会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Metal polishing slurry and method of polishing a film to be polished
    • 金属抛光浆料及抛光方法
    • US08791019B2
    • 2014-07-29
    • US12159419
    • 2006-12-27
    • Yutaka NomuraHiroshi NakagawaSou AnzaiAyako TobitaTakafumi SakuradaKatsumi Mabuchi
    • Yutaka NomuraHiroshi NakagawaSou AnzaiAyako TobitaTakafumi SakuradaKatsumi Mabuchi
    • H01L21/306C11D11/00H01L21/321C09G1/02
    • C11D11/0047C09G1/02C09K3/1463H01L21/3212
    • The present invention provides a metal polishing liquid capable of CMP at a high Cu polishing rate and solving the problems: (a) generation of scratches attributable to solid particles, (b) generation of deteriorations in flatness such as dishing and erosion, (c) complexity in a washing process for removing abrasive particles remaining on the surface of a substrate after polishing, and (d) higher costs attributable to the cost of a solid abrasive itself and to waste liquid treatment, as well as a method of polishing a film to be polished by using the same. Disclosed are a metal polishing liquid which comprises a metal oxidizer, a metal oxide solubilizer, a metal anticorrosive, and a water-soluble polymer having an anionic functional group with a weight-average molecular weight of 8,000 or more and has pH 1 or more to 3 or less, and a method of polishing a film to be polished, which comprises supplying the above metal polishing liquid onto a polishing cloth of a polishing platen and simultaneously relatively moving the polishing platen and a substrate having a metallic film to be polished while the substrate is pressed against the polishing cloth.
    • 本发明提供一种能够以高Cu抛光速率进行CMP处理的金属抛光液,并且解决了以下问题:(a)产生由固体颗粒引起的划痕,(b)产生诸如凹陷和腐蚀的平坦度的劣化,(c​​) 用于去除抛光后残留在基材表面上的磨料颗粒的洗涤过程中的复杂性,以及(d)由于固体磨料本身的成本和废液处理造成的更高成本,以及抛光膜的方法 通过使用它来抛光。 公开了一种金属抛光液,其包含金属氧化剂,金属氧化物增溶剂,金属防腐蚀剂和具有重均分子量为8000以上的阴离子官能团的水溶性聚合物,其pH为1以上至 3以下,以及抛光被研磨膜的方法,该方法包括将上述金属抛光液供给到研磨台板的研磨布上,同时相对移动研磨台板和具有待研磨金属膜的基板,同时 基板被压在抛光布上。
    • 2. 发明申请
    • Metal Polishing Slurry and Method of Polishing a Film to be Polished
    • 金属抛光浆料和抛光薄膜抛光方法
    • US20100178765A1
    • 2010-07-15
    • US12159419
    • 2006-12-27
    • Yutaka NomuraHiroshi NakagawaSou AnzaiAyako TobitaTakafumi SakuradaKatsumi Mabuchi
    • Yutaka NomuraHiroshi NakagawaSou AnzaiAyako TobitaTakafumi SakuradaKatsumi Mabuchi
    • H01L21/304H01L21/306C09K13/00C09K13/06
    • C11D11/0047C09G1/02C09K3/1463H01L21/3212
    • The present invention provides a metal polishing liquid capable of CMP at a high Cu polishing rate and solving the problems: (a) generation of scratches attributable to solid particles, (b) generation of deteriorations in flatness such as dishing and erosion, (c) complexity in a washing process for removing abrasive particles remaining on the surface of a substrate after polishing, and (d) higher costs attributable to the cost of a solid abrasive itself and to waste liquid treatment, as well as a method of polishing a film to be polished by using the same. Disclosed are a metal polishing liquid which comprises a metal oxidizer, a metal oxide solubilizer, a metal anticorrosive, and a water-soluble polymer having an anionic functional group with a weight-average molecular weight of 8,000 or more and has pH 1 or more to 3 or less, and a method of polishing a film to be polished, which comprises supplying the above metal polishing liquid onto a polishing cloth of a polishing platen and simultaneously relatively moving the polishing platen and a substrate having a metallic film to be polished while the substrate is pressed against the polishing cloth.
    • 本发明提供一种能够以高Cu抛光速率进行CMP处理的金属抛光液,并且解决了以下问题:(a)产生由固体颗粒引起的划痕,(b)产生诸如凹陷和腐蚀的平坦度的劣化,(c​​) 用于去除抛光后残留在基材表面上的磨料颗粒的洗涤过程中的复杂性,以及(d)由于固体磨料本身的成本和废液处理造成的更高成本,以及抛光膜的方法 通过使用它来抛光。 公开了一种金属抛光液,其包含金属氧化剂,金属氧化物增溶剂,金属防腐蚀剂和具有重均分子量为8000以上的阴离子官能团的水溶性聚合物,其pH为1以上至 3以下,以及抛光被研磨膜的方法,该方法包括将上述金属抛光液供给到研磨台板的研磨布上,同时相对移动研磨台板和具有待研磨金属膜的基板,同时 基板被压在抛光布上。
    • 4. 发明申请
    • Probe Microscope
    • 探头显微镜
    • US20100306886A1
    • 2010-12-02
    • US12789796
    • 2010-05-28
    • Motoko HARADAKyoko HonboKatsumi Mabuchi
    • Motoko HARADAKyoko HonboKatsumi Mabuchi
    • G01Q30/00
    • G01Q60/44G01Q60/02
    • An object of the present invention is to provide a probe microscope that permits qualitative and quantitative evaluation on ions existing near the surface of a sample and permits to detect further simply and easily such as impurities, flaws and corrosion origins existing on the sample in high sensitivity. A probe microscope according to the present invention is provided with a test cell that holds a sample and permits to receive liquid, a probe, a counter electrode, a reference electrode, a drive mechanism that causes the probe to follow the surface of the sample as well as to scan the same, a potential control portion that controls a potential between the probe and the reference electrode and a current measuring portion that measures a current flowing between the probe and the counter electrode, and is characterized in that the material of the probe is constituted by a conductive body containing any of gold or gold alloy, carbon or carbon compound, boron, zinc, lead, tin and mercury.
    • 本发明的目的是提供一种探针显微镜,其允许对存在于样品表面附近的离子进行定性和定量评估,并且允许以高灵敏度进一步简单且容易地检测样品中存在的杂质,缺陷和腐蚀起源。 。 根据本发明的探针显微镜设置有容纳样品并允许接收液体,探针,对电极,参比电极,使探针跟随样品表面的驱动机构的测试电池, 以及扫描相同的电位控制部分,其控制探针和参考电极之间的电势;以及电流测量部分,其测量在探针和对电极之间流动的电流,其特征在于探针的材料 由含有金或金合金,碳或碳化合物,硼,锌,铅,锡和汞的导电体构成。