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1. 发明授权

US5485063A Motor control circuit for a wire bonding apparatus 失效
标题翻译：电线接线装置的电机控制电路
公开(公告)号：US5485063A
公开(公告)日：1996-01-16
申请号：US99623
申请日：1993-07-30
申请人： Tooru Mochida , Yoshimitsu Terakado , Hijiri Hayashi
发明人： Tooru Mochida , Yoshimitsu Terakado , Hijiri Hayashi
IPC分类号： H01L21/60 , B23K20/00
CPC分类号： H01L24/85 , B23K20/007 , H01L24/78 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/78301 , H01L2224/85 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01082
摘要： A motor control circuit for a wire bonding apparatus for manufacturing semiconductor devices, etc. using a feedback gain circuit which performs feedback control of a synthesized signal that drives a Z-axis motor for moving a capillary up and down. The gain value of the feedback gain circuit is controlled by a computer, thus allowing smooth and stable control of the motor operation even after rotational speed change of the Z-axis motor, and assuring a stable wire bonding.
摘要翻译：一种用于使用反馈增益电路制造半导体器件等的引线接合装置的电动机控制电路，该反馈增益电路对驱动用于使毛细管上下移动的Z轴电动机的合成信号进行反馈控制。反馈增益电路的增益值由计算机控制，即使在Z轴电动机的转速变化之后也可以平稳，稳定地控制电动机运行，并确保稳定的线接合。

2. 发明授权

US5524811A Wire bonding method 失效
标题翻译：接线方式
公开(公告)号：US5524811A
公开(公告)日：1996-06-11
申请号：US309937
申请日：1994-09-21
申请人： Yoshimitsu Terakado , Kazuo Sugiura , Tooru Mochida , Tatsunari Mii
发明人： Yoshimitsu Terakado , Kazuo Sugiura , Tooru Mochida , Tatsunari Mii
IPC分类号： H01L21/60 , B23K20/00 , H01L21/607
CPC分类号： H01L24/85 , B23K20/007 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/78301 , H01L2224/85045 , H01L2224/85181 , H01L2224/85205 , H01L24/78 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082
摘要： In a bonding method for bonding with a wire a first bonding point and then a second bonding point, a capillary that carries the wire is moved in a direction which is opposite from the first bonding point at the same time that an ultrasonic vibration is applied to the capillary during bonding to the second bonding point. Such a movement of the opposite direction can occur 10-20 ms after the application of the ultrasonic vibration at the second bonding point.
摘要翻译：在与导线接合第一接合点和第二接合点的接合方法中，携带导线的毛细管在与第一接合点相反的方向上移动，同时将超声波振动施加到在接合到第二接合点期间的毛细管。在第二接合点施加超声波振动之后10-20ms可能发生相反方向的这种运动。

3. 发明授权

US5016803A Wire bonding apparatus 失效
标题翻译：接线装置
公开(公告)号：US5016803A
公开(公告)日：1991-05-21
申请号：US429760
申请日：1989-10-31
申请人： Yuji Ohashi , Yoshimitsu Terakado , Hijiri Hayashi
发明人： Yuji Ohashi , Yoshimitsu Terakado , Hijiri Hayashi
IPC分类号： H01L21/60 , B23K20/00 , H01L21/00
CPC分类号： H01L24/78 , B23K20/005 , H01L2224/78313 , H01L2224/786 , H01L2224/851 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039
摘要： A wire bonding apparatus in which an air guide blows air against a bonding wire so that tension is applied to the bonding wire between a wire spool and a bonding tool so that the bonding wire comes in contact with a wire-contact. An optical sensor is provided near the wire-contact so that the sensor is prevented from contacting the bonding wire. Thus, the presence of the bonding wire is detected by the optical sensor which senses when the bonding wire is in contact with the wire-contact.
摘要翻译：一种引线接合装置，其中空气引导件将空气吹向接合线，使得张力被施加到线卷轴和接合工具之间的接合线，使得接合线与线接触接触。在导线接触件附近设有光学传感器，防止传感器接触接合线。因此，通过光学传感器检测接合线的存在，该传感器感测接合线何时与线接触接触。

4. 发明授权

US5046654A Ultrasonic wire bonding apparatus 失效
标题翻译：超声波线焊机
公开(公告)号：US5046654A
公开(公告)日：1991-09-10
申请号：US426788
申请日：1989-10-25
申请人： Nobuto Yamazaki , Yoshimitsu Terakado , Yuji Ohashi , Hijiri Hayashi
发明人： Nobuto Yamazaki , Yoshimitsu Terakado , Yuji Ohashi , Hijiri Hayashi
IPC分类号： H01L21/607 , B23K20/10
CPC分类号： H01L24/78 , B23K20/10 , H01L2224/78 , H01L2924/00014 , H01L2924/01033
摘要： An ultrasonic wire bonding apparatus including a ultrasonic oscillation control circuit which causes a transducer having a bonding tool fastened at one end to be vibrated by ultrasonic oscillation voltage. The control circuit includes an electric current amplifier connected to the transducer, an A/D converter to which an electric current amplified by an electric current amplifier is supplied so as to be converted into digital signal which is supplied to a microcomputer, an ultrasonic oscillating circuit, and an output control circuit to which ultrasonic oscillation voltage is supplied from the ultrasonic oscillating circuit. The output control circuit controls the ultrasonic oscillating voltage by comparing it to the ultrasonic oscillating output data supplied from the computer and supplies the thus controlled voltage to the transducer through a power amplifier so as to vibrate the transducer.
摘要翻译：一种超声波引线接合装置，包括超声波振荡控制电路，其使具有固定在一端的接合工具的换能器通过超声波振荡电压振动。控制电路包括连接到换能器的电流放大器，A / D转换器，由电流放大器放大的电流供给到该A / D转换器，以转换为提供给微计算机的数字信号，超声波振荡电路以及从超声波振荡电路向其提供超声波振荡电压的输出控制电路。输出控制电路通过将其与从计算机提供的超声波振荡输出数据进行比较来控制超声波振荡电压，并通过功率放大器将这样控制的电压提供给换能器，从而使换能器振动。

5. 发明授权

US06595400B2 Wire bonding apparatus 失效
标题翻译：接线装置
公开(公告)号：US06595400B2
公开(公告)日：2003-07-22
申请号：US09934890
申请日：2001-08-22
申请人： Yoshimitsu Terakado , Tooru Mochida , Tatsunari Mii , Shigeru Shiozawa
发明人： Yoshimitsu Terakado , Tooru Mochida , Tatsunari Mii , Shigeru Shiozawa
IPC分类号： B23K3700
CPC分类号： H01L24/85 , B23K20/005 , H01L24/48 , H01L24/78 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/78301 , H01L2224/786 , H01L2224/851 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01051 , H01L2924/01082 , H01L2924/00 , H01L2224/45099
摘要： In a wire bonding apparatus in which a wire is passed through a capillary that is provided at one end of a bonding arm and a clamper that holds the wire is disposed directly above the capillary, the distance between the upper surface of the capillary and the undersurface of the clamper is set as a very short distance as 1.5 mm or less.
摘要翻译：在导线通过设置在接合臂的一端的毛细管的线接合装置中，并且保持线的夹持器直接设置在毛细管的上方，毛细管的上表面与下表面之间的距离的夹持器设置为1.5mm或更小的非常短的距离。

6. 发明授权

US06502738B2 Wire bonding apparatus 失效
标题翻译：接线装置
公开(公告)号：US06502738B2
公开(公告)日：2003-01-07
申请号：US09727000
申请日：2000-11-30
申请人： Tooru Mochida , Yoshimitsu Terakado , Koichi Takahashi
发明人： Tooru Mochida , Yoshimitsu Terakado , Koichi Takahashi
IPC分类号： B23Q15007
CPC分类号： H01L24/78 , B23K20/004 , G05B2219/45033 , H01L2224/78301 , H01L2224/786 , H01L2224/851 , H01L2924/00014 , H01L2924/01004 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2224/48 , H01L2224/45099
摘要： A wire bonding apparatus comprising: a spool motor rotates a spool around which a wire is wound, a tension-applying device that is disposed beneath the spool, a wire pay-out sensor disposed away from a gas-jet-out side of the tension-applying device so as to sense that the supply of the wire is insufficient, a wire-end detection sensor disposed on the gas-jet-out side of the tension-applying device so as to sense that the supply of the wire from the spool has stopped, and a control device controls so that the spool motor is rotated by a predetermined fixed amount when the wire is sensed by the wire pay-out sensor.
摘要翻译：一种引线接合装置，其特征在于，包括：卷轴电动机使卷绕有线的线圈旋转，布置在卷轴下方的张力施加装置，布置在远离张力的喷出侧的布线传感器传感器用于感测线材的供给不足的布线装置，设置在张力施加装置的气体喷射侧的线端检测传感器，以便感测到来自线轴的电线的供应已经停止，并且控制装置进行控制，使得当线由电线支付传感器感测时，线轴电动机旋转预定的固定量。

7. 发明授权

US5386936A Wire bonding method 失效
标题翻译：接线方式
公开(公告)号：US5386936A
公开(公告)日：1995-02-07
申请号：US105514
申请日：1993-08-11
申请人： Tooru Mochida , Yoshimitsu Terakado
发明人： Tooru Mochida , Yoshimitsu Terakado
IPC分类号： H01L21/607 , B23K20/10 , H01L21/60
CPC分类号： H01L24/85 , B23K20/10 , H01L2224/48245 , H01L2224/48247 , H01L2224/78 , H01L2224/85 , H01L2224/85205 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/14
摘要： A wire bonding method used in a bonding apparatus manufacturing, for example, semiconductor devices makes a correction of the ultrasonic output of a transducer using one of three correction timing patterns: a first correction timing pattern which makes the ultrasonic output correction prior to a first bonding by a first bonding wire to a single IC device, a second correction timing pattern which makes the output correction prior to a first bonding by a bonding wire, and a third correction timing pattern which makes the output correction prior to a first bonding and prior to a second bonding. By selecting one of the three patterns, the ultrasonic oscillation output is corrected at an appropriate timing regardless of the differences in the characteristics of the transducers used.
摘要翻译：在制造例如半导体器件的接合装置中使用的引线接合方法使用三种校正定时图案中的一种校正换能器的超声波输出：第一校正定时图案，其在第一接合之前进行超声波输出校正通过第一接合线到单个IC器件，在通过接合线进行第一次接合之前进行输出校正的第二校正定时图案，以及在第一次接合之前和之前进行输出校正的第三校正定时图案第二次接合。通过选择三种图案中的一种，无论所使用的换能器的特性的差异如何，在适当的时间校正超声波振荡输出。

8. 发明授权

US5287064A Bonding point polarity determining apparatus 失效
标题翻译：接合点极性判定装置
公开(公告)号：US5287064A
公开(公告)日：1994-02-15
申请号：US887067
申请日：1992-05-22
申请人： Tooru Mochida , Yoshimitsu Terakado
发明人： Tooru Mochida , Yoshimitsu Terakado
IPC分类号： H01L21/60 , G01R31/28 , H01L21/66 , G01R19/00
CPC分类号： H01L24/85 , G01R31/2853 , H01L24/78 , H01L2224/48245 , H01L2224/48247 , H01L2224/78301 , H01L2224/786 , H01L2224/851 , H01L2224/85205 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082
摘要： An apparatus for determining the polarities of bonding points to locate false bonding connections including an applied voltage output circuit which outputs positive and negative voltages, a switching circuit which after a wire is connected to a bonding point impresses voltage from the applied voltage output circuit to the bonding wire, a D/A converter which outputs standard positive and negative voltages, a polarity determining comparator which determines the polarity of the bonding point by comparing the voltage detected on the bonding wire with the standard voltage, and a memory which stores such a determination result for each bonding point.
摘要翻译：一种用于确定接合点的极性的装置，用于定位包括输出正和负电压的施加电压输出电路的假接合连接;在电线连接到接合点之后的开关电路将施加的电压输出电路的电压施加到接合线，输出标准正电压和负电压的D / A转换器，通过将接合线上检测的电压与标准电压进行比较来确定接合点的极性的极性确定比较器，以及存储这种确定的存储器每个结合点的结果。

9. 发明授权

US5219112A Wire bonding apparatus 失效
标题翻译：接线装置
公开(公告)号：US5219112A
公开(公告)日：1993-06-15
申请号：US879323
申请日：1992-05-07
申请人： Tooru Mochida , Yoshimitsu Terakado , Akihiro Hirayanagi
发明人： Tooru Mochida , Yoshimitsu Terakado , Akihiro Hirayanagi
IPC分类号： H01L21/60 , B23K20/10 , H01L21/00 , H05K13/06
CPC分类号： H01L24/78 , B23K20/10 , H05K13/06 , H01L2224/78301 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01033 , H01L2924/01039
摘要： In a bonding apparatus for semiconductor devices, etc., a linear sensor is mounted on a bonding head frame. An arm holder which has a bonding capillary at one end is pivotally mounted to the bonding head frame, and the linear sensor is positioned so that it faces a middle portion of the arm holder which locates an opposite side of pivotal point of the arm holder from the capillary. The linear sensor detects the gap between the arm holder and the bonding head frame when the arm holder pivots, thus determining the bonding surface level of a workpiece by the capillary which comes into contact with the workpiece.
摘要翻译：在半导体器件等的接合装置中，线性传感器安装在接合头架上。在一端具有接合毛细管的臂保持器枢转地安装在接合头框架上，并且线性传感器被定位成使得其面对臂保持器的中间部分，其将臂保持器的枢转点的相对侧定位成毛细管。当臂保持器枢转时，线性传感器检测臂保持器和接合头框架之间的间隙，从而通过与工件接触的毛细管确定工件的接合表面水平。

10. 发明授权

US5207370A Wire bonding method and apparatus 失效
标题翻译：引线接合方法和装置
公开(公告)号：US5207370A
公开(公告)日：1993-05-04
申请号：US890953
申请日：1992-05-29
申请人： Tooru Mochida , Yoshimitsu Terakado , Akihiro Hirayanagi
发明人： Tooru Mochida , Yoshimitsu Terakado , Akihiro Hirayanagi
IPC分类号： H01L21/60 , H01L21/00
CPC分类号： H01L24/78 , H01L2224/78301 , H01L2224/78344 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01039
摘要： In a bonding method and apparatus, a vertical movement of a bonding arm holder that has a capillary at the tip end is detected by a linear sensor and data based upon such a detection is outputted by the sensor. The output date in a predetermined range is checked if it is within a permissible range. If the output data is within the permissible range, it is determined that the capillary has come into contact with a bonding surface, and such a determination can be made without being affected by noises that often occur in bonding apparatus caused by vibrations.
摘要翻译：在接合方法和装置中，通过线性传感器检测在尖端具有毛细管的接合臂保持器的垂直移动，并且由传感器输出基于这种检测的数据。如果在允许的范围内，则检查在预定范围内的输出日期。如果输出数据在容许范围内，则确定毛细管已经与接合表面接触，并且可以在不受振动引起的粘合装置中经常发生的噪声的影响的情况下进行这种判断。

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