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    • 1. 发明申请
    • ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD
    • 电子元件安装系统和电子元件安装方法
    • US20090007424A1
    • 2009-01-08
    • US11814041
    • 2006-02-10
    • Yuji OtakeToshitsugu Oba
    • Yuji OtakeToshitsugu Oba
    • H05K3/34
    • H05K3/1216H05K3/303H05K3/3484Y10T29/49144Y10T29/53052Y10T29/53174Y10T29/53178Y10T29/53187Y10T29/53191
    • In an electronic component mounting method of mounting electronic components on a substrate by means of soldering by using an electronic component mounting system having a screen printing apparatus and an electronic component mounting apparatus connected to each other to manufacture a mounting substrate, prior to a screen printing process, the positions of pattern holes provided in a screen mask are measured to calculate mask aperture data, and the coordinates of a mounting position when a component mounting operation is performed by a mounting head are calculated, on the basis of the mask aperture data. In this way, it is possible to calculate the positional deviation of solder, without measuring the position of solder after printing whenever the solder is printed, and to prevent defects in mounting due to the positional deviation of solder, which results in high productivity.
    • 在通过使用具有彼此连接的丝网印刷装置和电子部件安装装置的电子部件安装系统通过焊接将电子部件安装在基板上以制造安装基板的电子部件安装方法中,在丝网印刷之前 测量屏幕掩模中设置的图形孔的位置,以计算掩模孔径数据,并且基于掩模孔径数据计算安装头执行部件安装操作时的安装位置的坐标。 以这种方式,可以计算焊料的位置偏差,而不管焊料印刷时不测量印刷后的焊料位置,并且防止由于焊料的位置偏差导致的安装缺陷,这导致高生产率。
    • 2. 发明授权
    • Electronic component mounting system and electronic component mounting method
    • 电子元件安装系统和电子元件安装方法
    • US07676916B2
    • 2010-03-16
    • US11814041
    • 2006-02-10
    • Yuji OtakeToshitsugu Oba
    • Yuji OtakeToshitsugu Oba
    • H05K3/34
    • H05K3/1216H05K3/303H05K3/3484Y10T29/49144Y10T29/53052Y10T29/53174Y10T29/53178Y10T29/53187Y10T29/53191
    • In an electronic component mounting method of mounting electronic components on a substrate by means of soldering by using an electronic component mounting system having a screen printing apparatus and an electronic component mounting apparatus connected to each other to manufacture a mounting substrate, prior to a screen printing process, the positions of pattern holes provided in a screen mask are measured to calculate mask aperture data, and the coordinates of a mounting position when a component mounting operation is performed by a mounting head are calculated, on the basis of the mask aperture data. In this way, it is possible to calculate the positional deviation of solder, without measuring the position of solder after printing whenever the solder is printed, and to prevent defects in mounting due to the positional deviation of solder, which results in high productivity.
    • 在通过使用具有彼此连接的丝网印刷装置和电子部件安装装置的电子部件安装系统通过焊接将电子部件安装在基板上以制造安装基板的电子部件安装方法中,在丝网印刷之前 测量屏幕掩模中设置的图案孔的位置以计算掩模孔径数据,并且基于掩模孔径数据计算安装头执行部件安装操作时的安装位置的坐标。 以这种方式,可以计算焊料的位置偏差,而不管焊料印刷时不测量印刷后的焊料位置,并且防止由于焊料的位置偏差导致的安装缺陷,这导致高生产率。
    • 3. 发明申请
    • SCREEN PRINTING APPARATUS AND SCREEN PRINTING METHOD
    • 屏幕打印设备和画面打印方法
    • US20120269959A1
    • 2012-10-25
    • US13265611
    • 2011-03-18
    • Tetsuya TanakaYuji Otake
    • Tetsuya TanakaYuji Otake
    • H05K3/12
    • B41M1/12B41F15/0881B41F15/36B41F15/423B41F15/46B41N1/24B41P2215/50H01L31/022425H05K3/1233Y02E10/50
    • There are provided a screen printing apparatus and a screen printing method which can realize an increase in conversion efficiency of a solar cell by forming a circuit pattern having a large aspect ratio of a sectional shape by increasing the thickness of the circuit pattern. A screen printing apparatus 10 and a screen printing method for forming a belt-shaped circuit pattern on a surface of a substrate 11 include a support table 12 which supports the substrate, a metal mask 1 having a covering portion which covers a part of the surface of the substrate 11, a plurality of apertures from which a part of the substrate 11 is exposed and bridge portions which are provided between the apertures along a direction which intersects a longitudinal direction of a circuit pattern to be formed and a cartridge-type squeegee head 13 which supplies a paste which constitutes a circuit pattern to a surface of the metal mask 1 under a predetermined pressure while causing a squeegee 14 of a predetermined length to slide on an upper surface of the metal mask 1 in a contact fashion.
    • 提供一种丝网印刷装置和丝网印刷方法,其可以通过增加电路图案的厚度来形成具有大截面形状的大纵横比的电路图案,从而实现太阳能电池的转换效率的提高。 在基板11的表面上形成带状电路图案的丝网印刷装置10和丝网印刷方法包括支撑基板的支撑台12,具有覆盖表面的一部分的覆盖部的金属掩模1 基板11的一部分露出的多个孔,沿着与要形成的电路图案的长度方向相交的方向设置在孔之间的桥接部,以及盒式刮板头 13,其在预定压力下将构成电路图案的糊料提供给金属掩模1的表面,同时使预定长度的刮板14以接触的方式在金属掩模1的上表面上滑动。
    • 9. 发明申请
    • Screen printing apparatus and screen printing method
    • 丝网印刷设备和丝网印刷方法
    • US20050183592A1
    • 2005-08-25
    • US11061913
    • 2005-02-18
    • Yuji OtakeTakaaki SakaueTetsuya Tanaka
    • Yuji OtakeTakaaki SakaueTetsuya Tanaka
    • B41F15/40B41F15/08B41M1/12H01L21/48H05K3/12H05K3/34B41L13/18B05C17/06B41C1/00
    • H05K3/1233B41M1/12H01L21/4867H05K2203/0264
    • In screen printing for printing cream-like solder on a board 7 through through-holes of a mask plate 12, removal of the board 7 from a lower surface of the mask plate 12 is performed in such a manner that the board 7 is moved down at a first descending velocity V1 as a lower velocity during an initial stroke S1 of from a state where the removal of the board 7 starts to a state where the board 7 is removed from the mask plate 12 so that the distance between the upper surface of the board 7 and the lower surface of the mask plate 12 reaches a predetermined value set to be in a range of from a half to twice as large as the thickness of the mask plate 12, and that the board 7 is moved down at a second descending velocity V2 as a higher velocity after the initial stroke S1. Accordingly, even in the case where solder apt to vary according to the passage of time is used, good removability and stable print quality can be secured.
    • 在通过掩模板12的通孔在板7上印刷奶油状焊料的丝网印刷中,以使得板7向下移动的方式从掩模板12的下表面去除板7 在第一下降速度V 1作为初始行程S 1期间从板7的移除开始到板7从掩模板12移除的状态下的较低速度,使得上部 板7的表面和掩模板12的下表面达到预定值,设定在掩模板12的厚度的一半至两倍的范围内,并且板7向下移动 第二下降速度V 2作为初始行程S 1之后的较高速度。 因此,即使在使用易于随时间流逝变化的焊料的情况下,也可以确保良好的可除去性和稳定的印刷品质。