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    • 6. 发明申请
    • PLASMA PROCESSING APPARATUS
    • 等离子体加工设备
    • US20080170969A1
    • 2008-07-17
    • US11680118
    • 2007-02-28
    • Ken YoshiokaYutaka OmotoMamoru YakushijiTsunehiko TsuboneKazunori Nakamoto
    • Ken YoshiokaYutaka OmotoMamoru YakushijiTsunehiko TsuboneKazunori Nakamoto
    • G05D23/00
    • H01L21/6831G05D23/1932G05D23/22H01L21/67109H01L21/67276
    • It is possible to provide a plasma etching apparatus that controls the temperature of a sample at a higher speed and with more accuracy to improve the efficiency of processing the sample. A plasma processing apparatus includes a processing chamber to be depressurized and exhausted, a sample placement electrode provided in the processing chamber and having a sample placement surface on which a substrate to be processed is placed, an electromagnetic generation device to generate plasma in the processing chamber, a supply system that supplies processing gas to the processing chamber, a vacuum exhaust system that exhausts inside the processing chamber, a heater layer and a base temperature monitor that are disposed on the sample placement electrode, a wafer temperature estimating unit that estimates a wafer temperature from the base temperature monitor and plasma forming power supply, and a controller that regulates the heater corresponding to output from the temperature estimating unit.
    • 可以提供一种等离子体蚀刻装置,其以更高的速度和更高的精度来控制样品的温度,以提高样品的处理效率。 一种等离子体处理装置,其特征在于,包括要被减压和排出的处理室,设置在处理室中并具有放置有待处理基板的样品放置面的样品放置电极,在处理室中产生等离子体的电磁产生装置 向处理室供给处理气体的供给系统,在处理室内排出的真空排气系统,设置在样本设置电极上的加热器层和基底温度监视器,估计晶片的晶片温度估计单元 来自基础温度监视器和等离子体形成电源的温度,以及根据来自温度估计单元的输出来调节加热器的控制器。