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1. 发明授权

US5705850A Semiconductor module 失效
标题翻译：半导体模块
公开(公告)号：US5705850A
公开(公告)日：1998-01-06
申请号：US290155
申请日：1994-08-15
申请人： Noriyuki Ashiwake , Takahiro Daikoku , Kenichi Kasai , Keizou Kawamura , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Toshiki Iino
发明人： Noriyuki Ashiwake , Takahiro Daikoku , Kenichi Kasai , Keizou Kawamura , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Toshiki Iino
IPC分类号： H01L23/36 , H01L23/433 , H01L23/473 , H01L21/10 , H01L23/34 , H02B1/00 , H02B1/01
CPC分类号： H01L23/4338 , H01L2224/16 , H01L2224/73253
摘要： The disclosed invention aims at providing a semiconductor module structure which has a high ability of absorbing thermal deformation, is excellent in radiating ability and enables an easy maintenance operation. To this end, in the semiconductor module of the invention thermal conductor members are provided, each of which has an area of contact with a semiconductor device or an inner surface of a housing and has opposed heat transfer surfaces. A radiator is formed integrally on the housing. With this structure, large thermal deformation resulting from a high heat production density design can be absorbed, and at the same time heat from semiconductor devices can be efficiently radiated.
摘要翻译：所公开的发明的目的在于提供一种具有高吸收热变形能力的半导体模块结构，散热能力优异，能够容易地进行维护操作。为此，在本发明的半导体模块中，提供了热导体构件，其各自具有与半导体器件或壳体的内表面接触的区域并且具有相对的传热表面。散热器一体地形成在壳体上。利用这种结构，可以吸收由高的发热密度设计引起的大的热变形，并且同时可以有效地辐射来自半导体器件的热量。

2. 发明授权

US5774334A Low thermal resistant, fluid-cooled semiconductor module 失效
标题翻译：低耐热，流体冷却的半导体模块
公开(公告)号：US5774334A
公开(公告)日：1998-06-30
申请号：US520338
申请日：1995-08-28
申请人： Keizo Kawamura , Noriyuki Ashiwake , Takahiro Daikoku , Akio Idei , Kenichi Kasai , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Shigeyuki Sasaki
发明人： Keizo Kawamura , Noriyuki Ashiwake , Takahiro Daikoku , Akio Idei , Kenichi Kasai , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Shigeyuki Sasaki
IPC分类号： H01L23/433 , H05K7/20
CPC分类号： H01L23/4338 , H01L2224/16 , H01L2224/73253
摘要： Semiconductor devices are fixed on a substrate by solder and a semiconductor module having an enclosed structure is formed by the substrate, flanges and a housing. Two groups of heat conducting members, each having fins respectively in contract with the semiconductor devices and an inner wall of the housing are attached to the semiconductors. A fin thickness of each fin of the two groups of heat conducting members is comparatively thick, a fin height is low and the respective fins of the respective opposed heat conducting members have with very small clearances therebetween. A liquid as a heat conducting medium is enclosed in the semiconductor module. The liquid level of the semiconductor module is controlled such that it contacts a uppermost semiconductor device in the semiconductor module in a vertical arrangement. Further, valve mechanisms for introducing and removing a cooling fluid are provided at a top face and a bottom face of a space formed in the semiconductor module. The mass production capability of the heat conducting members is improved by providing such highly rigid fins, and improved cooling function is provided by firmly introducing the cooling medium to the respective fins while permitting the module to be reduced in size.
摘要翻译：半导体器件通过焊料固定在衬底上，并且具有封闭结构的半导体模块由衬底，凸缘和壳体形成。两组导热构件分别与半导体装置收缩的翅片和壳体的内壁连接到半导体。两组导热构件的每个翅片的翅片厚度相对较厚，翅片高度低，并且相应的相对的导热构件的各个翅片之间的间隙非常小。作为导热介质的液体封装在半导体模块中。半导体模块的液面被控制成使得其以垂直方式接触半导体模块中的最上面的半导体器件。此外，在半导体模块中形成的空间的顶面和底面设置有用于引入和移除冷却流体的阀机构。通过提供这种高度刚性的翅片来提高导热构件的批量生产能力，并且通过将冷却介质牢固地引入各个翅片来提供改进的冷却功能，同时允许模块减小尺寸。

3. 发明授权

US5270572A Liquid impingement cooling module for semiconductor devices 失效
标题翻译：用于半导体器件的液体冲击冷却模块
公开(公告)号：US5270572A
公开(公告)日：1993-12-14
申请号：US903458
申请日：1992-06-24
申请人： Tadakatsu Nakajima , Shigeo Ohashi , Heikichi Kuwahara , Noriyuki Ashiwake , Motohiro Sato , Toshio Hatsuda , Takahiro Daikoku , Toshio Hatada , Shigeyuki Sasaki , Hiroshi Inouye , Atsuo Nishihara , Kenichi Kasai
发明人： Tadakatsu Nakajima , Shigeo Ohashi , Heikichi Kuwahara , Noriyuki Ashiwake , Motohiro Sato , Toshio Hatsuda , Takahiro Daikoku , Toshio Hatada , Shigeyuki Sasaki , Hiroshi Inouye , Atsuo Nishihara , Kenichi Kasai
IPC分类号： H01L23/44 , H01L23/473 , H05K7/20 , H01L23/02 , H01L25/04
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/12044
摘要： A semiconductor cooling unit for directly jetting a cooling medium against surfaces of semiconductor devices for use in a high-speed computer or the like to effectively remove heat from the semiconductor devices, in which partition members for partitioning a space into regions where semiconductor devices are placed. Each partitioned region has an opening at its ceiling side, and a pipe for supplying or discharging the cooling medium through the opening is disposed so as to project toward a central portion of the back surface of each semiconductor device. This pipe is utilized to also section a cooling medium supply header or a cooling medium return header so that bubbles generated from the semiconductor device surfaces can be smoothly removed, and so that the cooling medium can flow smoothly onto the semiconductor devices.
摘要翻译：一种半导体冷却单元，用于将冷却介质直接喷射到用于高速计算机等的半导体器件的表面上，以有效地从半导体器件移除热量，其中用于将空间分隔成半导体器件放置的区域的分隔构件。每个分隔区域在其顶侧具有开口，并且通过所述开口供给或排出冷却介质的管设置成朝向每个半导体器件的背面的中心部分突出。该管也用于将冷却介质供应集管或冷却介质返回集管分成一部分，从而可以平滑地去除从半导体器件表面产生的气泡，从而冷却介质可以顺利地流动到半导体器件上。

4. 发明授权

US5751062A Cooling device of multi-chip module 失效
标题翻译：多芯片模块冷却装置
公开(公告)号：US5751062A
公开(公告)日：1998-05-12
申请号：US571711
申请日：1995-12-13
申请人： Takahiro Daikoku , Fumiyuki Kobayashi , Noriyuki Ashiwake , Kenichi Kasai , Keizou Kawamura , Akio Idei
发明人： Takahiro Daikoku , Fumiyuki Kobayashi , Noriyuki Ashiwake , Kenichi Kasai , Keizou Kawamura , Akio Idei
IPC分类号： H01L23/36 , H01L23/433 , H01L23/367
CPC分类号： H01L23/4338 , H01L2224/73253
摘要： A cooling device of a multi-chip module has micropackages that are independent of thermal deformation and easy to assembly and disassembly. The multi-chip module includes a multi-layer substrate on which the micropackages, each encasing an LSI chip, are mounted, and a housing formed integrally with a cooler. Each of the micropackages includes a first heat conduction member, having a cap portion for receiving the LSI chip and a first fin made of the same material as the cap portion to be integral therewith, and a substrate fixed to the cap portion of the first heat conduction member, the LSI chip being mounted on the substrate which is securely fixed to the cap portion of the heat conduction member while being fixedly joined at the back surface thereof to an inner surface of the cap portion of the first heat conduction member. Second heat conduction members, each including a base portion and a second fin, are disposed to engage with the first fins and be pressed against the cooler by a spring, respectively.
摘要翻译：多芯片模块的冷却装置具有独立于热变形和易于组装和拆卸的微封装。多芯片模块包括多层基板，其上安装有每个包装LSI芯片的微封装以及与冷却器一体形成的壳体。每个微封装包括第一导热构件，具有用于容纳LSI芯片的盖部分和与其一体形成的与盖部分相同的材料制成的第一鳍片，以及固定到第一热量帽盖部分的基板所述LSI芯片被安装在所述基板上，所述基板被牢固地固定到所述导热部件的盖部，同时在其背面牢固地接合到所述第一导热部件的盖部的内表面。每个包括基部和第二翅片的第二热传导构件设置成与第一翅片接合并且分别通过弹簧压靠在冷却器上。

5. 发明授权

US5959351A Liquid-cooled electronic device 失效
标题翻译：液冷电子设备
公开(公告)号：US5959351A
公开(公告)日：1999-09-28
申请号：US103227
申请日：1993-08-09
申请人： Shigeyuki Sasaki , Tadakatsu Nakajima , Noriyuki Ashiwake , Yasuo Ohsone , Toshio Hatada , Toshiki Iino , Akio Idei , Kenichi Kasai
发明人： Shigeyuki Sasaki , Tadakatsu Nakajima , Noriyuki Ashiwake , Yasuo Ohsone , Toshio Hatada , Toshiki Iino , Akio Idei , Kenichi Kasai
IPC分类号： H01L23/44 , F15D1/08 , H01L23/427 , H01L23/473 , H01L23/34
CPC分类号： F15D1/08 , H01L23/473 , F28F13/02 , H01L2924/0002
摘要： There is disclosed a liquid-cooled electronic device. Semiconductor devices are mounted on a substrate of a semiconductor module immersed in a cooling liquid. A wire-like member is provided in the vicinity of a cooling medium ejection port of each cooling medium supply member which cools a respective one of the semiconductor devices by a jet of the cooling liquid. With this arrangement, the flow of the cooling liquid downstream of the wire-like member is disturbed to promote the boiling over the entire surface of the semiconductor device, and when the semiconductor device is to be cooled, a transient temperature rise is reduced at the time of starting the energization of the semiconductor device, thereby stabilizing the temperature of the semiconductor device.
摘要翻译：公开了一种液冷电子装置。半导体器件安装在浸没在冷却液中的半导体模块的衬底上。在各冷却介质供给部件的冷却介质喷出口附近设置有线状部件，冷却介质供给部件通过冷却液喷射冷却各个半导体器件。通过这种布置，线状构件下游的冷却液的流动受到干扰，促使半导体装置的整个表面沸腾，并且当半导体装置被冷却时，瞬态温度上升在开始半导体器件通电的时间，从而稳定半导体器件的温度。

6. 发明授权

US5406807A Apparatus for cooling semiconductor device and computer having the same 失效
标题翻译：用于冷却半导体器件的设备和具有该器件的计算机
公开(公告)号：US5406807A
公开(公告)日：1995-04-18
申请号：US77109
申请日：1993-06-16
申请人： Noriyuki Ashiwake , Tadakatsu Nakajima , Shigeyuki Sasaki , Yasuo Ohsone , Toshio Hatada , Toshiki Iino , Kenichi Kasai , Akio Idei
发明人： Noriyuki Ashiwake , Tadakatsu Nakajima , Shigeyuki Sasaki , Yasuo Ohsone , Toshio Hatada , Toshiki Iino , Kenichi Kasai , Akio Idei
IPC分类号： H01L23/427 , F25D17/02
CPC分类号： H01L23/427 , H01L2924/0002 , Y10S165/908
摘要： An apparatus for cooling semiconductor devices includes a module for cooling semiconductor devices; a refrigerant cooling device for receiving via an outlet pipe the refrigerant discharged through an outlet port of the module to cool the refrigerant; a refrigerant circulation pump for receiving, via a suction pipe, the refrigerant cooled by the refrigerant cooling device and sending the refrigerant to the module via an inlet pipe; and a refrigerant-flow stabilizing mechanism for stabilizing a refrigerant circulation flow discharged from the refrigerant circulation pump to be returned to the refrigerant circulation pump via the module and the refrigerant cooling device. Since the refrigerant-flow stabilizing mechanism stabilize the refrigerant flow, the refrigerant flow can be stably circulated so that the semiconductor devices in the module are stably cooled.
摘要翻译：一种用于冷却半导体器件的设备包括用于冷却半导体器件的模块; 制冷剂冷却装置，用于经由出口管接收通过模块的出口排出的制冷剂以冷却制冷剂; 制冷剂循环泵，其经由吸入管接收由所述制冷剂冷却装置冷却的制冷剂，并且经由入口管将所述制冷剂输送到所述组件; 以及制冷剂流量稳定机构，其使从制冷剂循环泵排出的制冷剂循环流量稳定化，经由模块和制冷剂冷却装置返回到制冷剂循环泵。由于制冷剂流动稳定机构使制冷剂流动稳定，所以可以稳定地循环制冷剂流，使得模块中的半导体器件稳定地冷却。

7. 发明授权

US5592363A Electronic apparatus 失效
标题翻译：电子仪器
公开(公告)号：US5592363A
公开(公告)日：1997-01-07
申请号：US128227
申请日：1993-09-29
申请人： Takayuki Atarashi , Toshio Hatada , Takahiro Daikoku , Nobuo Kawasaki , Toshiki Iino , Tamotsu Tsukaguchi , Kenichi Kasai , Fumiyuki Kobayashi , Yoshito Hayashi
发明人： Takayuki Atarashi , Toshio Hatada , Takahiro Daikoku , Nobuo Kawasaki , Toshiki Iino , Tamotsu Tsukaguchi , Kenichi Kasai , Fumiyuki Kobayashi , Yoshito Hayashi
IPC分类号： H01L23/467 , H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002
摘要： An electronic apparatus having a plurality of semiconductor devices which produce heat during operation, with a heat sink having a plurality of tabular or pin-type fins is provided on each semiconductor device. Nozzles are associated with the heat sinks so as to supply a cooling fluid into the heat sinks. The heat sinks are so arranged that all these heat sinks guide and discharge the cooling fluid in the same direction. A breadth of the respective nozzles, as measured in the direction (x-direction) of the flow and discharge of the cooling fluid determined by the heat sink is less than that of the associated heat sink. A width of the nozzle, as measured in the direction (y-direction) perpendicular to the x-direction is smaller than that of the associated heat sink. A space between adjacent nozzles provide a discharge passage of an ample cross-section which reduces resistance encountered by the heated cooling medium to be discharged therethrough.
摘要翻译：在每个半导体器件上设置具有多个半导体器件的电子设备，所述多个半导体器件在操作期间产生热量，散热片具有多个平板状或针状散热片。喷嘴与散热器相关联，以将冷却流体供应到散热器中。散热器布置成使得所有这些散热器沿相同的方向引导和排出冷却流体。在由散热器确定的流体的流动方向（x方向）和冷却流体的排放量上测量的各个喷嘴的宽度小于相关散热器的宽度。在与x方向垂直的方向（y方向）上测量的喷嘴的宽度小于相关联的散热器的宽度。相邻喷嘴之间的空间提供了足够横截面的排放通道，其减小被加热的冷却介质通过其排出所遇到的阻力。

8. 发明授权

US5504651A Cooling apparatus for electronic equipment 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5504651A
公开(公告)日：1996-04-02
申请号：US220256
申请日：1994-03-30
申请人： Takayuki Atarashi , Toshio Hatada , Tetsuya Tanaka , Toshiki Iino , Kenichi Kasai , Takahiro Daikoku , Tamotsu Tsukaguchi
发明人： Takayuki Atarashi , Toshio Hatada , Tetsuya Tanaka , Toshiki Iino , Kenichi Kasai , Takahiro Daikoku , Tamotsu Tsukaguchi
IPC分类号： H01L23/36 , H01L23/467 , H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002
摘要： An electronic equipment has a cooling structure in which air discharged from heat sinks can be recovered without any leakage and compact blow ducts and discharge ducts are disposed in a narrow space. A supply opening and a discharge opening for cooling air are independently formed in a heat sink. A plurality of supply branched ducts and discharge branched ducts are combined in a comb-like shape along the axis of the ducts. Ejection openings for cooling air are formed on each of the supply branched ducts in positions corresponding to each of the heat sinks. Such ejection openings are closely connected to the supply openings for cooling air of the heat sinks. On the other hand, recovery openings for cooling air are formed on each of the refrigerant discharge ducts in a position corresponding to each of the heat sinks. Such recovery openings are closely connected to the discharge openings for gas refrigerant of the heat sinks.
摘要翻译：电子设备具有冷却结构，其中可以在没有泄漏的情况下回收从散热器排出的空气，并且在狭窄的空间中设置紧凑的吹气管道和排放管道。用于冷却空气的供给开口和排出口独立地形成在散热器中。多个供应分支管道和排出分支管道沿着管道的轴线组合成梳状形状。在每个供应分支管道上，在对应于每个散热器的位置中形成用于冷却空气的喷射开口。这样的喷射开口紧密地连接到用于冷却散热器的空气的供应开口。另一方面，冷却空气的回收开口形成在与各散热器对应的位置上的每个制冷剂排出管上。这种回收开口与散热器的气体制冷剂的排出口紧密连接。

9. 发明授权

US06351384B1 Device and method for cooling multi-chip modules 失效
标题翻译：冷却多芯片模块的装置和方法
公开(公告)号：US06351384B1
公开(公告)日：2002-02-26
申请号：US09637468
申请日：2000-08-11
申请人： Takahiro Daikoku , Junri Ichikawa , Atsuo Nishihara , Kenichi Kasai
发明人： Takahiro Daikoku , Junri Ichikawa , Atsuo Nishihara , Kenichi Kasai
IPC分类号： H05K720
CPC分类号： F28F3/02 , F28F3/12 , F28F13/12 , H01L23/3672 , H01L23/473 , H01L2224/16225 , H01L2224/73253 , H01L2924/00014 , H01L2924/09701 , H01L2224/0401
摘要： A multi-chip module cooling device is provided which equally and efficiently reduces the rises in temperature of LSI chips, and which is superior in the productivity of multi-chip modules, such as their capability to be assembled and disassembled. A multi-chip module includes semiconductor devices and a sealing top plate for removing the heat generated by them. The sealing top plate has a number of parallel cooling channels and a number of cross grooves extending partially across the cooling channels. The cooling channels arc covered with a cooling channel cover, which is provided with turbulent promoters on an inner wall thereof. When the cooling channel cover is placed over the sealing top plate, the turbulent promoters engage with the cross grooves. The turbulent promoters are positioned midway between adjacent semiconductor devices.
摘要翻译：提供了同时有效地降低LSI芯片的温度上升的多芯片模块冷却装置，并且其具有优异的多芯片模块的生产率，例如其组装和拆卸能力。多芯片模块包括用于去除由它们产生的热量的半导体器件和密封顶板。密封顶板具有多个平行的冷却通道和部分横跨冷却通道延伸的多个横向槽。冷却通道覆盖有冷却通道盖，其在其内壁上设置有湍流促进剂。当冷却通道盖被放置在密封顶板上方时，湍流促进器与十字槽接合。湍流促进剂位于相邻半导体器件之间的中间位置。

10. 发明授权

US06890799B2 Device for sealing and cooling multi-chip modules 失效
标题翻译：密封和冷却多芯片模块的装置
公开(公告)号：US06890799B2
公开(公告)日：2005-05-10
申请号：US10338485
申请日：2003-01-07
申请人： Takahiro Daikoku , Kenichi Kasai , Toshitada Netsu , Koichi Koyano , Takayuki Uda
发明人： Takahiro Daikoku , Kenichi Kasai , Toshitada Netsu , Koichi Koyano , Takayuki Uda
IPC分类号： H01L23/10 , H01L23/473 , H01L21/48 , H01L23/34 , H05K7/20
CPC分类号： H01L23/10 , H01L23/473 , H01L2224/16 , H01L2224/73253 , H01L2924/01322 , H01L2924/09701 , H01L2924/15311 , H01L2924/15312 , H01L2924/16152 , H01L2924/16195 , H01L2924/1626
摘要： According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a multi-layer circuit substrate. A cooling flow path cover covering the entirety of cooling flow path grooves is formed as a separate metallic member. The back surface of the sealing top plate, on which are formed the cooling flow path grooves, is bonded directly to the back surface of a semiconductor device using solder. A thermal-conductive jacket with low thermal resistance is provided. A multi-chip module sealing frame is soldered to the edge of the sealing top plate. Furthermore, a sealing material such as an O-ring is simply interposed between the edge of the sealing top plate and the cooling water path cover, and tightening means is used to tighten the metallic cooling flow path cover and the multi-chip module sealing frame to each other.
摘要翻译：根据本发明，多芯片模块中的密封顶板由具有与多层电路基板的热膨胀系数一致的高导热性的陶瓷形成。覆盖整个冷却流路槽的冷却流路盖形成为单独的金属部件。密封顶板的形成冷却流路槽的背面使用焊料直接接合在半导体装置的背面。提供具有低热阻的导热护套。多芯片模块密封框架焊接到密封顶板的边缘。此外，诸如O形圈的密封材料简单地介于密封顶板的边缘和冷却水通道盖之间，并且紧固装置用于紧固金属冷却流路盖和多芯片模块密封框架对彼此。

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