专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5811497A Aromatic curing catalyst for epoxy resins 失效
标题翻译：用于环氧树脂的芳香族固化催化剂
公开(公告)号：US5811497A
公开(公告)日：1998-09-22
申请号：US526327
申请日：1995-09-11
申请人： Shuzi Hayase , Yoshihiko Nakano , Shinji Murai , Yukihiro Mikogami
发明人： Shuzi Hayase , Yoshihiko Nakano , Shinji Murai , Yukihiro Mikogami
IPC分类号： C08G59/68 , C08G59/06 , C08G59/24
CPC分类号： C08G59/68 , C08G59/681
摘要： Disclosed herein is a curing catalyst comprising at least one compound which is a substituted or unsubstituted aromatic or heteroaromatic compound and having any one of groups (I) --O--R.sub.1, (II) --O--CY--R.sub.1, or (III) --O--CY--X--R.sub.1, the groups being directly bonded to the armoatic or heteroaromatic ring, in a number of 1 to 10 wherein R.sub.1 may be the same or different and is a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, X is O or NH and Y is O or S. Furthermore, an epoxy resin composition comprising the curing catalyst is disclosed.
摘要翻译：本文公开了包含至少一种化合物的固化催化剂，所述化合物是取代或未取代的芳族或杂芳族化合物，并且具有（I）-O-R 1，（II）-O-CY-R 1或（III） - O-CY-X-R1，其直接键合到铠装或杂芳族环上，其数量为1至10，其中R 1可以相同或不同，并且是具有1至20个碳原子的取代或未取代的烃基， X是O或NH，Y是O或S.此外，公开了包含固化催化剂的环氧树脂组合物。

2. 发明授权

US5176982A Photosensitive resin composition for forming a polyimide film pattern 失效
标题翻译：用于形成聚酰亚胺薄膜图案的感光树脂组合物
公开(公告)号：US5176982A
公开(公告)日：1993-01-05
申请号：US726276
申请日：1991-07-05
申请人： Yukihiro Mikogami , Shuzi Hayase , Yoshihiko Nakano
发明人： Yukihiro Mikogami , Shuzi Hayase , Yoshihiko Nakano
IPC分类号： C08G73/10 , C08G77/455 , C08K5/541 , G03F7/075
CPC分类号： G03F7/0754 , C08G73/106 , C08G77/455 , C08K5/541 , G03F7/0757 , Y10S522/905
摘要： Disclosed is a photosensitive resin composition for forming a polyimide film pattern. The composition contains a polyamic acid and at least one silyl ketone compound represented by general formula (II) given below, ##STR1## where each of R.sup.3 to R.sup.16 is a are substituted or unsubstituted alkyl group having 1 to 12 carbon atoms or a substituted or unsubstituted aromatic group having 6 to 14 carbon atoms, each of R.sup.5 to R.sup.16 may be a substituted or unsubstituted silyl group, and each of l, m, n, s, t and u is 0 or 1, at least one of l, m, n, s, t and u being 1. The composition further contains a sensitizer, as required. A semiconductor substrate is coated with the composition, followed by exposing the coating through a predetermined mask and subsequently developing and heat-treating the coating so as to form a polyimide film pattern.

3. 发明授权

US6096836A (Hetero)aromatic ether, (thio)ester or (thio)carbonate epoxy catalyst 失效
标题翻译：（杂）芳族醚，（硫代）酯或（硫代）碳酸酯环氧催化剂
公开(公告)号：US6096836A
公开(公告)日：2000-08-01
申请号：US35307
申请日：1998-03-02
申请人： Shuzi Hayase , Yoshihiko Nakano , Shinji Murai , Yukihiro Mikogami
发明人： Shuzi Hayase , Yoshihiko Nakano , Shinji Murai , Yukihiro Mikogami
IPC分类号： C08G59/68 , C08G59/06 , C08G59/24
CPC分类号： C08G59/68 , C08G59/681
摘要： Disclosed herein is a curing catalyst comprising at least one compound which is a substituted or unsubstituted aromatic or heteroaromatic compound and having any one of groups (I) --O--R.sub.1, (II) --O--CY--R.sub.1, or (III) --O--CY--X--R.sub.1, the groups being directly bonded to the armoatic or heteroaromatic ring, in a number of 1 to 10 wherein R.sub.1 may be the same or different and is a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, X is O or NH and Y is O or S. Furthermore, an epoxy resin composition comprising the curing catalyst is disclosed.
摘要翻译：本文公开了包含至少一种化合物的固化催化剂，所述化合物是取代或未取代的芳族或杂芳族化合物，并且具有（I）-O-R 1，（II）-O-CY-R 1或（III） - O-CY-X-R1，其直接键合到铠装或杂芳族环上，其数量为1至10，其中R 1可以相同或不同，并且是具有1至20个碳原子的取代或未取代的烃基， X是O或NH，Y是O或S.此外，公开了包含固化催化剂的环氧树脂组合物。

4. 发明授权

US5518864A Method of forming polyimide film pattern 失效
标题翻译：形成聚酰亚胺薄膜图案的方法
公开(公告)号：US5518864A
公开(公告)日：1996-05-21
申请号：US220058
申请日：1994-03-30
申请人： Masayuki Oba , Rumiko Hayase , Naoko Kihara , Shuzi Hayase , Yukihiro Mikogami , Yoshihiko Nakano , Naohiko Oyasato , Shigeru Matake , Kei Takano
发明人： Masayuki Oba , Rumiko Hayase , Naoko Kihara , Shuzi Hayase , Yukihiro Mikogami , Yoshihiko Nakano , Naohiko Oyasato , Shigeru Matake , Kei Takano
IPC分类号： G03F7/023 , G03F7/038 , G03F7/38
CPC分类号： G03F7/0387 , G03F7/0233
摘要： Disclosed is a photosensitive resin composition, containing a polyamic acid derivative having a repeating unit represented by general formula (1) given below and a photosensitive agent: ##STR1## where, R.sup.1 represents a tetravalent organic group, R.sup.2 represents a divalent organic group, and R.sup.3 and R.sup.4 represent a monovalent organic group, at least one of R.sup.3 and R.sup.4 being an organic group having at least on hydroxyl group bonded to an aromatic ring. A semiconductor substrate is coated with the photosensitive resin composition, followed by exposing the coated film to light through a patterning mask and subsequently applying a development and a heat treatment so as to form a polyimide film pattern. A baking treatment also be applied immediately after the exposure step. The photosensitive resin composition of the present invention performs the function of a positive or negative photoresist film and the function of a polyimide protective film on a semiconductor substrate.
摘要翻译：公开了含有具有下述通式（1）表示的重复单元的聚酰胺酸衍生物和感光性化合物（1）的感光性树脂组合物，其中R1表示四价有机基团，R2表示二价有机基团并且R 3和R 4表示一价有机基团，R 3和R 4中的至少一个是至少具有与芳环键合的羟基的有机基团。用感光性树脂组合物涂布半导体基板，然后通过图案化掩模使涂膜曝光，随后进行显影和热处理，以形成聚酰亚胺膜图案。在曝光步骤之后立即施加烘烤处理。本发明的感光性树脂组合物在半导体基板上具有正性或负性光致抗蚀剂膜的功能和聚酰亚胺保护膜的功能。

5. 发明授权

US5348835A Photosensitive resin composition for forming polyimide film pattern comprising an o-quinone diazide photosensitive agent 失效
标题翻译：用于形成聚酰亚胺膜图案的光敏树脂组合物，其包含邻醌二叠氮化物感光剂
公开(公告)号：US5348835A
公开(公告)日：1994-09-20
申请号：US766334
申请日：1991-09-27
申请人： Masayuki Oba , Rumiko Hayase , Naoko Kihara , Shuzi Hayase , Yukihiro Mikogami , Yoshihiko Nakano , Naohiko Oyasato , Shigeru Matake , Kei Takano
发明人： Masayuki Oba , Rumiko Hayase , Naoko Kihara , Shuzi Hayase , Yukihiro Mikogami , Yoshihiko Nakano , Naohiko Oyasato , Shigeru Matake , Kei Takano
IPC分类号： G03F7/023 , G03F7/038 , G03F7/30
CPC分类号： G03F7/0387 , G03F7/0233
摘要： Disclosed is a photosensitive resin composition, containing a polyamic acid derivative having a repeating unit represented by general formula (1) given below and a photosensitive agent: ##STR1## where, R.sup.1 represents a tetravalent organic group, R.sup.2 represents a divalent organic group, and R.sup.3 and R.sup.4 represent a monovalent organic group, at least one of R.sup.3 and R.sup.4 being an organic group having at least on hydroxyl group bonded to an aromatic ring. A semiconductor substrate is coated with the photosensitive resin composition, followed by exposing the coated film to light through a patterning mask and subsequently applying a development and a heat treatment so as to form a polyimide film pattern. A baking treatment also be applied immediately after the exposure step. The photosensitive resin composition of the present invention performs the function of a positive or negative photoresist film and the function of a polyimide protective film on a semiconductor substrate.
摘要翻译：公开了一种感光性树脂组合物，其含有具有下述通式（1）表示的重复单元的聚酰胺酸衍生物和感光性化合物：其中，R 1表示四价有机基团，R 2表示二价有机基团， R3和R4表示一价有机基团，R3和R4中的至少一个是至少具有与芳环键合的羟基的有机基团。用感光性树脂组合物涂布半导体基板，然后通过图案化掩模将涂膜曝光，随后进行显影和热处理，以形成聚酰亚胺膜图案。在曝光步骤之后立即施加烘烤处理。本发明的感光性树脂组合物在半导体基板上具有正性或负性光致抗蚀剂膜的功能和聚酰亚胺保护膜的功能。

6. 发明授权

US5336736A Polysilane and polysilane composition 失效
标题翻译：聚硅烷和聚硅烷组成
公开(公告)号：US5336736A
公开(公告)日：1994-08-09
申请号：US53810
申请日：1993-04-29
申请人： Yoshihiko Nakano , Shuzi Hayase , Shinji Murai , Yukihiro Mikogami , Akira Yoshizumi
发明人： Yoshihiko Nakano , Shuzi Hayase , Shinji Murai , Yukihiro Mikogami , Akira Yoshizumi
IPC分类号： C08G18/64 , C08G59/00 , C08G59/20 , C08G59/30 , C08G59/40 , C08G59/42 , C08G77/60 , C08L63/00 , C08L83/04 , C08L83/16 , G03F7/075 , C08F283/00
CPC分类号： G03F7/0754 , C08G77/60 , C08L83/16
摘要： Disclosed is a polysilane having a repeating unit represented by general formula (1) given below. Also disclosed is a polysilane composition, comprising a polysilane having a repeating unit represented by general formula (2) given below and a cross linking agent: ##STR1## where, each of R.sup.1 and R.sup.3 is hydrogen, a substituted or unsubstituted alkyl group having 1 to 24 carbon atoms or a substituted or unsubstituted aryl group having 6 to 24 carbon atoms; R.sup.2 is a divalent hydrocarbon group having to 24 carbon atoms which can be substituted; R.sup.4 is a covalent bond, or a substituted or unsubstituted alkylene group having 1 to carbon atoms, or a substituted or unsubstituted arylene group having 6 to 24 carbon atoms; each of R.sup.5 to R.sup.9 is hydrogen, a substituted or unsubstituted alkyl group having 1 to 24 carbon atoms, a substituted or unsubstituted aryl group having 6 to 24 carbon atoms, or hydroxyl group, at least one of R.sup.5 to R.sup.9 being hydroxyl group; and X is a monovalent organic group having a reactive group capable of crosslinking upon exposure to light or by heating. If any of the polysilane and the polysilane composition of the present invention is exposed to light or heated, the polysilane molecules are crosslinked so as to provide a two or three dimensional polymer.
摘要翻译：公开了具有下述通式（1）表示的重复单元的聚硅烷。还公开了一种聚硅烷组合物，其包含具有由下述通式（2）表示的重复单元的聚硅烷和交联剂：其中，R1和R3各自为氢取代或未取代的碳原子数为1〜24的烷基或取代或未取代的碳原子数为6〜24的芳基。 R2是可被取代的具有24个碳原子的二价烃基; R4为共价键，或取代或未取代的碳原子数1〜2的亚烷基，取代或未取代的碳原子数为6〜24的亚芳基。 R5至R9各自为氢，取代或未取代的碳原子数为1〜24的烷基，取代或未取代的碳原子数为6〜24的芳基或羟基，R5〜R9中的至少一个为羟基; X是具有能够在曝光或加热时能够交联的反应性基团的一价有机基团。如果本发明的聚硅烷和聚硅烷组合物中的任何一种都被曝光或加热，则聚硅烷分子被交联以提供二维或三维聚合物。

7. 发明授权

US5578697A Polyimide precursor, bismaleimide-based cured resin precursor and electronic parts having insulating members made from these precursors 失效
标题翻译：聚酰亚胺前体，双马来酰亚胺类固化树脂前体和具有由这些前体制成的绝缘构件的电子部件
公开(公告)号：US5578697A
公开(公告)日：1996-11-26
申请号：US413173
申请日：1995-03-29
申请人： Yoshiaki Kawamonzen , Masayuki Oba , Yukihiro Mikogami , Shigeru Matake , Shuzi Hayase , Satoshi Mikoshiba
发明人： Yoshiaki Kawamonzen , Masayuki Oba , Yukihiro Mikogami , Shigeru Matake , Shuzi Hayase , Satoshi Mikoshiba
IPC分类号： C08G73/10 , G03F7/038 , H01L23/29 , H01L23/498 , H01L23/532
CPC分类号： G03F7/0387 , C08G73/1025 , C08G73/1039 , C08G73/106 , H01L23/293 , H01L23/49894 , H01L23/5329 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01025 , H01L2924/01039 , H01L2924/01046 , H01L2924/181 , Y10T428/2969 , Y10T428/31504 , Y10T428/31721
摘要： A polyimide precursor having a molecular structure obtained by polymerizing (a) 0.97 to 1.03 molar equivalent of a diamine component containing 0.40 molar equivalent or more of aromatic diamine compound represented by the general formula (DA1), and (b) an acid anhydride component containing (1-n.sub.1 /2) molar equivalent of a tetracarboxylic dianhydride and n.sub.1 molar equivalent of at least one selected from the group consisting of maleic anhydride and maleic derivative anhydride, wherein n.sub.1 ranges from 0.02 to 0.40. ##STR1##
摘要翻译：具有通过聚合（a）将通式（DA1）表示的含有0.40摩尔当量以上的芳香族二胺化合物的二胺成分为0.97〜1.03摩尔当量的聚合物前体，和（b）含有（1-n1 / 2）摩尔当量的四羧酸二酐和n1摩尔当量的选自马来酸酐和马来酸酐的至少一种，其中n1为0.02至0.40。（图）

8. 发明授权

US4816496A Photocurable composition 失效
标题翻译：可光固化组合物
公开(公告)号：US4816496A
公开(公告)日：1989-03-28
申请号：US739119
申请日：1985-05-30
申请人： Moriyasu Wada , Shuichi Suzuki , Yuusuke Wada , Shuzi Hayase , Yukihiro Mikogami
发明人： Moriyasu Wada , Shuichi Suzuki , Yuusuke Wada , Shuzi Hayase , Yukihiro Mikogami
IPC分类号： C08G59/14 , C08G59/68 , C08G65/14 , G03F7/075 , C08F283/10 , C08L63/10
CPC分类号： C08G65/14 , C08G59/14 , C08G59/1433 , C08G59/68 , G03F7/0755 , Y10S525/922
摘要： Disclosed are photocurable compositions which comprise(A) a compound having at least one epoxy group and at least one photocurable unsaturated ethylenic double bond within the same molecule;(B) an organometallic compound and(C) a silicon compound capable of generating silanol group by irradiation of light, or comprise(A) a compound having at least one epoxy group and at least one photocurable unsaturated ethylenic double bond within the same molecule;(E) an epoxy compound;(F) an organic phosphorus compound; and(G) a photosensitizer.The compositions of the present invention have excellent film characteristics such as good adhesion property, light resistance, heat resistance and weathering resistance.

9. 发明授权

US5637667A Thermosetting resin composition 失效
标题翻译：热固性树脂组合物
公开(公告)号：US5637667A
公开(公告)日：1997-06-10
申请号：US451065
申请日：1995-05-25
申请人： Hiroshi Shimozawa , Shinetsu Fujieda , Shuzi Hayase , Yoshihiko Nakano , Akira Yoshizumi , Ken Uchida
发明人： Hiroshi Shimozawa , Shinetsu Fujieda , Shuzi Hayase , Yoshihiko Nakano , Akira Yoshizumi , Ken Uchida
IPC分类号： C08G77/60 , C08L63/00 , C08L79/08 , C08L83/16 , C08L101/00 , C08G77/04
CPC分类号： C08L63/00 , C08G77/60 , C08L101/00 , C08L79/085 , C08L83/16
摘要： A thermosetting resin composition, containing (A) a thermosetting resin; (B) a curing agent for the thermosetting resin; (C) a polysilane copolymer; and (D) an inorganic filler; wherein the polyailane copolymer (C) is added in amount of about 0.1 to 10% by weight based on the total amount of the resin composition.
摘要翻译：一种热固性树脂组合物，其含有（A）热固性树脂; （B）热固性树脂用固化剂; （C）聚硅烷共聚物; 和（D）无机填料; 其中所述聚烯烃共聚物（C）的添加量相对于树脂组合物的总量为约0.1〜10重量％。

10. 发明授权

US5530956A Non-linear optical devices employing a polysilane composition and a polysilane composition therefor 失效
标题翻译：使用聚硅烷组合物的非线性光学器件及其聚硅烷组合物
公开(公告)号：US5530956A
公开(公告)日：1996-06-25
申请号：US450880
申请日：1995-05-26
申请人： Toshiro Hiraoka , Shin-ichi Nakamura , Yoshihiko Nakano , Shinji Murai , Shuzi Hayase
发明人： Toshiro Hiraoka , Shin-ichi Nakamura , Yoshihiko Nakano , Shinji Murai , Shuzi Hayase
IPC分类号： G02F1/361 , G02B6/00
CPC分类号： G02F1/3615 , Y10T428/31844
摘要： A non-linear optical device is disclosed, which comprises an optical waveguide complex wherein a part of the waveguide complex is formed of a non-linear element containing a polysilane having an average weight of 5,000 to 1,000,000 and having a repeating unit represented by formula ##STR1## Where R.sup.1 and R.sup.2 are independently selected from the group consisting of a hydrogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, and a substituted or unsubstituted aralkyl group, and particles having a particle size of 10 to 500 .ANG. selected from the group consisting of conductors, semiconductors, and mixture thereof.
摘要翻译：公开了一种非线性光学器件，其包括光波导复合体，其中波导复合体的一部分由含有平均重量为5,000〜1,000,000的聚硅烷的非线性元件形成，并具有式其中R 1和R 2独立地选自氢原子，取代或未取代的烷基，取代或未取代的芳基和取代或未取代的芳烷基，以及粒径为10〜500的粒子 ANGSTROM选自由导体，半导体及其混合物组成的组。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式