专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20140100990A1 REVIEW TEXT OUTPUT SYSTEM, REVIEW TEXT OUTPUT METHOD, PROGRAM AND COMPUTER-READABLE INFORMATION STORAGE MEDIUM 审中-公开
标题翻译：查看文本输出系统，查看文本输出方法，程序和计算机可读信息存储介质
公开(公告)号：US20140100990A1
公开(公告)日：2014-04-10
申请号：US14122675
申请日：2012-08-29
申请人： Yusuke Taguchi
发明人： Yusuke Taguchi
IPC分类号： G06Q30/06 , G06Q30/02
CPC分类号： G06Q30/0623 , G06Q10/00 , G06Q30/00 , G06Q30/0282 , G06Q30/06 , G06Q50/01
摘要： To enable a user to easily read and compare review texts about a plurality of commercial transaction objects that are posted by the same reviewer, provided is a review text output method, including: a condition receiving step of receiving a plurality of commercial transaction object search conditions; a review text identifying step of identifying, out of review texts about one or more commercial transaction objects that respectively satisfy the plurality of commercial transaction object search conditions, review texts that have been created by a common reviewer; and a review text outputting step of outputting, in association with one another, the review texts that have been identified in the review text identifying step as review texts that respectively satisfy the plurality of commercial transaction object search conditions.
摘要翻译：为了使用户能够容易地阅读和比较由相同审阅者发布的关于多个商业交易对象的审阅文本，提供了一种评论文本输出方法，包括：条件接收步骤，接收多个商业交易对象搜索条件 ; 评估文本识别步骤，用于识别关于分别满足多个商业交易对象搜索条件的一个或多个商业交易对象的审阅文本，审查由共同审阅者创建的审阅文本; 以及审查文本输出步骤，将彼此相关联地将在评论文本识别步骤中识别的评论文本输出为分别满足多个商业交易对象搜索条件的评论文本。

2. 发明授权

US08237189B2 Heat-curable silicone resin-epoxy resin composition, and premolded package molded from same 有权
标题翻译：可热固化的有机硅树脂 - 环氧树脂组合物，以及由其模制的预成型包装
公开(公告)号：US08237189B2
公开(公告)日：2012-08-07
申请号：US12496460
申请日：2009-07-01
申请人： Yusuke Taguchi , Toshio Shiobara
发明人： Yusuke Taguchi , Toshio Shiobara
IPC分类号： H01L33/00
CPC分类号： H01L23/49861 , C08G77/16 , C08G77/18 , C08L63/00 , C08L63/06 , C08L83/04 , C08L83/06 , H01L23/295 , H01L23/296 , H01L33/56 , H01L2924/0002 , C08L83/00 , C08L2666/14 , C08L2666/22 , H01L2924/00
摘要： A heat-curable silicone resin-epoxy resin composition that is ideal as a premolded package for a high-brightness LED or solar cell. The composition contains (A) a heat-curable silicone resin, (B) a combination of a triazine derivative epoxy resin and an acid anhydride, or a prepolymer obtained by reaction of them, (C) an inorganic filler, and (D) a curing accelerator. The composition exhibits excellent curability, and yields a uniform cured product that displays excellent retention of heat resistance and light resistance over long periods of time, and suffers minimal yellowing.
摘要翻译：作为用于高亮度LED或太阳能电池的预先包装的理想的可热固化的有机硅树脂 - 环氧树脂组合物。该组合物含有（A）可热固化的有机硅树脂，（B）三嗪衍生物环氧树脂和酸酐的组合，或通过它们反应获得的预聚物，（C）无机填料和（D）固化促进剂。该组合物表现出优异的固化性，并且产生均匀的固化产物，其在长时间内显示出优异的耐热性和耐光性保持性，并且几乎不发黄。

3. 发明授权

US08013057B2 White thermosetting silicone resin composition for molding an optical semiconductor case and optical semiconductor case 有权
标题翻译：用于模制光学半导体外壳和光学半导体外壳的白色热固性硅树脂组合物
公开(公告)号：US08013057B2
公开(公告)日：2011-09-06
申请号：US12405589
申请日：2009-03-17
申请人： Yusuke Taguchi , Kazutoshi Tomiyoshi
发明人： Yusuke Taguchi , Kazutoshi Tomiyoshi
IPC分类号： C08L83/04 , B29D11/00
CPC分类号： C08L83/06 , C08G77/26 , C08G77/28 , H01L2224/48091 , H01L2924/00014
摘要： A white thermosetting silicone resin composition for molding an optical semiconductor case and a case for an optical semiconductor such as LED are provided. The composition comprises (A) a thermosetting organopolysiloxane, (B) a white pigment, (C) an inorganic filler (excluding the white pigment), (D) a condensation catalyst, and (E) a coupling agent represented by the following formula: R3dSi(OR2)e wherein R3 represents an organic group containing a mercapto group, a glycidyl group, or an amino group, R2 represents a C1-4 organic group, d represents 1 or 2, and e represents 2 or 3; wherein content of the white pigment (B) is 1 to 50% by weight in the entire composition, and total content of the white pigment (B) and the inorganic filler (C) is 70 to 93% by weight in the entire composition. When cured, it has excellent whiteness, consistency, and resistance to heat, light, yellowing, and warping.
摘要翻译：提供了一种用于模制光学半导体壳体的白色热固性硅树脂组合物和诸如LED的光学半导体的壳体。组合物包含（A）热固性有机聚硅氧烷，（B）白色颜料，（C）无机填料（不包括白色颜料），（D）缩合催化剂和（E）由下式表示的偶联剂： R3dSi（OR2）e其中R3表示含有巯基，缩水甘油基或氨基的有机基团，R2表示C1-4有机基团，d表示1或2，e表示2或3; 其中白色颜料（B）的含量在整个组合物中为1〜50重量％，白色颜料（B）和无机填料（C）的总含量在整个组合物中为70〜93重量％。固化时，具有优异的白度，一致性和耐热，耐光，发黄，翘曲等特点。

4. 发明申请

US20100148380A1 THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE 有权
标题翻译：热固性环氧树脂组合物和半导体器件
公开(公告)号：US20100148380A1
公开(公告)日：2010-06-17
申请号：US12637359
申请日：2009-12-14
申请人： Masaki Hayashi , Yusuke Taguchi , Kazutoshi Tomiyoshi , Tomoyoshi Tada
发明人： Masaki Hayashi , Yusuke Taguchi , Kazutoshi Tomiyoshi , Tomoyoshi Tada
IPC分类号： H01L23/29 , C08L63/00
CPC分类号： C08G59/3245 , C08G59/186 , C08G59/42 , C08L63/00 , C08L63/06 , H01L23/24 , H01L23/293 , H01L23/3135 , H01L24/73 , H01L24/97 , H01L33/56 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/97 , H01L2924/01322 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A thermosetting epoxy resin composition comprising (A) a reaction mixture of a triazine derivative epoxy resin and an acid anhydride at a ratio of the epoxy group equivalent to the acid anhydride equivalent of 0.6 to 2.0; (B) an internal mold release agent; (C) a reflective material; (D) an inorganic filler; and (E) a curing catalyst. The internal mold release agent of component (B) comprises a carboxylate ester represented by: R11—COO—R12 (1) wherein R11 and R12 are CnH2n+1 and n is 1 to 30 and a compound represented by: wherein R1, R2, and R3 are selected from H, —OH, —OR, and —OCOCaHb with the proviso that at least one includes —OCOCaHb; R is CnH2n+1 (wherein n is an integer of 1 to 30), a is 10 to 30, and b is 17 to 61.
摘要翻译：一种热固性环氧树脂组合物，其包含（A）三嗪衍生物环氧树脂和酸酐的反应混合物，其中环氧基当量相对于酸酐当量为0.6-2.0; （B）内部脱模剂; （C）反射材料; （D）无机填料; 和（E）固化催化剂。组分（B）的内部脱模剂包含由以下化合物表示的羧酸酯：R11-COO-R12（1）其中R11和R12为CnH2n + 1且n为1至30，以及由下式表示的化合物：其中R1，R2，并且R 3选自H，-OH，-OR和-OCOCaHb，条件是至少一个包括-OCOCaHb; R为C n H 2n + 1（n为1〜30的整数），a为10〜30，b为17〜61。

5. 发明授权

US08455899B2 Resin composition, reflector for light-emitting semiconductor device, and light-emitting semiconductor unit 有权
标题翻译：树脂组合物，发光半导体器件的反射器和发光半导体单元
公开(公告)号：US08455899B2
公开(公告)日：2013-06-04
申请号：US13074317
申请日：2011-03-29
申请人： Yusuke Taguchi , Toshio Shiobara
发明人： Yusuke Taguchi , Toshio Shiobara
IPC分类号： H01L33/00 , H01L23/29 , F21V7/00 , C08K5/00
CPC分类号： H01L33/60 , H01L24/97 , H01L33/486 , H01L33/62 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/01012 , H01L2924/01029 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/15747 , H01L2924/181 , H01L2933/0058 , H01L2924/00014 , H01L2924/00
摘要： Disclosed herein is a resin composition including 100 parts by weight of an organic resin and 50 to 1,000 parts by weight of an inorganic filler, wherein 10 to 100% of the inorganic filler is composed of an oxide of a rare earth element.
摘要翻译：本发明公开了一种树脂组合物，其包含100重量份的有机树脂和50-1000重量份的无机填料，其中10-100重量％的无机填料由稀土元素的氧化物组成。

6. 发明授权

US08173053B2 White heat-curable silicone resin composition and optoelectronic part case 有权
标题翻译：白色可热固化硅树脂组合物和光电子部件
公开(公告)号：US08173053B2
公开(公告)日：2012-05-08
申请号：US12480129
申请日：2009-06-08
申请人： Yusuke Taguchi , Junichi Sawada
发明人： Yusuke Taguchi , Junichi Sawada
IPC分类号： B29D11/00 , C08L83/04 , C08L83/06
CPC分类号： C08L83/04 , C08G77/16 , C08G77/18 , H01L33/486 , H01L33/60 , H01L2224/48091 , Y10T428/1352 , H01L2924/00014
摘要： A white heat-curable silicone resin composition comprising (A) a heat-curable organopolysiloxane, (B) a white pigment, (C) an inorganic filler, and (D) a condensation catalyst cures into a white uniform product having heat resistance, light resistance and minimal yellowing. The cured composition has a thermal conductivity of 1-10 W/mK. The composition is useful for forming cases on optoelectronic parts, typically LED.
摘要翻译：一种白色可热固化的有机硅树脂组合物，其包含（A）可热固化的有机聚硅氧烷，（B）白色颜料，（C）无机填料和（D）缩合催化剂固化成具有耐热性的白色均匀产品，电阻和最小变黄。固化的组合物的导热率为1-10W / mK。组合物可用于在光电子部件（通常为LED）上形成壳体。

7. 发明授权

US08012381B2 White heat-curable silicone resin composition and optoelectronic part case 有权
标题翻译：白色可热固化硅树脂组合物和光电子部件
公开(公告)号：US08012381B2
公开(公告)日：2011-09-06
申请号：US12480118
申请日：2009-06-08
申请人： Yusuke Taguchi , Junichi Sawada
发明人： Yusuke Taguchi , Junichi Sawada
IPC分类号： B29D11/00 , C08L83/04 , C08L83/06
CPC分类号： C08L83/04 , C08G77/16 , C08G77/18 , C08K3/013 , C08K3/22 , H01L31/02161 , H01L33/56 , H01L2224/48091 , Y10T428/1352 , C08L2666/44 , C08L2666/54 , H01L2924/00014
摘要： A white heat-curable silicone resin composition comprising (A) a heat-curable organopolysiloxane, (B) a white pigment, (C) an inorganic filler, and (D) a condensation catalyst cures into a white uniform product having heat resistance, light resistance and minimal yellowing. The cured composition has a reflectance of at least 80% at wavelength 350-400 nm. The composition is useful for forming cases on optoelectronic parts, typically LED.
摘要翻译：一种白色可热固化的有机硅树脂组合物，其包含（A）可热固化的有机聚硅氧烷，（B）白色颜料，（C）无机填料和（D）缩合催化剂固化成具有耐热性的白色均匀产品，电阻和最小变黄。固化的组合物在350-400nm的波长下具有至少80％的反射率。组合物可用于在光电子部件（通常为LED）上形成壳体。

8. 发明授权

US08519063B2 Underfill composition and an optical semiconductor device 有权
标题翻译：底部填充组合物和光学半导体器件
公开(公告)号：US08519063B2
公开(公告)日：2013-08-27
申请号：US12875606
申请日：2010-09-03
申请人： Yusuke Taguchi , Junichi Sawada
发明人： Yusuke Taguchi , Junichi Sawada
IPC分类号： C08F283/12 , C08G77/16 , C08G77/44
CPC分类号： H01L23/296 , C08G77/16 , C08G77/70 , C08K3/36 , C08K5/544 , C08K5/548 , C08K9/06 , C08L83/04 , H01L21/563 , H01L33/56 , H01L2924/0002 , C08L83/00 , H01L2924/00
摘要： A purpose of the present invention is to provide an underfill composition for optical semiconductor devices which can provide a cured product whose moldability, adhesiveness to a gold bump, heat-resistance, and light resistance are better. The present invention is an underfill composition, comprising (A) 60 to 99 parts by weight of a branched organopolysiloxane having a weight average molecular weight of from 500 to 20000, reduced to polystyrene, and represented by the average compositional formula (1); (B) 250 to 1000 parts by weight of an inorganic filler; (C) 0.01 to 10 parts by weight of a condensation catalyst; (D) 1 to 40 parts by weight of an organopolysiloxane having a linear diorganopolysiloxane moiety, represented by the formula (2), provided that a total amount of component (A) and component (D) is 100 parts by weight; and (E) 0.2 to 2.0 parts by weight of silane coupling agent.
摘要翻译：本发明的目的是提供一种光学半导体器件的底部填充组合物，其可以提供其成型性，对金凸块的粘附性，耐热性和耐光性更好的固化产物。本发明是一种底部填充剂组合物，其包含（A）60〜99重量份的重均分子量为500〜20000的分支有机聚硅氧烷，还原为聚苯乙烯，由平均组成式（1）表示。（B）250〜1000重量份的无机填料; （C）0.01〜10重量份的缩合催化剂; （D）1〜40重量份具有由式（2）表示的线性二有机聚硅氧烷部分的有机聚硅氧烷，其中组分（A）和组分（D）的总量为100重量份; 和（E）0.2〜2.0重量份的硅烷偶联剂。

9. 发明授权

US08088856B2 Heat-curable resin composition 有权
标题翻译：热固性树脂组合物
公开(公告)号：US08088856B2
公开(公告)日：2012-01-03
申请号：US12617919
申请日：2009-11-13
申请人： Toshio Shiobara , Tsutomu Kashiwagi , Yusuke Taguchi
发明人： Toshio Shiobara , Tsutomu Kashiwagi , Yusuke Taguchi
IPC分类号： C08L83/00 , C08K3/22 , C08K3/36 , C08K3/18 , C08K3/30
CPC分类号： C08G59/306 , C08G59/3245 , C08G59/42
摘要： A heat-curable resin composition that yields a cured product having excellent heat resistance and light resistance, and a premolded package molded using the composition. The heat-curable resin composition comprises components (A) to (E) listed below: (A) an isocyanuric acid derivative containing at least one epoxy group within each molecule, in an amount of 100 parts by mass, (B) a silicone resin containing at least one epoxy group within each molecule, in an amount of 10 to 1,000 parts by mass, (C) an acid anhydride curing agent, in an amount such that the ratio of [total epoxy group equivalents within component (A) and component (B)/carboxyl group equivalents within component (C)] is within a range from 0.6 to 2.2, (D) a curing accelerator, in an amount within a range from 0.05 to 5 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C), and (E) an inorganic filler, in an amount of 200 to 1,000 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C).
摘要翻译：产生具有优异的耐热性和耐光性的固化产物的热固化树脂组合物和使用该组合物成型的预成型包装。热固性树脂组合物包含下列成分（A）〜（E）：（A）在各分子内含有至少一个环氧基的异氰脲酸衍生物，其量为100质量份，（B）有机硅树脂在各分子内含有至少一个环氧基，其量为10〜1000质量份，（C）酸酐固化剂，其量使得[组分（A）和组分（C）成分中的（B）/羧基当量]在0.6〜2.2的范围内，（D）固化促进剂的含量为0.05〜5质量份，相对于100质量份组分（A），（B）和（C）的质量和（E）无机填料的量为每100质量份组分（A），（B ）和（C）。

10. 发明授权

US08022137B2 Silicone resin composition for optical semiconductor devices 有权
标题翻译：用于光学半导体器件的硅树脂组合物
公开(公告)号：US08022137B2
公开(公告)日：2011-09-20
申请号：US12569433
申请日：2009-09-29
申请人： Yusuke Taguchi , Junichi Sawada , Kenji Hagiwara , Shoichi Osada , Kazutoshi Tomiyoshi
发明人： Yusuke Taguchi , Junichi Sawada , Kenji Hagiwara , Shoichi Osada , Kazutoshi Tomiyoshi
IPC分类号： C08L83/00
CPC分类号： H01L23/296 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , C08K3/22 , C08L83/04 , H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , C08L83/00 , H01L2924/00014
摘要： The present invention provides a silicone resin composition for an optical semiconductor device, comprising (A) 100 parts by mass of an organopolysiloxane having a weight average molecular weight of from 500 to 20000, reduced to polystyrene, and represented by the following average compositional formula (1), (CH3)aSi(OR1)b(OH)cO(4-a-b-c)/2 (1) wherein R1 is an organic group having 1 to 4 carbon atoms and a, b, and c are numbers satisfying the equations: 0.8≦a≦1.5, 0≦b≦0.3, 0.001≦c≦0.5, and 0.801≦a+b+c
摘要翻译：本发明提供一种光半导体装置用有机硅树脂组合物，其包含：（A）100质量份的重均分子量为500〜20000的有机聚硅氧烷，还原为聚苯乙烯，由下列平均组成式（ 1），（CH3）aSi（OR1）b（OH）cO（4-abc）/ 2（1）其中R1是具有1至4个碳原子的有机基团，a，b和c是满足下列等式的数字： 0.8和nlE; a＆nlE; 1.5,0.001和nlE; c＆nlE; 0.5和0.801≤n1E; a + b + c2，（B）3到200质量份白色颜料，（C）400 1000质量份除了所述白色颜料以外的无机填充材料，（D）0.01〜10质量份的缩合催化剂，（E）2〜50质量份的由有机聚硅氧烷构成的有机聚硅氧烷，所述直链二有机聚硅氧烷部分由下式（2），其中R 2和R 3彼此独立地是选自羟基，烷基具有1至3个碳原子的基团，环己基，乙烯基，苯基和烯丙基，其中m为5-50的整数。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式