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    • 2. 发明授权
    • Group-III nitride semiconductor laser device, and method for fabricating group-III nitride semiconductor laser device
    • III族氮化物半导体激光器件以及III族氮化物半导体激光器件的制造方法
    • US08139619B2
    • 2012-03-20
    • US13209054
    • 2011-08-12
    • Shimpei TakagiYusuke YoshizumiKoji KatayamaMasaki UenoTakatoshi Ikegami
    • Shimpei TakagiYusuke YoshizumiKoji KatayamaMasaki UenoTakatoshi Ikegami
    • H01S5/00
    • H01S5/34333B82Y20/00H01S5/0202H01S5/2201H01S5/3202
    • Provided are a group-III nitride semiconductor laser device with a laser cavity to enable a low threshold current on a semipolar surface of a hexagonal group-III nitride, and a method for fabricating the group-III nitride semiconductor laser device on a stable basis. Notches, e.g., notch 113a and others, are formed at four respective corners of a first surface 13a located on the anode side of a group-III nitride semiconductor laser device 11. The notch 113a or the like is a part of a scribed groove provided for separation of the device 11. The scribed grooves are formed with a laser scriber and the shape of the scribed grooves is adjusted by controlling the laser scriber. For example, a ratio of the depth of the notch 113a or the like to the thickness of the group-III nitride semiconductor laser device 11 is not less than 0.05 and not more than 0.4, a tilt of a side wall surface at an end of the notch 113a is not less than 45° and not more than 85°, and a tilt of a side wall surface at an end of the notch 113b is not less than 10° and not more than 30°.
    • 提供了具有激光腔的III族氮化物半导体激光器件,其能够在六边形III族氮化物的半极性表面上实现低阈值电流,以及稳定地制造III族氮化物半导体激光器件的方法。 在位于III族氮化物半导体激光装置11的阳极侧的第一表面13a的四个相应的角部处形成缺口,例如凹口113a等。凹口113a等是设置在划线槽中的一部分 用于分离设备11.划线槽由激光划线器形成,并且通过控制激光划线机来调节划线槽的形状。 例如,凹口113a的深度等于III族氮化物半导体激光器件11的厚度的比率不小于0.05且不大于0.4,则侧壁表面的端部的倾斜度 凹口113a不小于45°并且不大于85°,并且凹口113b的端部处的侧壁表面的倾斜度不小于10°并且不大于30°。
    • 3. 发明授权
    • Method of fabricating group-III nitride semiconductor laser device
    • III族氮化物半导体激光器件的制造方法
    • US08105857B2
    • 2012-01-31
    • US12837306
    • 2010-07-15
    • Shimpei TakagiYusuke YoshizumiKoji KatayamaMasaki UenoTakatoshi Ikegami
    • Shimpei TakagiYusuke YoshizumiKoji KatayamaMasaki UenoTakatoshi Ikegami
    • H01L21/18
    • H01S5/0202H01S5/2201H01S5/3202H01S5/32341
    • A method for fabricating a III-nitride semiconductor laser device includes: forming a substrate product having a laser structure; scribing a first surface of the substrate product to form a scribed mark, which extends along a reference line indicative of a direction of the a-axis of the hexagonal III-nitride semiconductor, on the first surface, a scribed mark; mounting the substrate product on a breaking device to support first and second regions of the substrate product by first and second support portions, respectively, of the breaking device; and carrying out breakup of the substrate product by press in alignment with the scribed mark in a third region, without supporting the third region of the substrate product located between the first and second regions, to form another substrate product and a laser bar. First and second end faces of the laser bar form a laser cavity of the III-nitride semiconductor laser device.
    • 一种制造III族氮化物半导体激光器件的方法包括:形成具有激光结构的衬底产品; 划定衬底产品的第一表面以形成刻痕,其沿着表示六边形III族氮化物半导体的a轴的方向的参考线延伸在第一表面上,划线标记; 将所述基板产品安装在断开装置上以分别通过所述断路装置的第一和第二支撑部分支撑所述基板产品的第一和第二区域; 并且在不支撑位于第一和第二区域之间的基板产品的第三区域的情况下,在第三区域中通过压制与基板标记对准地分解基板产品,以形成另一基板产品和激光条。 激光棒的第一和第二端面形成III族氮化物半导体激光器件的激光腔。
    • 10. 发明授权
    • Group-III nitride semiconductor laser device, and method of fabricating group-III nitride semiconductor laser device
    • III族氮化物半导体激光器件及III族氮化物半导体激光器件的制造方法
    • US08401048B2
    • 2013-03-19
    • US12837269
    • 2010-07-15
    • Shimpei TakagiYusuke YoshizumiKoji KatayamaMasaki UenoTakatoshi Ikegami
    • Shimpei TakagiYusuke YoshizumiKoji KatayamaMasaki UenoTakatoshi Ikegami
    • H01S5/00
    • H01S5/34333B82Y20/00H01S5/0014H01S5/0202H01S5/028H01S5/0425H01S5/1082H01S5/1085H01S5/16H01S5/3202H01S2301/14
    • In a III-nitride semiconductor laser device, a laser structure includes a support base comprised of a hexagonal III-nitride semiconductor and having a semipolar primary surface, and a semiconductor region provided on the semipolar primary surface of the support base. An electrode is provided on the semiconductor region of the laser structure. The c-axis of the hexagonal III-nitride semiconductor of the support base is inclined at an angle ALPHA with respect to a normal axis toward the m-axis of the hexagonal III-nitride semiconductor. The angle ALPHA is in the range of not less than 45 degrees and not more than 80 degrees or in the range of not less than 100 degrees and not more than 135 degrees. The laser structure includes first and second fractured faces that intersect with an m-n plane defined by the m-axis of the hexagonal III-nitride semiconductor and the normal axis. A laser cavity of the III-nitride semiconductor laser device includes the first and second fractured faces. The laser structure includes first and second surfaces, and the first surface is opposite to the second surface. Each of the first and second fractured faces extends from an edge of the first surface to an edge of the second surface. The support base of the laser structure has a recess provided at a portion of the edge of the first surface in the first fractured face. The recess extends from a back surface of the support base, and an end of the recess is apart from the edge of the second surface of the laser structure.
    • 在III族氮化物半导体激光器件中,激光器结构包括由六方晶III族氮化物半导体构成并具有半极性主表面的支撑基底和设置在支撑基底的半极性主表面上的半导体区域。 在激光结构的半导体区域上设置电极。 支撑基体的六边形III族氮化物半导体的c轴相对于正六边形III族氮化物半导体的m轴的法线轴线倾斜一角度ALPHA。 角度ALPHA在不小于45度且不大于80度的范围内或在不小于100度且不超过135度的范围内。 激光结构包括与由六边形III族氮化物半导体的m轴和法线轴限定的m-n平面相交的第一和第二断裂面。 III族氮化物半导体激光器件的激光腔包括第一和第二断裂面。 激光结构包括第一表面和第二表面,并且第一表面与第二表面相对。 第一和第二断裂面中的每一个从第一表面的边缘延伸到第二表面的边缘。 激光结构的支撑基座具有设置在第一断裂面中的第一表面的边缘的一部分处的凹部。 凹部从支撑基座的后表面延伸,并且凹部的端部与激光结构的第二表面的边缘分开。