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1. 发明授权

US5558493A Forced air cooling apparatus having blower and air current regulating plate that reduces eddy air current at inlet of blower 失效
标题翻译：具有鼓风机和气流调节板的强制空气冷却装置可减少鼓风机入口的涡流
公开(公告)号：US5558493A
公开(公告)日：1996-09-24
申请号：US477653
申请日：1995-06-07
申请人： Yutaka Hayashi , Mitsuo Miyamoto , Michihito Watarai , Takayuki Atarashi , Tetsuya Tanaka , Toshio Hatada , Yoshihiro Takada , Takahiro Daikoku
发明人： Yutaka Hayashi , Mitsuo Miyamoto , Michihito Watarai , Takayuki Atarashi , Tetsuya Tanaka , Toshio Hatada , Yoshihiro Takada , Takahiro Daikoku
IPC分类号： F25D1/00 , C04B28/18 , F04D29/42 , H05K7/20 , F04D29/66
CPC分类号： F04D29/4213
摘要： A forced air cooling apparatus having a blower for blowing air taken in from an intake surface or inlet of the blower to be blown against an electronic device in an installation wherein the blower is mounted for operation on a casing or a rack, and in which the apparatus has a flow regulating plate vertically intersecting the intake surface that is installed immediately before the intake surface. With this construction, eddy air current flow in the vicinity of the intake surface is prevented and the cooling ability obtained from the blower is optimized to thereby attain the effect that the electronic devices can be efficiently cooled without requiring the same separation distance between an intake surface of the blower and a wall surface of the frame or casing in which the blower is installed, as compared with a conventional installation of the same equipment in the same casing without the flow regulating plate.
摘要翻译：一种强制用空气冷却装置，其特征在于，具有鼓风机，所述鼓风机用于将鼓风机从壳体或机架上进行操作的设备中，从鼓风机的进气表面或进气口吸入的空气吹向电子设备，其中，装置具有垂直于入口表面垂直相交的流动调节板，其紧靠在进气表面之前安装。通过这种结构，可以防止在进气表面附近的涡流流动，从鼓风机获得的冷却能力最优化，从而达到能够有效地冷却电子设备的效果，而不需要在进气表面的鼓风机和安装有鼓风机的框架或壳体的壁面相比，与同一设备的常规安装相比，在没有流量调节板的情况下。

2. 发明授权

US5504651A Cooling apparatus for electronic equipment 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5504651A
公开(公告)日：1996-04-02
申请号：US220256
申请日：1994-03-30
申请人： Takayuki Atarashi , Toshio Hatada , Tetsuya Tanaka , Toshiki Iino , Kenichi Kasai , Takahiro Daikoku , Tamotsu Tsukaguchi
发明人： Takayuki Atarashi , Toshio Hatada , Tetsuya Tanaka , Toshiki Iino , Kenichi Kasai , Takahiro Daikoku , Tamotsu Tsukaguchi
IPC分类号： H01L23/36 , H01L23/467 , H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002
摘要： An electronic equipment has a cooling structure in which air discharged from heat sinks can be recovered without any leakage and compact blow ducts and discharge ducts are disposed in a narrow space. A supply opening and a discharge opening for cooling air are independently formed in a heat sink. A plurality of supply branched ducts and discharge branched ducts are combined in a comb-like shape along the axis of the ducts. Ejection openings for cooling air are formed on each of the supply branched ducts in positions corresponding to each of the heat sinks. Such ejection openings are closely connected to the supply openings for cooling air of the heat sinks. On the other hand, recovery openings for cooling air are formed on each of the refrigerant discharge ducts in a position corresponding to each of the heat sinks. Such recovery openings are closely connected to the discharge openings for gas refrigerant of the heat sinks.
摘要翻译：电子设备具有冷却结构，其中可以在没有泄漏的情况下回收从散热器排出的空气，并且在狭窄的空间中设置紧凑的吹气管道和排放管道。用于冷却空气的供给开口和排出口独立地形成在散热器中。多个供应分支管道和排出分支管道沿着管道的轴线组合成梳状形状。在每个供应分支管道上，在对应于每个散热器的位置中形成用于冷却空气的喷射开口。这样的喷射开口紧密地连接到用于冷却散热器的空气的供应开口。另一方面，冷却空气的回收开口形成在与各散热器对应的位置上的每个制冷剂排出管上。这种回收开口与散热器的气体制冷剂的排出口紧密连接。

3. 发明授权

US5934368A Air-cooled electronic apparatus with condensation prevention 失效
标题翻译：防冷凝风冷电子设备
公开(公告)号：US5934368A
公开(公告)日：1999-08-10
申请号：US530670
申请日：1995-09-19
申请人： Tetsuya Tanaka , Toshio Hatada , Takayuki Atarashi , Junichi Kobayashi , Akihiro Takanashi , Takahiro Daikoku , Yutaka Watanabe , Shizuo Zushi
发明人： Tetsuya Tanaka , Toshio Hatada , Takayuki Atarashi , Junichi Kobayashi , Akihiro Takanashi , Takahiro Daikoku , Yutaka Watanabe , Shizuo Zushi
IPC分类号： F24F11/00 , G05D22/02 , G05D23/19 , H01L23/34 , H01L23/427 , H01L23/467 , H05K5/02 , H05K7/20 , F25D17/06
CPC分类号： H05K7/207 , F24F11/0008 , G05D22/02 , G05D23/1931 , H01L23/34 , H01L23/467 , H05K7/20572 , H01L2924/0002
摘要： A highly reliable electronic apparatus free from condensation in the cabinet of the apparatus. The electronic apparatus has printed circuit boards on which heat emitting semiconductor devices are mounted and a fan. The electronic apparatus further comprises a hygrometer for measuring the relative humidity and dew-point temperature of the cooling air that is introduced into the cabinet through an opening, a surface temperature sensor for sensing the temperature of the surface of the semiconductor devices, an internal temperature sensor for sensing the internal temperature of the semiconductor device, dehumidifier and heater means made up of a heat pump and an outdoor unit, and a controller for controlling the dehumidifier means and the heater means so that the relative humidity is less than 100% and the dew-point temperature is less than the surface temperature of the semiconductor devices.
摘要翻译：一种高度可靠的电子设备，在设备的机柜中无冷凝。该电子设备具有安装有散热半导体器件的印刷电路板和风扇。该电子设备还包括湿度计，用于测量通过开口引入机柜的冷却空气的相对湿度和露点温度，用于感测半导体器件表面温度的表面温度传感器，内部温度用于感测半导体装置的内部温度的传感器，由热泵和室外机组成的除湿器和加热器装置，以及用于控制除湿装置和加热装置的控制器，使得相对湿度小于100％露点温度小于半导体器件的表面温度。

4. 发明授权

US5592363A Electronic apparatus 失效
标题翻译：电子仪器
公开(公告)号：US5592363A
公开(公告)日：1997-01-07
申请号：US128227
申请日：1993-09-29
申请人： Takayuki Atarashi , Toshio Hatada , Takahiro Daikoku , Nobuo Kawasaki , Toshiki Iino , Tamotsu Tsukaguchi , Kenichi Kasai , Fumiyuki Kobayashi , Yoshito Hayashi
发明人： Takayuki Atarashi , Toshio Hatada , Takahiro Daikoku , Nobuo Kawasaki , Toshiki Iino , Tamotsu Tsukaguchi , Kenichi Kasai , Fumiyuki Kobayashi , Yoshito Hayashi
IPC分类号： H01L23/467 , H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002
摘要： An electronic apparatus having a plurality of semiconductor devices which produce heat during operation, with a heat sink having a plurality of tabular or pin-type fins is provided on each semiconductor device. Nozzles are associated with the heat sinks so as to supply a cooling fluid into the heat sinks. The heat sinks are so arranged that all these heat sinks guide and discharge the cooling fluid in the same direction. A breadth of the respective nozzles, as measured in the direction (x-direction) of the flow and discharge of the cooling fluid determined by the heat sink is less than that of the associated heat sink. A width of the nozzle, as measured in the direction (y-direction) perpendicular to the x-direction is smaller than that of the associated heat sink. A space between adjacent nozzles provide a discharge passage of an ample cross-section which reduces resistance encountered by the heated cooling medium to be discharged therethrough.
摘要翻译：在每个半导体器件上设置具有多个半导体器件的电子设备，所述多个半导体器件在操作期间产生热量，散热片具有多个平板状或针状散热片。喷嘴与散热器相关联，以将冷却流体供应到散热器中。散热器布置成使得所有这些散热器沿相同的方向引导和排出冷却流体。在由散热器确定的流体的流动方向（x方向）和冷却流体的排放量上测量的各个喷嘴的宽度小于相关散热器的宽度。在与x方向垂直的方向（y方向）上测量的喷嘴的宽度小于相关联的散热器的宽度。相邻喷嘴之间的空间提供了足够横截面的排放通道，其减小被加热的冷却介质通过其排出所遇到的阻力。

5. 发明授权

US5077601A Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system 失效
标题翻译：用于冷却电子设备的冷却系统和用于冷却系统的散热片
公开(公告)号：US5077601A
公开(公告)日：1991-12-31
申请号：US404350
申请日：1989-09-07
申请人： Toshio Hatada , Takayuki Atarashi , Takahiro Daikoku , Satomi Kobayashi , Shizuo Zushi , Fumiyuki Kobayashi , Susumu Iwai
发明人： Toshio Hatada , Takayuki Atarashi , Takahiro Daikoku , Satomi Kobayashi , Shizuo Zushi , Fumiyuki Kobayashi , Susumu Iwai
IPC分类号： H01L23/467
CPC分类号： H01L23/467 , H01L2924/0002
摘要： A cooling system for cooling an electronic device by allowing a cooling fluid to flow in contact with heat generating components such as LSI chips of the electronic device arranged in series along the major flow of the cooling fluid. The cooling system has heat radiation fins attached to the heat-generating components, and a cooling duct defining a cooling fluid flow passage in which assemblies composed of the heat-generating components and the heat radiation fins are disposed. The flow passage has, at the upstream end of the upstream end assembly, a cross-sectional area greater than that of the assembly when taken in a plane perpendicular to the direction of the major flow of the cooling fluid. The cross-sectional area of the flow passage progressively decreases towards the downstream end, whereby the flow passage is divided into a main passage through which a main flow component of the cooling fluid directly flows into the series of assemblies and an auxiliary passage through which an auxiliary component of the cooling fluid flows substantially vertically towards the heat-generating component to impinge upon the heat generating component.
摘要翻译：一种冷却系统，用于通过使冷却流体沿着沿着冷却流体的主流排列成串联的电子装置的发热部件等发热部件而流动而冷却电子设备。冷却系统具有附接到发热部件的散热翅片，以及限定冷却流体流动通道的冷却管道，其中设置有由发热部件和散热翅片组成的组件。当在垂直于冷却流体的主流方向的平面中时，流动通道在上游端组件的上游端处具有大于组件的截面面积的横截面面积。流动通道的横截面积朝向下游端逐渐减小，由此流动通道被分成主通道，冷却流体的主流分量通过该主通道直接流入一系列组件和辅助通道，通过该辅助通道冷却流体的辅助部件基本垂直地朝着发热部件流动以撞击发热部件。

6. 发明授权

US5705854A Cooling apparatus for electronic device 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5705854A
公开(公告)日：1998-01-06
申请号：US632618
申请日：1996-04-15
申请人： Takayuki Atarashi , Tetsuya Tanaka , Takahiro Daikoku
发明人： Takayuki Atarashi , Tetsuya Tanaka , Takahiro Daikoku
IPC分类号： H01L23/433 , H01L23/467 , H01L23/34
CPC分类号： H01L23/4336 , H01L23/467 , H01L2924/0002
摘要： A cooling apparatus for electronic devices which is capable of reducing the flow resistance in an exhaust air flow passage to lessen noises and to improve the cooling performance of heat sinks when heat-generating semiconductor parts are very tightly mounted in a plane or when the calorific value of the heat-generating semiconductor parts is extremely large. In addition, the cooling apparatus realizes uniform air quantity distribution and uniform temperature distribution to the heat-generating semiconductor parts. Heat sinks 13 are respectively attached onto a plurality of heat-generating semiconductor parts 12a, 12b and 12c on a board 11. Further, nozzles 14 are respectively provided on the opposite side surfaces of heat-generating semiconductor part fitted surfaces of the heat sinks 13. The nozzles 14 have a substantially rectangular cross section parallel to the board, and are designed such that, when the ratio of the distance between the adjacent heat sinks to the pitch of the plurality of mounted heat sinks is not less than 0.00 but below 0.02, the ratio of the width of the nozzles 14 in the direction (X direction) that a refrigerant flows within the heat sinks 13 to the width of the heat sinks 13 is not less than 0.16 and not more than 0.35.
摘要翻译：一种用于电子设备的冷却装置，其能够在发热半导体部件非常紧密地安装在平面中时或者当发热量（以下简称为热值）时能够降低排气流路中的流动阻力以减小噪声并提高散热器的冷却性能的发热半导体部件非常大。此外，冷却装置实现均匀的空气量分布和对发热半导体部件的均匀的温度分布。散热片13分别安装在板11上的多个发热半导体部分12a，12b和12c上。此外，喷嘴14分别设置在散热片13的发热半导体部件装配表面的相对侧表面上喷嘴14具有与板平行的大致矩形的横截面，并且被设计成使得当相邻散热器之间的距离与多个安装的散热器的间距之比不小于0.00但小于0.02时制冷剂在散热器13内流动的方向（X方向）上的喷嘴14的宽度与散热片13的宽度的比率不小于0.16且不大于0.35。

7. 发明授权

US5705850A Semiconductor module 失效
标题翻译：半导体模块
公开(公告)号：US5705850A
公开(公告)日：1998-01-06
申请号：US290155
申请日：1994-08-15
申请人： Noriyuki Ashiwake , Takahiro Daikoku , Kenichi Kasai , Keizou Kawamura , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Toshiki Iino
发明人： Noriyuki Ashiwake , Takahiro Daikoku , Kenichi Kasai , Keizou Kawamura , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Toshiki Iino
IPC分类号： H01L23/36 , H01L23/433 , H01L23/473 , H01L21/10 , H01L23/34 , H02B1/00 , H02B1/01
CPC分类号： H01L23/4338 , H01L2224/16 , H01L2224/73253
摘要： The disclosed invention aims at providing a semiconductor module structure which has a high ability of absorbing thermal deformation, is excellent in radiating ability and enables an easy maintenance operation. To this end, in the semiconductor module of the invention thermal conductor members are provided, each of which has an area of contact with a semiconductor device or an inner surface of a housing and has opposed heat transfer surfaces. A radiator is formed integrally on the housing. With this structure, large thermal deformation resulting from a high heat production density design can be absorbed, and at the same time heat from semiconductor devices can be efficiently radiated.
摘要翻译：所公开的发明的目的在于提供一种具有高吸收热变形能力的半导体模块结构，散热能力优异，能够容易地进行维护操作。为此，在本发明的半导体模块中，提供了热导体构件，其各自具有与半导体器件或壳体的内表面接触的区域并且具有相对的传热表面。散热器一体地形成在壳体上。利用这种结构，可以吸收由高的发热密度设计引起的大的热变形，并且同时可以有效地辐射来自半导体器件的热量。

8. 发明授权

US5270572A Liquid impingement cooling module for semiconductor devices 失效
标题翻译：用于半导体器件的液体冲击冷却模块
公开(公告)号：US5270572A
公开(公告)日：1993-12-14
申请号：US903458
申请日：1992-06-24
申请人： Tadakatsu Nakajima , Shigeo Ohashi , Heikichi Kuwahara , Noriyuki Ashiwake , Motohiro Sato , Toshio Hatsuda , Takahiro Daikoku , Toshio Hatada , Shigeyuki Sasaki , Hiroshi Inouye , Atsuo Nishihara , Kenichi Kasai
发明人： Tadakatsu Nakajima , Shigeo Ohashi , Heikichi Kuwahara , Noriyuki Ashiwake , Motohiro Sato , Toshio Hatsuda , Takahiro Daikoku , Toshio Hatada , Shigeyuki Sasaki , Hiroshi Inouye , Atsuo Nishihara , Kenichi Kasai
IPC分类号： H01L23/44 , H01L23/473 , H05K7/20 , H01L23/02 , H01L25/04
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/12044
摘要： A semiconductor cooling unit for directly jetting a cooling medium against surfaces of semiconductor devices for use in a high-speed computer or the like to effectively remove heat from the semiconductor devices, in which partition members for partitioning a space into regions where semiconductor devices are placed. Each partitioned region has an opening at its ceiling side, and a pipe for supplying or discharging the cooling medium through the opening is disposed so as to project toward a central portion of the back surface of each semiconductor device. This pipe is utilized to also section a cooling medium supply header or a cooling medium return header so that bubbles generated from the semiconductor device surfaces can be smoothly removed, and so that the cooling medium can flow smoothly onto the semiconductor devices.
摘要翻译：一种半导体冷却单元，用于将冷却介质直接喷射到用于高速计算机等的半导体器件的表面上，以有效地从半导体器件移除热量，其中用于将空间分隔成半导体器件放置的区域的分隔构件。每个分隔区域在其顶侧具有开口，并且通过所述开口供给或排出冷却介质的管设置成朝向每个半导体器件的背面的中心部分突出。该管也用于将冷却介质供应集管或冷却介质返回集管分成一部分，从而可以平滑地去除从半导体器件表面产生的气泡，从而冷却介质可以顺利地流动到半导体器件上。

9. 发明授权

US5774334A Low thermal resistant, fluid-cooled semiconductor module 失效
标题翻译：低耐热，流体冷却的半导体模块
公开(公告)号：US5774334A
公开(公告)日：1998-06-30
申请号：US520338
申请日：1995-08-28
申请人： Keizo Kawamura , Noriyuki Ashiwake , Takahiro Daikoku , Akio Idei , Kenichi Kasai , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Shigeyuki Sasaki
发明人： Keizo Kawamura , Noriyuki Ashiwake , Takahiro Daikoku , Akio Idei , Kenichi Kasai , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Shigeyuki Sasaki
IPC分类号： H01L23/433 , H05K7/20
CPC分类号： H01L23/4338 , H01L2224/16 , H01L2224/73253
摘要： Semiconductor devices are fixed on a substrate by solder and a semiconductor module having an enclosed structure is formed by the substrate, flanges and a housing. Two groups of heat conducting members, each having fins respectively in contract with the semiconductor devices and an inner wall of the housing are attached to the semiconductors. A fin thickness of each fin of the two groups of heat conducting members is comparatively thick, a fin height is low and the respective fins of the respective opposed heat conducting members have with very small clearances therebetween. A liquid as a heat conducting medium is enclosed in the semiconductor module. The liquid level of the semiconductor module is controlled such that it contacts a uppermost semiconductor device in the semiconductor module in a vertical arrangement. Further, valve mechanisms for introducing and removing a cooling fluid are provided at a top face and a bottom face of a space formed in the semiconductor module. The mass production capability of the heat conducting members is improved by providing such highly rigid fins, and improved cooling function is provided by firmly introducing the cooling medium to the respective fins while permitting the module to be reduced in size.
摘要翻译：半导体器件通过焊料固定在衬底上，并且具有封闭结构的半导体模块由衬底，凸缘和壳体形成。两组导热构件分别与半导体装置收缩的翅片和壳体的内壁连接到半导体。两组导热构件的每个翅片的翅片厚度相对较厚，翅片高度低，并且相应的相对的导热构件的各个翅片之间的间隙非常小。作为导热介质的液体封装在半导体模块中。半导体模块的液面被控制成使得其以垂直方式接触半导体模块中的最上面的半导体器件。此外，在半导体模块中形成的空间的顶面和底面设置有用于引入和移除冷却流体的阀机构。通过提供这种高度刚性的翅片来提高导热构件的批量生产能力，并且通过将冷却介质牢固地引入各个翅片来提供改进的冷却功能，同时允许模块减小尺寸。

10. 发明授权

US5345107A Cooling apparatus for electronic device 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5345107A
公开(公告)日：1994-09-06
申请号：US839071
申请日：1992-02-20
申请人： Takahiro Daikoku , Nobuo Kawasaki , Noriyuki Ashiwake , Keizou Kawamura , Shizuo Zushi , Mitsuo Miyamoto , Atsushi Morihara
发明人： Takahiro Daikoku , Nobuo Kawasaki , Noriyuki Ashiwake , Keizou Kawamura , Shizuo Zushi , Mitsuo Miyamoto , Atsushi Morihara
IPC分类号： F28F13/00 , H01L23/433 , H01L23/473 , H01L25/065 , F28F7/00 , H01L23/00 , H05K7/20
CPC分类号： H01L24/32 , F28F13/00 , H01L23/4338 , H01L23/473 , H01L25/0655 , F28F2013/005 , H01L2224/16 , H01L2224/32057 , H01L2224/73253 , H01L2224/73257 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/0132 , H01L2924/15312 , H01L2924/16152
摘要： The present invention relates to a cooling apparatus for an electronic device, in which a cooling solid body in close contact through thermal conductive fluid with a heat transfer portion of the electronic device is provided, on its one surface in contact with the electronic device, with a number of grooves communicating with the outside of the heat transfer portion, and a spring member for elastically pressing this cooling solid body on the electronic device is provided for forcing the cooling solid body into close contact with the electronic device by means of the thermal conductive fluid in a third layer.
摘要翻译：本发明涉及一种用于电子设备的冷却装置，其中在其与电子设备接触的一个表面上设置有通过导电流体与电子设备的传热部分紧密接触的冷却固体，与提供与传热部分的外部连通的多个槽，以及用于将该冷却固体本体弹性挤压在电子装置上的弹簧构件，用于迫使冷却固体与电子装置紧密接触，借助于导热流体在第三层。

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