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1. 发明授权

US5998907A Surface acoustic wave devices and their manufacturing method 失效
标题翻译：表面声波器件及其制造方法
公开(公告)号：US5998907A
公开(公告)日：1999-12-07
申请号：US087079
申请日：1998-05-29
申请人： Yutaka Taguchi , Kazuo Eda , Osamu Kawasaki , Yosihiro Tomita , Keiji Onishi , Shun-ichi Seki , Akihiko Namba , Hiroki Sato , Tetsuyosi Ogura
发明人： Yutaka Taguchi , Kazuo Eda , Osamu Kawasaki , Yosihiro Tomita , Keiji Onishi , Shun-ichi Seki , Akihiko Namba , Hiroki Sato , Tetsuyosi Ogura
IPC分类号： H03H9/145 , H03H9/02 , H03H9/25 , H03H9/64
CPC分类号： H03H9/02834 , H03H9/02574 , H03H9/02921
摘要： A surface acoustic wave device has a main substrate; a comb-like electrode formed on one of the main surfaces of said main substrate; and a supplementary substrate joined with the other main surface of said main substrate, wherein said supplementary substrate has a smaller thermal expansion coefficient and a larger thickness than said main substrate.
摘要翻译：表面声波装置具有主基板; 形成在所述主基板的一个主表面上的梳状电极; 以及与所述主基板的另一个主表面接合的辅助基板，其中所述辅助基板具有比所述主基板更小的热膨胀系数和更大的厚度。

2. 发明授权

US07061100B2 Semiconductor built-in millimeter-wave band module 有权
标题翻译：半导体内置毫米波段模块
公开(公告)号：US07061100B2
公开(公告)日：2006-06-13
申请号：US10405524
申请日：2003-04-02
申请人： Hideki Iwaki , Yutaka Taguchi , Tetsuyosi Ogura , Yasuhiro Sugaya , Toshiyuki Asahi , Tousaku Nishiyama , Yoshinobu Idogawa
发明人： Hideki Iwaki , Yutaka Taguchi , Tetsuyosi Ogura , Yasuhiro Sugaya , Toshiyuki Asahi , Tousaku Nishiyama , Yoshinobu Idogawa
IPC分类号： H01L23/10 , H01L23/34
CPC分类号： H01L23/66 , H01L21/481 , H01L21/56 , H01L23/552 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/162 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01079 , H01L2924/01322 , H01L2924/12042 , H01L2924/1305 , H01L2924/14 , H01L2924/1423 , H01L2924/1532 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/20752
摘要： A semiconductor built-in millimeter-wave band module includes: an insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a high thermal conductivity substrate made of a dielectric material having thermal conductivity higher than the insulating substrate and laminated on one surface of the insulating substrate; a plurality of wiring patterns formed on the high thermal conductivity substrate and the insulating substrate; a semiconductor device operating at millimeter-wave band, which is arranged inside of the insulating substrate, is packaged on the high thermal conductivity substrate in a face-up manner, and is connected electrically with the wiring patterns; and a distributed constant circuit element and an active element provided on the semiconductor device. In this module, a void is provided inside of the insulating substrate and in the vicinity of a surface of the distributed constant circuit element and the active element. With this configuration, heat from the semiconductor device operating at a millimeter-wave band can be dissipated effectively and the semiconductor and other circuit components can be packaged with high density.
摘要翻译：半导体内置毫米波段模块包括：绝缘基板，由含有无机填料和热固性树脂的混合物制成; 高导热性衬底，其由具有高于绝缘衬底的导热率的电介质材料制成并且层压在绝缘衬底的一个表面上; 形成在高导热性基板和绝缘基板上的多个布线图案; 布置在绝缘基板内部的以毫米波段工作的半导体器件以面朝上的方式封装在高导热性基板上，并与布线图形电连接; 以及设置在半导体器件上的分布常数电路元件和有源元件。在该模块中，在绝缘基板内部和分布常数电路元件和有源元件的表面附近设置有空隙。利用这种结构，可以有效地消耗来自在毫米波段工作的半导体器件的热量，并可以高密度地封装半导体和其它电路部件。

3. 发明授权

US06310393B1 Electric circuit and package for semiconductor 失效
标题翻译：半导体电路和封装
公开(公告)号：US06310393B1
公开(公告)日：2001-10-30
申请号：US09412593
申请日：1999-10-05
申请人： Tetsuyosi Ogura , Yukihiro Fukumoto , Hideki Iwaki , Yutaka Taguchi , Yoshihiro Bessho
发明人： Tetsuyosi Ogura , Yukihiro Fukumoto , Hideki Iwaki , Yutaka Taguchi , Yoshihiro Bessho
IPC分类号： H01L2348
CPC分类号： H01L23/50 , H01L24/48 , H01L24/73 , H01L2224/05599 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/19041 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： The semiconductor package of this invention includes: a semiconductor element having a power supply terminal, a ground terminal, and an output terminal; an inductance; and a capacitance. One of opposing terminals of the capacitance is connected to the power supply terminal of the semiconductor element, and the other terminal is connected to the ground terminal of the semiconductor element. The ground terminal of the semiconductor element is connected to a ground terminal of the semiconductor package, the power supply terminal of the semiconductor element is connected to a power supply terminal of the semiconductor package via the inductance, and the output terminal of the semiconductor element is connected to an output terminal of the semiconductor package.
摘要翻译：本发明的半导体封装包括：具有电源端子，接地端子和输出端子的半导体元件; 电感; 和电容。电容的相对端子之一连接到半导体元件的电源端子，另一个端子连接到半导体元件的接地端子。半导体元件的接地端子与半导体封装的接地端子连接，半导体元件的电源端子通过电感连接到半导体封装的电源端子，半导体元件的输出端子连接到半导体封装的输出端子。

4. 发明授权

US06537855B2 Semiconductor device and method of manufacturing the same 失效
公开(公告)号：US06537855B2
公开(公告)日：2003-03-25
申请号：US09827074
申请日：2001-04-05
申请人： Yutaka Taguchi , Tetsuyosi Ogura , Hideki Iwaki
发明人： Yutaka Taguchi , Tetsuyosi Ogura , Hideki Iwaki
IPC分类号： H01L2144
CPC分类号： H01L24/83 , H01L21/563 , H01L23/49811 , H01L24/28 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/1134 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/8319 , H01L2224/838 , H01L2224/92125 , H01L2924/00013 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/0781 , H01L2924/10329 , H01L2924/12043 , H01L2924/15787 , H01L2224/13099 , H01L2924/01015 , H01L2924/01049 , H01L2924/01031 , H01L2924/00 , H01L2224/05599
摘要： A first bump and a second bump are formed on the surface of a mounting board (substrate) so that the second bump is allowed to be higher than the first bump. A conductive adhesive member is transferred onto those bumps. A semiconductor substrate in which a mesa portion has been processed is mounted on the mounting board so that the first bump does not come into contact with an electrode on a top of the mesa portion directly while electrically connected to the electrode via the conductive adhesive member. In the semiconductor device in which the semiconductor substrate is mounted with an active surface processed to form the mesa portion facing the mounting board, the stresses applied to the mesa portion (a stress caused in mounting and a stress due to a heat cycle in use) are relieved, thus preventing deterioration of an element.

5. 发明授权

US06789956B2 Optical module 失效
标题翻译：光模块
公开(公告)号：US06789956B2
公开(公告)日：2004-09-14
申请号：US10326239
申请日：2002-12-19
申请人： Hideki Iwaki , Yutaka Taguchi , Tetsuyosi Ogura
发明人： Hideki Iwaki , Yutaka Taguchi , Tetsuyosi Ogura
IPC分类号： G02B636
CPC分类号： G02B6/4224 , G02B6/4243 , G02B6/4257 , G02B6/4267 , G02B6/4274 , H01L2224/16225 , H01L2924/15311
摘要： An optical module of the present invention is provided with a substrate that includes an insulating layer, a passive element provided inside or on the surface of the insulating layer, and terminal electrodes formed on the surface of the insulating layer, and with at least one active element, which includes at least an optical element and is connected to the terminal electrodes on the substrate surface. The passive element has a dielectric layer, a resistive layer, or a magnetic layer, at least one of the terminal electrodes is connected to the passive element, and at least one of the at least one active element has a protruding electrode and is flip-chip mounted to the terminal electrodes on a principle face of the substrate via the protruding electrode. Taking a plane parallel to the principle face of the substrate as a projection plane, then an area of orthographic projection of the dielectric layer, the resistive layer, or the magnetic layer is smaller than an area of orthographic projection of the principle face of the substrate, and the dielectric layer, the resistive layer, or the magnetic layer is formed such that the orthographic projection, with respect to the projection plane, of all the protruding electrodes of the at least one active element that is flip-chip mounted to the principle face of the substrate is included in the orthographic projection of the dielectric layer, the resistive layer, or the magnetic layer. Thus, the optical module has good high frequency properties and the optical element can be mounted stably onto the substrate.
摘要翻译：本发明的光学模块设置有基板，该基板包括绝缘层，设置在绝缘层的内部或表面上的无源元件，以及形成在绝缘层的表面上的端子电极，以及至少一个主动元件，其至少包括光学元件并且连接到衬底表面上的端子电极。无源元件具有电介质层，电阻层或磁性层，至少一个端子电极连接到无源元件，并且至少一个有源元件中的至少一个具有突出电极，芯片通过突出电极安装到基板的原理面上的端子电极。将平行于基板的原理面的平面作为投影平面，则介电层，电阻层或磁性层的正投影的面积小于基板的主面的正投影面积并且形成电介质层，电阻层或磁性层，使得相对于投影平面的至少一个有源元件的所有突起电极的正投影按照原理被倒装安装基板的表面包括在电介质层，电阻层或磁性层的正投影中。因此，光学模块具有良好的高频特性，光学元件可以稳定地安装在基板上。

6. 发明授权

US06348739B1 Semiconductor device and method of manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US06348739B1
公开(公告)日：2002-02-19
申请号：US09558470
申请日：2000-04-24
申请人： Yutaka Taguchi , Tetsuyosi Ogura , Hideki Iwaki
发明人： Yutaka Taguchi , Tetsuyosi Ogura , Hideki Iwaki
IPC分类号： H01L2348
CPC分类号： H01L24/83 , H01L21/563 , H01L23/49811 , H01L24/28 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/1134 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/8319 , H01L2224/838 , H01L2224/92125 , H01L2924/00013 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/0781 , H01L2924/10329 , H01L2924/12043 , H01L2924/15787 , H01L2224/13099 , H01L2924/01015 , H01L2924/01049 , H01L2924/01031 , H01L2924/00 , H01L2224/05599
摘要： A first bump and a second bump are formed on the surface of a mounting board (substrate) so that the second bump is allowed to be higher than the first bump. A conductive adhesive member is transferred onto those bumps. A semiconductor substrate in which a mesa portion has been processed is mounted on the mounting board so that the first bump does not come into contact with an electrode on a top of the mesa portion directly while electrically connected to the electrode via the conductive adhesive member. In the semiconductor device in which the semiconductor substrate is mounted with an active surface processed to form the mesa portion facing the mounting board, the stresses applied to the mesa portion (a stress caused in mounting and a stress due to a heat cycle in use) are relieved, thus preventing deterioration of an element.
摘要翻译：在安装板（基板）的表面上形成第一凸起和第二凸起，使得第二凸块被允许高于第一凸起。将导电性粘接剂转印到这些凸块上。其中已经处理了台面部分的半导体衬底被安装在安装板上，使得第一凸块不直接通过导电粘合构件电连接到电极而与台面部分的顶部上的电极接触。在半导体器件中，半导体衬底被安装成具有处理以形成面向安装板的台面部分的活性表面的半导体器件，施加到台面部分的应力（安装时引起的应力和由于使用中的热循环引起的应力）释放，从而防止元件的劣化。

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