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    • 5. 发明授权
    • Method of forming stressed SOI FET having doped glass box layer using sacrificial stressed layer
    • 使用牺牲应力层形成具有掺杂玻璃盒层的应力SOI FET的方法
    • US07888197B2
    • 2011-02-15
    • US11622056
    • 2007-01-11
    • Dureseti ChidambarraoWilliam K. HensonYaocheng Liu
    • Dureseti ChidambarraoWilliam K. HensonYaocheng Liu
    • H01L21/8238
    • H01L29/78696H01L21/823807H01L21/823878H01L21/84H01L27/1203H01L29/045H01L29/7849
    • A method is provided for fabricating a semiconductor-on-insulator (“SOI”) substrate. In such method an SOI substrate is formed to include (i) an SOI layer of monocrystalline silicon separated from (ii) a bulk semiconductor layer by (iii) a buried oxide (“BOX”) layer including a layer of doped silicate glass. A sacrificial stressed layer is deposited onto the SOI substrate to overlie the SOI layer. Trenches are then etched through the sacrificial stressed layer and into the SOI layer. The SOI substrate is heated with the sacrificial stressed layer sufficiently to cause the glass layer to soften and the sacrificial stressed layer to relax, to thereby apply a stress to the SOI layer to form a stressed SOI layer. The trenches in the stressed SOI layer are then filled with a dielectric material to form trench isolation regions contacting peripheral edges of the stressed SOI layer, the trench isolation regions extending downwardly from a major surface of the stressed SOI layer towards the BOX layer. The sacrificial stressed layer is then removed to expose the stressed SOI layer. Field effect transistors can then be formed in the stressed SOI layer.
    • 提供了一种用于制造绝缘体上半导体(“SOI”)衬底的方法。 在这种方法中,形成SOI衬底,其包括(i)通过(iii)包含掺杂硅酸盐玻璃层的掩埋氧化物(“BOX”)层从(ii)体半导体层分离的单晶硅的SOI层。 牺牲应力层沉积在SOI衬底上以覆盖SOI层。 然后将沟槽蚀刻穿过牺牲应力层并进入SOI层。 用牺牲应力层将SOI衬底充分加热,使玻璃层软化,牺牲应力层松弛,从而向SOI层施加应力以形成受应力的SOI层。 然后用电介质材料填充受应力的SOI层中的沟槽,以形成接触应力SOI层的外围边缘的沟槽隔离区,沟槽隔离区域从受应力的SOI层的主表面向BOX层向下延伸。 然后去除牺牲应力层以暴露受应力的SOI层。 然后可以在受应力的SOI层中形成场效应晶体管。