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1. 发明授权

US06261365B1 Heat treatment method, heat treatment apparatus and treatment system 有权
公开(公告)号：US06261365B1
公开(公告)日：2001-07-17
申请号：US09272782
申请日：1999-03-19
申请人： Yuji Matsuyama , Yoji Mizutani , Shinji Nagashima , Akira Yonemizu
发明人： Yuji Matsuyama , Yoji Mizutani , Shinji Nagashima , Akira Yonemizu
IPC分类号： B05C502
CPC分类号： H01L21/67748 , H01L21/67103 , H01L21/67109 , H01L21/67178
摘要： When a substrate coated with a coating solution which oxidizes at high temperatures is heat-treated, an oxygen concentration of a treatment atmosphere is lowered when the temperature is low. Next, the substrate is heat-treated in the treatment atmosphere of which the oxygen concentration is lowered. Sequentially, the treatment atmosphere is returned to that with the original oxygen concentration after the passage of a predetermined time after completing the heat treatment. Thereby, the substrate can be heat-treated, with the oxidization of the coating solution being controlled.

2. 发明授权

US06979474B2 Heat treatment method, heat treatment apparatus and treatment system 有权
标题翻译：热处理方法，热处理装置及处理系统
公开(公告)号：US06979474B2
公开(公告)日：2005-12-27
申请号：US09886213
申请日：2001-06-22
申请人： Yuji Matsuyama , Yoji Mizutani , Shinji Nagashima , Akira Yonemizu
发明人： Yuji Matsuyama , Yoji Mizutani , Shinji Nagashima , Akira Yonemizu
IPC分类号： H01L21/00 , H01L21/677 , B05D3/00
CPC分类号： H01L21/67748 , H01L21/67103 , H01L21/67109 , H01L21/67178
摘要： When a substrate coated with a coating solution which oxidizes at high temperatures is heat-treated, an oxygen concentration of a treatment atmosphere is lowered when the temperature is low. Next, the substrate is heat-treated in the treatment atmosphere of which the oxygen concentration is lowered. Sequentially, the treatment atmosphere is returned to that with the original oxygen concentration after the passage of a predetermined time after completing the heat treatment. Thereby, the substrate can be heat-treated, with the oxidization of the coating solution being controlled.
摘要翻译：当涂覆有在高温下氧化的涂布溶液的基材被热处理时，当温度低时，处理气氛的氧浓度降低。接着，在氧浓度降低的处理气氛中进行基板的热处理。接着，在完成热处理后经过预定时间后，处理气氛恢复到原来的氧浓度。由此，能够对涂布液的氧化进行控制，对基板进行热处理。

3. 发明授权

US5958145A Method for washing both surfaces of a substrate 失效
标题翻译：洗涤基板两面的方法
公开(公告)号：US5958145A
公开(公告)日：1999-09-28
申请号：US26912
申请日：1998-02-20
申请人： Akira Yonemizu , Yuji Matsuyama
发明人： Akira Yonemizu , Yuji Matsuyama
IPC分类号： H01L21/304 , B08B1/04 , B08B7/00 , H01L21/00 , B08B3/00
CPC分类号： H01L21/67028 , B08B1/007 , B08B1/04 , B08B7/0057 , Y10S134/902
摘要： A method for washing both surfaces of a substrate, comprising (a) a first washing step for washing a front surface of a substrate, which is kept rotated, by bringing a scrubbing member into contact with said front surface of the substrate while supplying a washing liquid onto the front surface, (b) a second washing step for washing a back surface of the substrate, which is kept rotated, by bringing a scrubbing member into contact with said back surface of the substrate while supplying a washing liquid onto the back surface, (c) a heating step for drying under heat the wet surfaces of the substrate, (d) a recipe determining step for determining whether said heating step (c) is performed at a period between said first washing step (a) and second washing step (b) and at a period after the second washing step (b), whether the heating step (c) is performed only once after the second washing step (b), or whether the heating step (c) is not performed, and (e) a conducting step for performing or not performing the heating step (C) in accordance with the recipe determined in said recipe determining step (d).
摘要翻译：一种用于洗涤基材的两个表面的方法，包括：（a）第一洗涤步骤，用于洗涤保持旋转的基材的前表面，通过使洗涤部件与所述基材的所述前表面接触，同时提供洗涤液体到前表面上，（b）第二洗涤步骤，用于洗涤保持旋转的衬底的背面，通过使洗涤构件与衬底的所述背面接触，同时将洗涤液体供应到背面（c）用于在加热下在基底的湿表面上干燥的加热步骤，（d）配方确定步骤，用于确定所述加热步骤（c）是否在所述第一洗涤步骤（a）和第二洗涤步骤（b）和在第二洗涤步骤（b）之后的时间段，加热步骤（c）是否在第二洗涤步骤（b）之后仅进行一次，或者是否没有进行加热步骤（c），以及（e）执行的导电步骤或者根据在所述配方确定步骤（d）中确定的配方不执行加热步骤（C）。

4. 发明授权

US06173468B1 Apparatus for washing both surfaces of a substrate 有权
标题翻译：用于洗涤基底的两个表面的装置
公开(公告)号：US06173468B1
公开(公告)日：2001-01-16
申请号：US09333915
申请日：1999-06-16
申请人： Akira Yonemizu , Yuji Matsuyama
发明人： Akira Yonemizu , Yuji Matsuyama
IPC分类号： B08B104
CPC分类号： H01L21/67028 , B08B1/007 , B08B1/04 , B08B7/0057 , Y10S134/902
摘要： A method for washing both surfaces of a substrate, comprising (a) a first washing step for washing a front surface of a substrate, which is kept rotated, by bringing a scrubbing member into contact with said front surface of the substrate while supplying a washing liquid onto the front surface, (b) a second washing step for washing a back surface of the substrate, which is kept rotated, by bringing a scrubbing member into contact with said back surface of the substrate while supplying a washing liquid onto the back surface, (c) a heating step for drying under heat the wet surfaces of the substrate, (d) a recipe determining step for determining whether said heating step (c) is performed, at a period between said first washing step (a) and second washing step (b) and at a period after the second washing step (b), whether the heating step (c) is performed only once after the second washing step (b), or whether the heating step (c) is not performed, and (e) a conducting step for performing or not performing the heating step (C) in accordance with the recipe determined in said recipe determining step (d).
摘要翻译：一种用于洗涤基材的两个表面的方法，包括：（a）第一洗涤步骤，用于洗涤保持旋转的基材的前表面，通过使洗涤部件与所述基材的所述前表面接触，同时提供洗涤液体到前表面上，（b）第二洗涤步骤，用于洗涤保持旋转的衬底的背面，通过使洗涤构件与衬底的所述背面接触，同时将洗涤液体供应到背面（c）用于在加热下在基底的湿表面上干燥的加热步骤，（d）配方确定步骤，用于在所述第一洗涤步骤（a）和第二洗涤步骤（a）之间的时间段确定是否执行所述加热步骤（c）洗涤步骤（b），并且在第二洗涤步骤（b）之后的时间段，在第二洗涤步骤（b）之后是否仅进行一次加热步骤（c），或者是否不进行加热步骤（c）和（e）用于执行的导电步骤或者根据在所述配方确定步骤（d）中确定的配方不执行加热步骤（C）。

5. 发明授权

US5985039A Apparatus and method for washing both surfaces of a substrate 失效
标题翻译：用于洗涤基材的两个表面的装置和方法
公开(公告)号：US5985039A
公开(公告)日：1999-11-16
申请号：US28113
申请日：1998-02-23
申请人： Akira Yonemizu , Yuji Matsuyama
发明人： Akira Yonemizu , Yuji Matsuyama
IPC分类号： H01L21/677 , H01L21/00 , H01L21/304 , B08B3/00
CPC分类号： H01L21/67173 , H01L21/67028 , Y10S134/902
摘要： An apparatus and method for scrubbing both surfaces of a substrate which includes a process section having a first unit, a second unit, a main arm mechanism for transferring a substrate into/from the first and second units, a first cassette or a second cassette section for transferring plural cassettes, a first and second sub-arm for transferring a substrate into/from the cassette sections, and controllers, such that a first substrate taken out from the first cassette section is subjected to the first unit and then subjected to the second unit, while a second substrate taken out from the second cassette is subjected to the second unit and then subjected to the first unit.
摘要翻译：一种用于擦洗基板的两个表面的装置和方法，其包括具有第一单元，第二单元，用于将基板输送到第一和第二单元中的主臂机构的处理部分的第一盒或第二盒部分用于传送多个盒，用于将基板传送到盒部分中的第一和第二子臂以及控制器，使得从第一盒部分取出的第一基板经受第一单元，然后经受第二个单元，而从第二盒取出的第二基板经受第二单元，然后经受第一单元。

6. 发明授权

US08641202B2 Projection display device 有权
标题翻译：投影显示设备
公开(公告)号：US08641202B2
公开(公告)日：2014-02-04
申请号：US12551833
申请日：2009-09-01
申请人： Hisashi Okada , Kazuya Minami , Yosuke Nishihata , Yuji Matsuyama
发明人： Hisashi Okada , Kazuya Minami , Yosuke Nishihata , Yuji Matsuyama
IPC分类号： G03B21/18 , G03B21/16 , G02F1/1333
CPC分类号： G03B21/26
摘要： A projection display device includes: a light modulator for modulating light from a light source; a polarizer disposed at a position facing the light modulator; a cooling section for allowing an air to flow in a space between the light modulator and the polarizer; and an air deflector for deflecting the air flowing in the space between the light modulator and the polarizer toward the polarizer.
摘要翻译：投影显示装置包括：调制器，用于调制来自光源的光; 设置在面向所述光调制器的位置处的偏振器; 用于允许空气在所述光调制器和所述偏振器之间的空间中流动的冷却部分; 以及用于使在光调制器和偏振器之间的空间中流动的空气偏向偏振器的空气导流板。

7. 发明授权

US06533864B1 Solution processing apparatus and method 有权
标题翻译：解决方案处理装置和方法
公开(公告)号：US06533864B1
公开(公告)日：2003-03-18
申请号：US09639172
申请日：2000-08-16
申请人： Yuji Matsuyama , Shuichi Nagamine
发明人： Yuji Matsuyama , Shuichi Nagamine
IPC分类号： B05C1110
CPC分类号： H01L21/6715 , B05C11/08
摘要： An upper side of a cup provided around a wafer is formed in a rectangular shape and a lower side thereof is formed in a cylindrical shape. The cup is formed such that, when seen from above, the portion forming the cylindrical shape is positioned within the portion forming the rectangular shape. The cup has a raising and lowering mechanism and is controlled by a control section. The upper side of the cup is placed by the side of the wafer during a scan by a supply nozzle. The lower side of the cup is placed over an upper level and a lower level of the wafer while a rinse liquid and a developing solution are shaken off. The scan by the supply nozzle is performed with the supply nozzle positioned in the upper cup portion.
摘要翻译：设置在晶片周围的杯的上侧形成为矩形，其下侧形成为圆筒状。杯形成为从上方观察，形成圆筒形状的部分位于形成矩形形状的部分内。杯具有升降机构，由控制部控制。杯子的上侧在扫描期间被供给喷嘴放置在晶片的侧面。将杯的下侧放置在晶片的上层和下层上，同时冲洗液体和显影液被摇动。由供给喷嘴进行的扫描由位于上杯部的供给喷嘴进行。

8. 发明授权

US06312171B1 Developing apparatus and method thereof 失效
标题翻译：显影装置及其制造方法
公开(公告)号：US06312171B1
公开(公告)日：2001-11-06
申请号：US09635196
申请日：2000-08-09
申请人： Yuji Matsuyama , Masahito Hamada
发明人： Yuji Matsuyama , Masahito Hamada
IPC分类号： G03D500
CPC分类号： G03F7/3021
摘要： A current member is disposed above a wafer holding section for holding a wafer and a top plate and a bottom plate of the current member are positioned so that respective air holes are overlapped each other in a vertical direction, and a developing solution is heaped on a front face of the wafer. Thereafter, the developing is performed with the bottom plate of the current member slid in a lateral direction so that the air holes are not overlapped each other in the vertical direction. In this configuration, air streams to the wafer are obstructed during the developing because the air holes in the current member are obstructed in the vertical direction, whereby occurrence of temperature distribution of the developing solution within the plane of the wafer caused by flows of air currents to the wafer is prevented and uniform developing processing can be performed.
摘要翻译：电流部件设置在用于保持晶片的晶片保持部分上方，并且当前部件的顶板和底板被定位成使得相应的气孔在垂直方向上彼此重叠，并且显影液堆积在晶片前面。此后，当前构件的底板沿横向方向滑动，使得气孔在垂直方向上不重叠时进行显影。在这种构造中，由于当前构件中的空气孔在垂直方向上被阻塞，所以在显影期间阻挡了流到晶片的空气流，从而由于气流的流动而导致显影液在晶片平面内的温度分布的发生防止了晶片，并且可以进行均匀的显影处理。

9. 发明授权

US07208066B2 Substrate processing apparatus and substrate processing method 失效
标题翻译：基板加工装置及基板处理方法
公开(公告)号：US07208066B2
公开(公告)日：2007-04-24
申请号：US10649780
申请日：2003-08-28
申请人： Junichi Kitano , Yuji Matsuyama , Takahiro Kitano , Takayuki Katano , Hidefumi Matsui , Yo Suzuki , Masami Yamashita , Toru Aoyama , Hiroyuki Iwaki , Satoru Shimura , Masatoshi Deguchi , Kousuke Yoshihara , Naruaki Iida
发明人： Junichi Kitano , Yuji Matsuyama , Takahiro Kitano , Takayuki Katano , Hidefumi Matsui , Yo Suzuki , Masami Yamashita , Toru Aoyama , Hiroyuki Iwaki , Satoru Shimura , Masatoshi Deguchi , Kousuke Yoshihara , Naruaki Iida
IPC分类号： C23F1/00 , H01L21/306 , B05C11/00
CPC分类号： H01L21/67178 , G03F7/70991 , H01L21/67017 , H01L21/6715 , H01L21/67161 , H01L21/67184 , H01L21/67742 , H01L21/67778 , Y10T29/41
摘要： On top of respective areas divided by partition plates, that is, a cassette station, a processing station, and an interface section in a coating and developing processing system, gas supply sections for supplying an inert gas into the respective areas are provided. Exhaust pipes for exhausting atmospheres in the respective areas are provided at the bottom of the respective areas. The atmospheres in the respective areas are maintained in a clean condition by supplying the inert gas not containing impurities such as oxygen and fine particles from the respective gas supply sections into the respective areas and exhausting the atmospheres in the respective areas from the exhaust pipes.
摘要翻译：在涂覆和显影处理系统中由分隔板，即盒式磁带站，加工站和界面部分划分的各个区域之上，提供用于向各个区域供应惰性气体的气体供应部分。在各个区域的底部设置用于各区域的排气的排气管。通过将不含杂质的惰性气体（例如氧气和细颗粒）从各个气体供应区域供应到各个区域中并且从排气管排出各个区域中的气氛，将各个区域中的气氛保持在清洁状态。

10. 发明授权

US07022190B2 Substrate coating unit and substrate coating method 失效
公开(公告)号：US07022190B2
公开(公告)日：2006-04-04
申请号：US10146799
申请日：2002-05-17
申请人： Yuji Matsuyama
发明人： Yuji Matsuyama
IPC分类号： B05C11/00
CPC分类号： H01L21/6715 , B05C11/08 , B05D1/005 , B05D3/10
摘要： The present invention is a coating unit for coating a substrate with a coating solution, comprising a coating solution discharge member for discharging the coating solution to the substrate which is positioned in a downward part. A lower surface of the coating solution discharge member is in a shape having a length longer, at least, than the radius of the substrate and having a narrow width. A coating solution discharge port is disposed in a portion of the coating solution discharge member, facing the center of the substrate, while a solvent mist discharge port for discharging a solvent mist of the coating solution is disposed in a portion facing a peripheral portion including an outer edge potion of the substrate, when the coating solution discharge member is positioned above the radius of the substrate.

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