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1. 发明申请

US20050064627A1 Method for manufacturing an electronic circuit device and electronic circuit device 失效
标题翻译：电子电路装置及电子电路装置的制造方法
公开(公告)号：US20050064627A1
公开(公告)日：2005-03-24
申请号：US10901750
申请日：2004-07-29
申请人： Yuji Kimura , Takenobu Maeda , Toru Yabe
发明人： Yuji Kimura , Takenobu Maeda , Toru Yabe
IPC分类号： H01L21/60 , H01L23/485 , H01L23/544 , H05K1/02 , H05K3/30 , H05K3/40 , H01L21/44 , H01L21/48
CPC分类号： H05K1/0269 , H01L23/544 , H01L24/11 , H01L2223/54473 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/1134 , H01L2224/1403 , H01L2224/16225 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01025 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10329 , H01L2924/15787 , H05K3/303 , H05K3/4015 , H05K2201/0367 , H05K2201/09781 , H05K2201/10674 , H05K2203/166 , H01L2224/13099 , H01L2924/00 , H01L2924/00014
摘要： A circuit element having electrodes on one main surface thereof and a substrate having connection bump electrodes and recognition bump electrodes provided on one main surface thereof are prepared. Connection bumps and recognition bumps are formed on the connection bump electrodes and the recognition bump electrodes by using a wire bonding method. Based on the images of the recognition bumps picked up by an optical device, the location of the recognition bumps is detected and, based on the detected location, the circuit element is connected to the substrate through the connection bumps. Since the upper portions of the recognition bumps are in a convex shape, a contrast with respect to the recognition bump electrodes is easily obtained and the location of the recognition bumps can be correctly detected.
摘要翻译：制备在其一个主表面上具有电极的电路元件和设置在其一个主表面上的具有连接凸块电极和识别凸块电极的基板。通过使用引线接合方法，在连接凸块电极和识别凸块电极上形成连接凸起和识别凸块。基于由光学装置拾取的识别凸块的图像，检测识别凸块的位置，并且基于检测到的位置，电路元件通过连接凸块连接到基板。由于识别凸块的上部是凸形的，因此容易获得相对于识别凸块电极的对比度，并且可以正确地检测识别凸块的位置。

2. 发明授权

US07179666B2 Method for manufacturing an electronic circuit device and electronic circuit device 失效
标题翻译：电子电路装置及电子电路装置的制造方法
公开(公告)号：US07179666B2
公开(公告)日：2007-02-20
申请号：US10901750
申请日：2004-07-29
申请人： Yuji Kimura , Takenobu Maeda , Toru Kabe
发明人： Yuji Kimura , Takenobu Maeda , Toru Kabe
IPC分类号： H01L21/58
CPC分类号： H05K1/0269 , H01L23/544 , H01L24/11 , H01L2223/54473 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/1134 , H01L2224/1403 , H01L2224/16225 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01025 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10329 , H01L2924/15787 , H05K3/303 , H05K3/4015 , H05K2201/0367 , H05K2201/09781 , H05K2201/10674 , H05K2203/166 , H01L2224/13099 , H01L2924/00 , H01L2924/00014
摘要： A circuit element having electrodes on one main surface thereof and a substrate having connection bump electrodes and recognition bump electrodes provided on one main surface thereof are prepared. Connection bumps and recognition bumps are formed on the connection bump electrodes and the recognition bump electrodes by using a wire bonding method. Based on the images of the recognition bumps picked up by an optical device, the location of the recognition bumps is detected and, based on the detected location, the circuit element is connected to the substrate through the connection bumps. Since the upper portions of the recognition bumps are in a convex shape, a contrast with respect to the recognition bump electrodes is easily obtained and the location of the recognition bumps can be correctly detected.
摘要翻译：制备在其一个主表面上具有电极的电路元件和设置在其一个主表面上的具有连接凸块电极和识别凸块电极的基板。通过使用引线接合方法，在连接凸块电极和识别凸块电极上形成连接凸起和识别凸块。基于由光学装置拾取的识别凸块的图像，检测识别凸块的位置，并且基于检测到的位置，电路元件通过连接凸块连接到基板。由于识别凸块的上部是凸形的，因此容易获得相对于识别凸块电极的对比度，并且可以正确地检测识别凸块的位置。

3. 发明授权

US09151284B2 Fluid control device 有权
标题翻译：流体控制装置
公开(公告)号：US09151284B2
公开(公告)日：2015-10-06
申请号：US13603701
申请日：2012-09-05
申请人： Atsuhiko Hirata , Yoshinori Ando , Takenobu Maeda , Yukiharu Kodama , Kenta Omori , Sho Makino
发明人： Atsuhiko Hirata , Yoshinori Ando , Takenobu Maeda , Yukiharu Kodama , Kenta Omori , Sho Makino
IPC分类号： F04B17/03 , F04B43/04 , F04B45/047
CPC分类号： F04B43/043 , F04B45/047
摘要： A fluid control device includes a vibrating plate unit, a driver, and a flexible plate. The vibrating plate unit includes a vibrating plate including a first main surface and a second main surface, and a frame plate surrounding the surroundings of the vibrating plate. The driver is provided on the first main surface of the vibrating plate, and vibrates the vibrating plate. The flexible plate has a hole formed thereon. Furthermore, the flexible plate faces the second main surface of the vibrating plate, and adheres to the frame plate by the adhesive agent that contains a plurality of particles arranged such that the plurality of particles are interposed between the flexible plate and the vibrating plate.
摘要翻译：流体控制装置包括振动板单元，驱动器和柔性板。振动板单元包括：振动板，包括第一主表面和第二主表面;以及框架板，围绕振动板的周围。驱动器设置在振动板的第一主表面上，并振动振动板。柔性板具有形成在其上的孔。此外，柔性板面向振动板的第二主表面，并且通过包含多个颗粒的粘合剂粘附到框架板，所述多个颗粒被布置成使得多个颗粒介于柔性板和振动板之间。

4. 发明授权

US09103337B2 Fluid control device 有权
标题翻译：流体控制装置
公开(公告)号：US09103337B2
公开(公告)日：2015-08-11
申请号：US13603689
申请日：2012-09-05
申请人： Atsuhiko Hirata , Yoshinori Ando , Takenobu Maeda , Yukiharu Kodama , Kenta Omori
发明人： Atsuhiko Hirata , Yoshinori Ando , Takenobu Maeda , Yukiharu Kodama , Kenta Omori
IPC分类号： F04B17/03 , F04B43/04 , F04B45/047
CPC分类号： F04B43/046 , F04B45/047 , F04D33/00
摘要： A fluid control device includes a vibrating plate unit, a driver, and a flexible plate. The vibrating plate unit includes a vibrating plate with first and second main surfaces, a frame plate surrounding the vibrating plate, and a link portion linking the vibrating plate and the frame plate and elastically supporting the vibrating plate against the frame plate. The driver is on the first main surface of the vibrating plate, and vibrates the vibrating plate. The flexible plate having a hole faces the second main surface of the vibrating plate, being fixed to the frame plate. At least a portion of the vibrating plate and the link portion are thinner than the thickness of the frame plate so that the surface of the portion of the vibrating plate and the link portion, on the side of the flexible plate, can separate from the flexible plate.
摘要翻译：流体控制装置包括振动板单元，驱动器和柔性板。振动板单元包括具有第一和第二主表面的振动板，围绕振动板的框架板和连接振动板和框架板并将振动板弹性地支撑在框架板上的连杆部分。驱动器位于振动板的第一主表面上，并振动振动板。该柔性板具有面向振动板的第二主表面的孔，固定在框架板上。振动板和连杆部分的至少一部分比框架板的厚度薄，使得振动板的部分的表面和连接部分在柔性板的侧面上的表面可以与柔性的盘子。

5. 发明授权

US09046093B2 Fluid control device 有权
标题翻译：流体控制装置
公开(公告)号：US09046093B2
公开(公告)日：2015-06-02
申请号：US13603724
申请日：2012-09-05
申请人： Yukiharu Kodama , Atsuhiko Hirata , Takenobu Maeda , Kenta Omori , Yoshihiko Sano
发明人： Yukiharu Kodama , Atsuhiko Hirata , Takenobu Maeda , Kenta Omori , Yoshihiko Sano
IPC分类号： F04B17/03 , F04B43/04 , F04B45/047
CPC分类号： F04B43/043 , F04B45/047
摘要： A fluid control device includes a vibrating plate including a first main surface and a second main surface, a driver that is provided on the first main surface of the vibrating plate and vibrates the vibrating plate, and a plate that is provided on the second main surface of the vibrating plate and has a hole provided thereon. At least one of either the vibrating plate or the plate is positioned between the hole and a region of the vibrating plate facing the hole, and includes a projection projecting in a direction intermediate between the hole and the region of the vibrating plate facing the hole.
摘要翻译：一种流体控制装置，包括：振动板，包括第一主表面和第二主表面;驱动器，设置在振动板的第一主表面上并振动振动板;以及板，其设置在第二主表面上并且具有设置在其上的孔。所述振动板或所述板中的至少一个位于所述孔与面向所述孔的所述振动板的区域之间，并且包括沿所述孔和所述振动板的面向所述孔的区域之间的方向突出的突起。

6. 发明授权

US09052021B2 Valve, fluidic apparatus, and fluid-supplying apparatus 有权
标题翻译：阀，流体装置和流体供给装置
公开(公告)号：US09052021B2
公开(公告)日：2015-06-09
申请号：US13241806
申请日：2011-09-23
申请人： Takenobu Maeda , Gaku Kamitani , Hidekazu Sasai
发明人： Takenobu Maeda , Gaku Kamitani , Hidekazu Sasai
IPC分类号： G05D16/06 , F16K7/17 , F16K15/14 , H01M8/04
CPC分类号： F16K15/185 , F16K7/17 , F16K15/141 , F16K15/144 , G05D16/0633 , H01M8/04082 , Y10T137/7792
摘要： A valve includes a valve body, a diaphragm dividing the inside of the valve body into first and second valve chambers and being displaced under a pressure of fluid, first and second openings in communication with the first valve chamber, and a third opening in communication with the second valve chamber. When a pump is not driven, the force applied to a side of the diaphragm facing the second valve chamber is greater than the force applied to a side of the diaphragm facing the first valve chamber, and the second opening is sealed by the diaphragm. When the pump is driven and the force applied to the side of the diaphragm facing the first valve chamber becomes greater than the force applied to the side of the diaphragm facing the second valve chamber, the diaphragm allows the first and second openings and to communicate with each other.
摘要翻译：阀包括阀体，将阀体内部分隔成第一和第二阀室并在流体压力下移动的隔膜，与第一阀室连通的第一和第二开口以及与第一阀室连通的第三开口第二阀室。当泵不被驱动时，施加到面向第二阀室的隔膜侧的力大于施加到面向第一阀室的隔膜侧的力，第二开口被隔膜密封。当泵被驱动并且施加到面向第一阀室的隔膜侧的力变得大于施加到面向第二阀室的隔膜侧的力时，隔膜允许第一和第二开口与第彼此。

7. 发明授权

US06933615B2 Electronic component device and manufacturing method therefor 失效
标题翻译：电子元器件及其制造方法
公开(公告)号：US06933615B2
公开(公告)日：2005-08-23
申请号：US10752521
申请日：2004-01-08
申请人： Takenobu Maeda
发明人： Takenobu Maeda
IPC分类号： H01L21/60 , H05K1/02 , H05K3/32 , H01L23/48
CPC分类号： H05K1/0271 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/81206 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H05K3/328 , H05K2201/10416 , H05K2201/10674 , H05K2201/2009 , H05K2201/2045 , H05K2203/0285 , H01L2924/00 , H01L2224/05624 , H01L2924/00014
摘要： In an electronic component device, electrodes of an electric component and respective wiring lines on a board are collectively bonded together via bumps using ultrasonic vibration. The wiring lines include wiring lines that are substantially parallel to the direction of ultrasonic vibration and wiring lines that are substantially perpendicularly to the direction of ultrasonic vibration. A displacement inhibiting layer is provided inside the board in a portion below the wiring lines that are substantially perpendicular to the direction of ultrasonic vibration.
摘要翻译：在电子部件装置中，电子部件的电极和板上的各布线通过使用超声波振动的凸块共同地接合在一起。布线包括基本上平行于超声波振动方向的布线和基本上垂直于超声波振动方向的布线。在基板垂直于超声波振动的方向的布线下方的部分设置有位移抑制层。

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