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    • 2. 发明授权
    • Nano-imprinting process
    • 纳米压印过程
    • US07955545B2
    • 2011-06-07
    • US11897859
    • 2007-08-31
    • Yung-Chun LeeFei-Bin HsiaoCheng-Yu Chiu
    • Yung-Chun LeeFei-Bin HsiaoCheng-Yu Chiu
    • B29C59/00
    • B29C59/022B29C2059/023Y10S977/887
    • A nano-imprinting process is described, comprising: providing a substrate including an imprinting material layer covering a surface of the substrate; providing a mold including protruding features set on a surface of the mold covered with an anti-adhesion layer; forming a transferring material layer on a top surface of each protruding feature; embedding the transferring material layer into a first portion of the imprinting material layer; removing the mold and separating the mold and the transferring material layer simultaneously to transfer the transferring material layer into the first portion of the imprinting material layer and to expose a second portion of the imprinting material layer; using the transferring material layer as a mask to remove the second portion of the imprinting material layer and a portion of the substrate; and removing the first portion of the imprinting material layer and the transferring material layer.
    • 描述了纳米压印方法,其包括:提供包括覆盖所述基板的表面的压印材料层的基板; 提供包括设置在模具的表面上的突出特征的模具,​​其覆盖有防粘附层; 在每个突出特征的顶表面上形成转印材料层; 将转印材料层嵌入到压印材料层的第一部分中; 去除模具并同时分离模具和转移材料层,以将转印材料层转印到压印材料层的第一部分中并暴露压印材料层的第二部分; 使用转印材料层作为掩模以去除压印材料层的第二部分和基板的一部分; 并移除压印材料层和转印材料层的第一部分。
    • 3. 发明申请
    • Nano-imprinting process
    • 纳米压印过程
    • US20080296803A1
    • 2008-12-04
    • US11897859
    • 2007-08-31
    • Yung-Chun LeeFei-Bin HsiaoCheng-Yu Chiu
    • Yung-Chun LeeFei-Bin HsiaoCheng-Yu Chiu
    • B29C41/22
    • B29C59/022B29C2059/023Y10S977/887
    • A nano-imprinting process is described, comprising: providing a substrate including an imprinting material layer covering a surface of the substrate; providing a mold including protruding features set on a surface of the mold covered with an anti-adhesion layer; forming a transferring material layer on a top surface of each protruding feature; embedding the transferring material layer into a first portion of the imprinting material layer; removing the mold and separating the mold and the transferring material layer simultaneously to transfer the transferring material layer into the first portion of the imprinting material layer and to expose a second portion of the imprinting material layer; using the transferring material layer as a mask to remove the second portion of the imprinting material layer and a portion of the substrate; and removing the first portion of the imprinting material layer and the transferring material layer.
    • 描述了纳米压印方法,包括:提供包括覆盖基材表面的压印材料层的基板; 提供包括设置在模具的表面上的突出特征的模具,​​其覆盖有防粘附层; 在每个突出特征的顶表面上形成转印材料层; 将转印材料层嵌入到压印材料层的第一部分中; 去除模具并同时分离模具和转移材料层,以将转印材料层转印到压印材料层的第一部分中并暴露压印材料层的第二部分; 使用转印材料层作为掩模以去除压印材料层的第二部分和基板的一部分; 并移除压印材料层和转印材料层的第一部分。