29/42
摘要： A compact, low height, low cost, and high reliability surface acoustic wave device, and its method of manufacture. The surface acoustic wave device consists of a substrate, a comb-electrode disposed on the main surface of the substrate, plural electrode pads disposed around the comb-electrode, protecting means covering the comb-electrode through a closed space produced by combining the comb-electrode and the electrode pads with the substrate by using substantially covalent bonding force acting between conductive bumps formed on the electrode bumps, a conductive adhesive layer disposed at least on the top of the conductive bumps, and a package adhered on the conductive bumps by means of the conductive adhesive, and insulation adhesive filled into the package contacting the conductive adhesive, the conductive bumps, and the protective means.
摘要翻译：紧凑，低高，低成本，高可靠性的声表面波器件及其制造方法。表面声波装置由基板，设置在基板的主表面上的梳状电极，设置在梳状电极周围的多个电极焊盘构成，保护装置通过将梳状电极组合而形成的闭合空间覆盖梳状电极，通过使用作用在形成在电极凸点上的导电凸起之间的基本上共价的结合力，至少设置在导电凸块的顶部上的导电粘合剂层，以及通过以下方式附着在导电凸块上的封装，导电粘合剂和填充到包装中的绝缘粘合剂接触导电粘合剂，导电凸块和保护装置。

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