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1. 发明授权

US5046654A Ultrasonic wire bonding apparatus 失效
标题翻译：超声波线焊机
公开(公告)号：US5046654A
公开(公告)日：1991-09-10
申请号：US426788
申请日：1989-10-25
申请人： Nobuto Yamazaki , Yoshimitsu Terakado , Yuji Ohashi , Hijiri Hayashi
发明人： Nobuto Yamazaki , Yoshimitsu Terakado , Yuji Ohashi , Hijiri Hayashi
IPC分类号： H01L21/607 , B23K20/10
CPC分类号： H01L24/78 , B23K20/10 , H01L2224/78 , H01L2924/00014 , H01L2924/01033
摘要： An ultrasonic wire bonding apparatus including a ultrasonic oscillation control circuit which causes a transducer having a bonding tool fastened at one end to be vibrated by ultrasonic oscillation voltage. The control circuit includes an electric current amplifier connected to the transducer, an A/D converter to which an electric current amplified by an electric current amplifier is supplied so as to be converted into digital signal which is supplied to a microcomputer, an ultrasonic oscillating circuit, and an output control circuit to which ultrasonic oscillation voltage is supplied from the ultrasonic oscillating circuit. The output control circuit controls the ultrasonic oscillating voltage by comparing it to the ultrasonic oscillating output data supplied from the computer and supplies the thus controlled voltage to the transducer through a power amplifier so as to vibrate the transducer.
摘要翻译：一种超声波引线接合装置，包括超声波振荡控制电路，其使具有固定在一端的接合工具的换能器通过超声波振荡电压振动。控制电路包括连接到换能器的电流放大器，A / D转换器，由电流放大器放大的电流供给到该A / D转换器，以转换为提供给微计算机的数字信号，超声波振荡电路以及从超声波振荡电路向其提供超声波振荡电压的输出控制电路。输出控制电路通过将其与从计算机提供的超声波振荡输出数据进行比较来控制超声波振荡电压，并通过功率放大器将这样控制的电压提供给换能器，从而使换能器振动。

2. 发明授权

US5016803A Wire bonding apparatus 失效
标题翻译：接线装置
公开(公告)号：US5016803A
公开(公告)日：1991-05-21
申请号：US429760
申请日：1989-10-31
申请人： Yuji Ohashi , Yoshimitsu Terakado , Hijiri Hayashi
发明人： Yuji Ohashi , Yoshimitsu Terakado , Hijiri Hayashi
IPC分类号： H01L21/60 , B23K20/00 , H01L21/00
CPC分类号： H01L24/78 , B23K20/005 , H01L2224/78313 , H01L2224/786 , H01L2224/851 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039
摘要： A wire bonding apparatus in which an air guide blows air against a bonding wire so that tension is applied to the bonding wire between a wire spool and a bonding tool so that the bonding wire comes in contact with a wire-contact. An optical sensor is provided near the wire-contact so that the sensor is prevented from contacting the bonding wire. Thus, the presence of the bonding wire is detected by the optical sensor which senses when the bonding wire is in contact with the wire-contact.
摘要翻译：一种引线接合装置，其中空气引导件将空气吹向接合线，使得张力被施加到线卷轴和接合工具之间的接合线，使得接合线与线接触接触。在导线接触件附近设有光学传感器，防止传感器接触接合线。因此，通过光学传感器检测接合线的存在，该传感器感测接合线何时与线接触接触。

3. 发明授权

US5485063A Motor control circuit for a wire bonding apparatus 失效
标题翻译：电线接线装置的电机控制电路
公开(公告)号：US5485063A
公开(公告)日：1996-01-16
申请号：US99623
申请日：1993-07-30
申请人： Tooru Mochida , Yoshimitsu Terakado , Hijiri Hayashi
发明人： Tooru Mochida , Yoshimitsu Terakado , Hijiri Hayashi
IPC分类号： H01L21/60 , B23K20/00
CPC分类号： H01L24/85 , B23K20/007 , H01L24/78 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/78301 , H01L2224/85 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01082
摘要： A motor control circuit for a wire bonding apparatus for manufacturing semiconductor devices, etc. using a feedback gain circuit which performs feedback control of a synthesized signal that drives a Z-axis motor for moving a capillary up and down. The gain value of the feedback gain circuit is controlled by a computer, thus allowing smooth and stable control of the motor operation even after rotational speed change of the Z-axis motor, and assuring a stable wire bonding.
摘要翻译：一种用于使用反馈增益电路制造半导体器件等的引线接合装置的电动机控制电路，该反馈增益电路对驱动用于使毛细管上下移动的Z轴电动机的合成信号进行反馈控制。反馈增益电路的增益值由计算机控制，即使在Z轴电动机的转速变化之后也可以平稳，稳定地控制电动机运行，并确保稳定的线接合。

4. 发明授权

US06302312B1 Bonding apparatus and method 失效
标题翻译：接合装置及方法
公开(公告)号：US06302312B1
公开(公告)日：2001-10-16
申请号：US09322801
申请日：1999-05-27
申请人： Kuniyuki Takahashi , Hijiri Hayashi
发明人： Kuniyuki Takahashi , Hijiri Hayashi
IPC分类号： B23K2010
CPC分类号： H01L24/80 , B23K20/10 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01082
摘要： Instead of using the ordinary pulse train command inputted from a computer to the control circuit, an offset signal outputted from an offset compensation circuit is employed for performing scrubbing of a bonding surface of, for instance, a semiconductor device. The offset compensation circuit controls a DC motor in drive amounts smaller than the resolution of the DC motor which moves an XY table having a bonding tool which performs the scrubbing, and the drive amounts smaller than the resolution outputted from the offset compensation circuit are controlled by a computer.
摘要翻译：代替使用从计算机输入到控制电路的普通脉冲串命令，从偏移补偿电路输出的偏移信号用于擦除例如半导体器件的接合表面。偏移补偿电路控制直流电动机的驱动量小于直流电动机的分辨率，该直流电动机移动具有执行擦洗的接合工具的XY工作台，并且小于由偏移补偿电路输出的分辨率的驱动量由一台电脑。

5. 发明授权

US06206266B1 Control method for wire bonding apparatus 失效
标题翻译：引线接合装置的控制方法
公开(公告)号：US06206266B1
公开(公告)日：2001-03-27
申请号：US09164331
申请日：1998-10-01
申请人： Kuniyuki Takahashi , Hijiri Hayashi
发明人： Kuniyuki Takahashi , Hijiri Hayashi
IPC分类号： B23K3700
CPC分类号： H01L24/85 , B23K20/004 , H01L24/78 , H01L2224/78301 , H01L2224/85148 , H01L2224/859 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2224/48 , H01L2224/45099
摘要： In a bonding method and apparatus, a bonding arm having a bonding tool at one end thereof is controlled to stop at a constant height position by a computer that incudes a memory containing positional deviation correction values which correct deviations at stopping positions of the bonding arm so that a bonding arm position controller is controlled by the positional deviation correction values.
摘要翻译：在接合方法和装置中，通过计算机控制在其一端具有接合工具的接合臂在包含位置偏差校正值的存储器的恒定高度位置停止，所述位置偏差校正值校正了接合臂的停止位置的偏差，接合臂位置控制器由位置偏差校正值控制。

6. 发明授权

US06070778A Wire bonding apparatus and control method thereof 失效
标题翻译：线接合装置及其控制方法
公开(公告)号：US06070778A
公开(公告)日：2000-06-06
申请号：US79215
申请日：1998-05-14
申请人： Kuniyuki Takahashi , Hijiri Hayashi
发明人： Kuniyuki Takahashi , Hijiri Hayashi
IPC分类号： H01L21/60 , B23K20/00 , B23K37/00 , B23K13/08 , B23K15/02 , B23K31/00 , B23K31/02
CPC分类号： H01L24/85 , B23K20/004 , H01L24/78 , H01L2224/78301 , H01L2224/85148 , H01L2224/859 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039
摘要： In a bonding method and apparatus, a bonding arm having a bonding tool at one end thereof is controlled to stop at a constant height position by a computer that incudes a memory containing positional deviation correction values which correct deviations at stopping positions of the bonding arm so that a bonding arm position controller is controlled by the positional deviation correction values.
摘要翻译：在接合方法和装置中，通过计算机控制在其一端具有接合工具的接合臂在包含位置偏差校正值的存储器的恒定高度位置停止，所述位置偏差校正值校正了接合臂的停止位置的偏差，接合臂位置控制器由位置偏差校正值控制。

7. 发明授权

US6095396A Bonding load correction method and wire bonding apparatus 失效
标题翻译：引线接合装置的接合负载校正方法
公开(公告)号：US6095396A
公开(公告)日：2000-08-01
申请号：US73631
申请日：1998-05-06
申请人： Kuniyuki Takahashi , Hijiri Hayashi
发明人： Kuniyuki Takahashi , Hijiri Hayashi
IPC分类号： H01L21/60 , B23K20/00 , B23K20/10 , B23K37/00 , B23K1/06 , B23K5/20
CPC分类号： H01L24/78 , B23K20/004 , B23K20/106 , H01L2224/78301 , H01L2224/78823 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039
摘要： A wire bonding method and apparatus using a computer that has a memory which stores correction values that correct positional discrepancies in the height position of a bonding arm and limit values that limit an electric power not only in a state in which no load is applied but also in a state in which a weight is mounted on a supporting frame so that a load equal to a bonding load is applied to a linear motor that raises and lowers the bonding arm.
摘要翻译：一种引线接合方法和使用计算机的设备，该计算机具有存储校正值的存储器，该校正值校正接合臂的高度位置的位置偏差，并且限制不仅在不施加负载的状态下的电力的值，在将重量安装在支撑框架上的状态下，使得等于接合负载的负载施加到升高和降低接合臂的线性电动机。

8. 发明授权

US5949208A Circuit and method for controlling a DC motor 失效
标题翻译：用于控制直流电动机的电路和方法
公开(公告)号：US5949208A
公开(公告)日：1999-09-07
申请号：US47033
申请日：1998-03-24
申请人： Kuniyuki Takahashi , Hijiri Hayashi
发明人： Kuniyuki Takahashi , Hijiri Hayashi
IPC分类号： G05D3/00 , G05B19/23 , G05D3/12 , H02P3/08 , H02P7/06 , G05B11/01
CPC分类号： G05B19/231 , G05B2219/41329 , G05B2219/43112
摘要： A circuit and method for controlling a rotating or oscillating element of a DC motor, including a positional deviation correction signal generator in addition to a position sensor which detects an amount of rotation or oscillation and position of the rotating or oscillating element, a main control circuit that includes a DC motor driving circuit, and a computer which controls the main control circuit. The output signal of the positional deviation correction signal generator is controlled by the computer based upon positional deviation correction information and signals from the position sensor, so that the positional deviation correction signal generator compensates for any positional deviation of the rotating or oscillating element of the DC motor at a stopping position thereof.
摘要翻译：一种用于控制直流电动机的旋转或振荡元件的电路和方法，包括除了检测旋转或振荡的位置传感器和旋转或振荡元件的位置之外的位置偏差校正信号发生器，主控制电路包括直流电动机驱动电路和控制主控制电路的计算机。位置偏差校正信号发生器的输出信号由计算机根据位置偏差校正信息和来自位置传感器的信号进行控制，使得位置偏差校正信号发生器补偿DC的旋转或振荡元件的任何位置偏差电机处于停止位置。

9. 发明授权

US06362014B1 Bonding apparatus 失效
标题翻译：接合装置
公开(公告)号：US06362014B1
公开(公告)日：2002-03-26
申请号：US09687842
申请日：2000-10-13
申请人： Kuniyuki Takahashi , Hijiri Hayashi
发明人： Kuniyuki Takahashi , Hijiri Hayashi
IPC分类号： H01L2166
CPC分类号： H01L24/80 , B23K20/10 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01082
摘要： Instead of using the ordinary pulse train command inputted from a computer to the control circuit, an offset signal outputted from an offset compensation circuit is employed for performing scrubbing of a bonding surface of, for instance, a semiconductor device. The offset compensation circuit controls a DC motor in drive amounts smaller than the resolution of the DC motor which moves an XY table having a bonding tool which performs the scrubbing, and the drive amounts smaller than the resolution outputted from the offset compensation circuit are controlled by a computer.
摘要翻译：代替使用从计算机输入到控制电路的普通脉冲串命令，从偏移补偿电路输出的偏移信号用于擦除例如半导体器件的接合表面。偏移补偿电路控制直流电动机的驱动量小于直流电动机的分辨率，该直流电动机移动具有执行擦洗的接合工具的XY工作台，并且小于由偏移补偿电路输出的分辨率的驱动量由一台电脑。

10. 发明授权

US6119917A Wire bonding apparatus and bonding load correction method for the same 失效
标题翻译：引线接合装置和接合负载校正方法相同
公开(公告)号：US6119917A
公开(公告)日：2000-09-19
申请号：US54232
申请日：1998-04-02
申请人： Kuniyuki Takahashi , Hijiri Hayashi
发明人： Kuniyuki Takahashi , Hijiri Hayashi
IPC分类号： H01L21/60 , B23K20/00 , B23K20/10 , G05B19/404 , B23K31/02 , B23Q15/22 , B23Q16/00
CPC分类号： H01L24/78 , B23K20/004 , B23K20/10 , B23K20/106 , G05B19/404 , H01L24/85 , G05B2219/41214 , G05B2219/45033 , H01L2224/78301 , H01L2224/85148 , H01L2224/85205 , H01L2224/859 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039
摘要： A bonding apparatus for manufacturing, for instance, a semiconductor device including a computer system which calculates a limit value of a driving current that flows to a linear motor controlling a bonding arm, and the computer system including a memory which stores correction current values that are used to correct the driving force of a plate spring at various height positions of the bonding arm, and limit values of the driving current according to a bonding load.
摘要翻译：一种用于制造的接合装置，例如包括计算流向控制接合臂的线性电动机的驱动电流的极限值的计算机系统的半导体装置，以及包括存储校正电流值的存储器的计算机系统用于校正接合臂的各个高度位置处的板簧的驱动力，并根据接合负载限制驱动电流的值。

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