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1. 发明申请

US20090007424A1 ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD 有权
标题翻译：电子元件安装系统和电子元件安装方法
公开(公告)号：US20090007424A1
公开(公告)日：2009-01-08
申请号：US11814041
申请日：2006-02-10
申请人： Yuji Otake , Toshitsugu Oba
发明人： Yuji Otake , Toshitsugu Oba
IPC分类号： H05K3/34
CPC分类号： H05K3/1216 , H05K3/303 , H05K3/3484 , Y10T29/49144 , Y10T29/53052 , Y10T29/53174 , Y10T29/53178 , Y10T29/53187 , Y10T29/53191
摘要： In an electronic component mounting method of mounting electronic components on a substrate by means of soldering by using an electronic component mounting system having a screen printing apparatus and an electronic component mounting apparatus connected to each other to manufacture a mounting substrate, prior to a screen printing process, the positions of pattern holes provided in a screen mask are measured to calculate mask aperture data, and the coordinates of a mounting position when a component mounting operation is performed by a mounting head are calculated, on the basis of the mask aperture data. In this way, it is possible to calculate the positional deviation of solder, without measuring the position of solder after printing whenever the solder is printed, and to prevent defects in mounting due to the positional deviation of solder, which results in high productivity.
摘要翻译：在通过使用具有彼此连接的丝网印刷装置和电子部件安装装置的电子部件安装系统通过焊接将电子部件安装在基板上以制造安装基板的电子部件安装方法中，在丝网印刷之前测量屏幕掩模中设置的图形孔的位置，以计算掩模孔径数据，并且基于掩模孔径数据计算安装头执行部件安装操作时的安装位置的坐标。以这种方式，可以计算焊料的位置偏差，而不管焊料印刷时不测量印刷后的焊料位置，并且防止由于焊料的位置偏差导致的安装缺陷，这导致高生产率。

2. 发明授权

US07676916B2 Electronic component mounting system and electronic component mounting method 有权
标题翻译：电子元件安装系统和电子元件安装方法
公开(公告)号：US07676916B2
公开(公告)日：2010-03-16
申请号：US11814041
申请日：2006-02-10
申请人： Yuji Otake , Toshitsugu Oba
发明人： Yuji Otake , Toshitsugu Oba
IPC分类号： H05K3/34
CPC分类号： H05K3/1216 , H05K3/303 , H05K3/3484 , Y10T29/49144 , Y10T29/53052 , Y10T29/53174 , Y10T29/53178 , Y10T29/53187 , Y10T29/53191
摘要： In an electronic component mounting method of mounting electronic components on a substrate by means of soldering by using an electronic component mounting system having a screen printing apparatus and an electronic component mounting apparatus connected to each other to manufacture a mounting substrate, prior to a screen printing process, the positions of pattern holes provided in a screen mask are measured to calculate mask aperture data, and the coordinates of a mounting position when a component mounting operation is performed by a mounting head are calculated, on the basis of the mask aperture data. In this way, it is possible to calculate the positional deviation of solder, without measuring the position of solder after printing whenever the solder is printed, and to prevent defects in mounting due to the positional deviation of solder, which results in high productivity.
摘要翻译：在通过使用具有彼此连接的丝网印刷装置和电子部件安装装置的电子部件安装系统通过焊接将电子部件安装在基板上以制造安装基板的电子部件安装方法中，在丝网印刷之前测量屏幕掩模中设置的图案孔的位置以计算掩模孔径数据，并且基于掩模孔径数据计算安装头执行部件安装操作时的安装位置的坐标。以这种方式，可以计算焊料的位置偏差，而不管焊料印刷时不测量印刷后的焊料位置，并且防止由于焊料的位置偏差导致的安装缺陷，这导致高生产率。

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