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    • 5. 发明授权
    • Electron beam simulation corner correction for optical lithography
    • 用于光学光刻的电子束模拟角修正
    • US08464185B2
    • 2013-06-11
    • US12625466
    • 2009-11-24
    • Yuri Granik
    • Yuri Granik
    • G06F17/50
    • H01J37/3174B82Y10/00B82Y40/00G03F1/36G03F1/78
    • Methods for approximating simulated contours are provided herein. With some implementations, a function that incorporates a Gaussian proximity kernel to approximate the electron beam exposure effects is used to simulate a printed image. Subsequently, one or more corners of the simulated printed image may be approximated by two or more straight edges. In various implementations, the number of straight edges used to approximate the corner as well as the orientation of the one or more straight edges is determined based upon the characteristics of the corner, such as, the corner having an obtuse angle larger than 135 degrees for example. With various implementations, two straight edges are used to approximate the corner, the orientation of the two straight edges being determined by a first point, a second point, and a shared corner point.
    • 本文提供了近似模拟轮廓的方法。 通过一些实施方式,使用包含高斯邻近内核以近似电子束曝光效果的函数来模拟打印图像。 随后,模拟印刷图像的一个或多个角可以由两个或更多个直边近似。 在各种实施方式中,用于近似拐角的直边的数量以及一个或多个直边的取向基于拐角的特征来确定,例如,角为大于135度的角为大于135度的角 例。 通过各种实施方式,使用两个直边来近似拐角,两个直边的方向由第一点,第二点和共同角点确定。
    • 6. 发明申请
    • Electron Beam Simulation Corner Correction For Optical Lithpography
    • 电子束模拟角修正光学Lithpography
    • US20100269086A1
    • 2010-10-21
    • US12625466
    • 2009-11-24
    • Yuri Granik
    • Yuri Granik
    • G06F17/50
    • H01J37/3174B82Y10/00B82Y40/00G03F1/36G03F1/78
    • Methods for approximating simulated contours are provided herein. With some implementations, a function that incorporates a Gaussian proximity kernel to approximate the electron beam exposure effects is used to simulate a printed image. Subsequently, one or more corners of the simulated printed image may be approximated by two or more straight edges. In various implementations, the number of straight edges used to approximate the corner as well as the orientation of the one or more straight edges is determined based upon the characteristics of the corner, such as, the corner having an obtuse angle larger than 135 degrees for example. With various implementations, two straight edges are used to approximate the corner, the orientation of the two straight edges being determined by a first point, a second point, and a shared corner point.
    • 本文提供了近似模拟轮廓的方法。 通过一些实施方式,使用包含高斯邻近内核以近似电子束曝光效果的函数来模拟打印图像。 随后,模拟印刷图像的一个或多个角可以由两个或更多个直边近似。 在各种实施方式中,用于近似拐角的直边的数量以及一个或多个直边的取向基于拐角的特征来确定,例如,角为大于135度的角为大于135度的角 例。 通过各种实施方式,使用两个直边来近似拐角,两个直边的方向由第一点,第二点和共同角点确定。
    • 10. 发明授权
    • Integrated device structure prediction based on model curvature
    • 基于模型曲率的集成器件结构预测
    • US06643616B1
    • 2003-11-04
    • US09457410
    • 1999-12-07
    • Yuri GranikNicolas Bailey CobbFranklin Mark Schellenberg
    • Yuri GranikNicolas Bailey CobbFranklin Mark Schellenberg
    • G06F1750
    • G03F7/70441G03F1/36
    • Methods and apparatuses for structure prediction based on model curvature are described. A simulation result corresponding to an integrated circuit or other structure is generated. The result includes contour data representing a feature value, for example, height (or intensity) of the structure at various points. Three or more points are used to determine a curvature of the result at a predetermined location. The curvature information can be used to determine boundaries of the structure. For example, when used with an integrated circuit layout, the curvature can be used for optical and process correction (OPC) purposes to modify an integrated circuit layout such that the resulting integrated circuit more closely resembles the designed integrated circuit than would otherwise be possible. In one embodiment, both slope and curvature of the integrated circuit structure are used for OPC purposes.
    • 描述了基于模型曲率的结构预测方法和装置。 产生与集成电路或其他结构对应的模拟结果。 结果包括表示特征值的轮廓数据,例如在各个点处的结构的高度(或强度)。 使用三个或更多个点来确定在预定位置处的结果的曲率。 曲率信息可用于确定结构的边界。 例如,当与集成电路布局一起使用时,曲率可以用于光学和过程校正(OPC)目的,以修改集成电路布局,使得所得到的集成电路与设计的集成电路非常类似于否则可能的。 在一个实施例中,集成电路结构的斜率和曲率都用于OPC目的。